171777 ⎘
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere; Testing of electronic circuits, e.g. by signal tracer; Testing of integrated circuits [IC]; Environmental, reliability or burn-in testing; Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM] Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
SYSTEM AND METHOD OF TESTING FOR RF-INDUCED ELECTROMIGRATION IN SEMICONDUCTOR INTEGRATED CIRCUITS
#2METHOD AND SYSTEM FOR THERMAL-AWARE ELECTROMIGRATION EVALUATION AND CIRCUIT DESIGN
#3METHODS AND APPARATUS TO DETERMINE ELECTRICAL PROPERTIES OF COMPONENTS
#4FAST LEARNING-BASED ELECTROMIGRATION ANALYSIS FOR MULTI-SEGMENT INTERCONNECTS USING A HIERARCHICAL PHYSICS-INFORMED NEURAL NETWORK
#5Operating voltage adjustment for aging circuits
#6Semiconductor product with edge integrity detection structure
#7Method and testing apparatus related to wafer testing
#8Semiconductor testkey pattern and test method thereof
#9Method for evaluating hot carrier injection effect of device
#10Electromigration sign-off tool
#11Method for determining the resistance temperature characteristic of a ceramic glow plug
#12On-die reliability monitor for integrated circuit
#13Die edge integrity monitoring system
#14Electromigration sign-off tool
#15Method for estimating an operating profile of an integrated circuit of a system-on-a-chip, and corresponding system-on-a-chip
#16Apparatuses including test segment circuits having latch circuits for testing a semiconductor die
#17IC degradation management circuit, system and method
#18Electromigration test structures for void localization
#19Method of assessing semiconductor substrate and method of assessing device chip
#20Parallel test structure
#21Embedded photodetector as device health monitor for hot carrier injection (HCI) in power semiconductors
#22Electromigration sign-off methodology
#23Electromigration monitor
#24Device for attaching a semiconductor device to a circuit board
#25Crack sensor including polymer for healing cracks and electronic device including the same
#26Method and device of remaining life prediction for electromigration failure
#27Die edge integrity monitoring system
#28Assembly of strip conductors, device, and method for determining errors in a semiconductor circuit
#29Electromigration monitor
#30Electromigration monitor
#31Voltage Rail Monitoring to Detect Electromigration
#32Method for estimating an operating profile of an integrated circuit of a system-on-a-chip, and corresponding system-on-a-chip
#33Systems and methods for electrically testing electromigration in an electromigration test structure
#34IC degradation management circuit, system and method
#35Die edge crack and delamination detection
#36Electromigration wearout detection circuits
#37Apparatus and method for monitoring and predicting reliability of an integrated circuit
#38Interconnect reliability structures
#39Voltage rail monitoring to detect electromigration
#40Voltage rail monitoring to detect electromigration
#41RESISTANCE MEASUREMENT-DEPENDENT INTEGRATED CIRCUIT CHIP RELIABILITY ESTIMATION
#42Electromigration test structure for Cu barrier integrity and blech effect evaluations
#43Systems and methods for interconnect simulation and characterization
#44On-chip sensor for monitoring active circuits on integrated circuit (IC) chips
#45Electromigration sign-off methodology
#46Pulsed current source with internal impedance matching
#47PULSED CURRENT SOURCE WITH INTERNAL IMPEDANCE MATCHING
#48On-chip aging sensor and counterfeit integrated circuit detection method
#49Integrated time dependent dielectric breakdown reliability testing
#50Integrated time dependent dielectric breakdown reliability testing
#51Test structures for dielectric reliability evaluations
#52Method and apparatus for integrated circuit monitoring and prevention of electromigration failure
#53Circuit to detect previous use of computer chips using passive test wires
#54Electromigration testing of interconnect analogues having bottom-connected sensory pins
#55Testing method
#56Fixture for in situ electromigration testing during X-ray microtomography
#57STOCHASTIC AND TOPOLOGICALLY AWARE ELECTROMIGRATION ANALYSIS METHODOLOGY
#58E-fuse structure with methods of fusing the same and monitoring material leakage
#59Circuit to detect previous use of computer chips using passive test wires
#60E-fuse structure with methods of fusing the same and monitoring material leakage
#61Degradation detector and method of detecting the aging of an integrated circuit
#62Method and device of remaining life prediction for electromigration failure
#63Integrated time dependent dielectric breakdown reliability testing
#64Semiconductor device components and methods
#65Semiconductor device test structures and methods
#66Integrated circuit including sensor structure, related method and design structure
#67Integrated time dependent dielectric breakdown reliability testing
#68Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration
#69LCR test circuit structure for detecting metal gate defect conditions
#70Semiconductor device components and methods
#71Analyzing EM performance during IC manufacturing
#72Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migration
#73Apparatus and method for testing electromigration in semiconductor devices
#74METHOD AND DEVICE FOR MEASURING THE RELIABILITY OF AN INTEGRATED CIRCUIT
#75Crack sensors for semiconductor devices
#76Method for Determining the Lifetime of Interconnects
#77Determining critical current density for interconnect
#78STRUCTURE AND METHOD FOR SEMICONDUCTOR TESTING
#79Semiconductor device test structures and methods
#80Semiconductor device test structures and methods
#81Test structure for highly accelerated electromigration tests for thick metallization systems of solid state integrated circuits
#82Apparatus for NBTI prediction
#83Parallel array architecture for constant current electro-migration stress testing
#84Electromigration testing and evaluation apparatus and methods
#85Methodology for bias temperature instability test
#86Current-voltage-based method for evaluating thin dielectrics based on interface traps
#87Electromigration tester for high capacity and high current
#88Crack sensors for semiconductor devices
#89Method and apparatus for dynamic characterization of reliability wearout mechanisms
#90Structure for on-chip electromigration monitoring system
#91Test structure for electromigration analysis and related method
#92Methods and apparatus for detecting defects in interconnect structures
#93Method and structures for accelerated soft-error testing
#94Method for measuring a property of interconnections and structure for the same
#95Extrusion failure monitor structures
#96Test structure for electromigration analysis and related method
#97Multiple line width electromigration test structure and method
#98Method for determining time dependent dielectric breakdown
#99IC chip stress testing
#100On-chip electromigration monitoring
#101Unified test structure for stress migration tests
#102Structure for modeling stress-induced degradation of conductive interconnects
#103Systems and Methods for Controlling of Electro-Migration
#104Semiconductor device test structures and methods
#105Semiconductor device test structures and methods
#106Method for determining electro-migration failure mode
#107Addressable hierarchical metal wire test methodology
#108Test structure with TDDB test pattern
#109Structure for monitoring stress-induced degradation of conductive interconnects
#110Method for determining time to failure of submicron metal interconnects
#111Systems and methods for controlling of electro-migration
#112Method of NBTI prediction
#113On-chip electromigration monitoring system
#114System and method for testing power durability of saw filter
#115Structure and method for monitoring stress-induced degradation of conductive interconnects
#116Systems and methods for controlling of electro-migration
#117Cordless communication apparatus
#118Method of accelerating test of semiconductor device
#119System and method for testing a processor
#120Testing electromigration at multiple points of a single node
#121Systems and methods for controlling of electro-migration
#122Dual photo-acoustic and resistivity measurement system
#123Method and apparatus for a reliability testing
#124Electromigration test device and electromigration test method
#125SEMICONDUCTOR STRUCTURE AND TESTING METHOD THEREOF
#126Capacitive monitors for detecting metal extrusion during electromigration
#127Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same
#128System and method of testing for RF-induced electromigration in semiconductor integrated circuits
#129In-situ testing system for semiconductor device in aerospace irradiation environment
#130EM-compliance topology in a tree router
#131Diversified exerciser and accelerator