176996 ⎘
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor; Photosensitive materials Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
PHOTORESIST COMPOSITION
#2Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, And Patterning Process
#3Wafer Bow Mitigation
#4RESIST UNDERLAYER FILM-FORMING COMPOSITION
#5RESIST UNDERLAYER FILM-FORMING COMPOSITION
#6METHOD FOR OPTIMIZING A PUPIL STOP SHAPE FOR SIMULATING ILLUMINATION AND IMAGING PROPERTIES OF AN OPTICAL PRODUCTION SYSTEM DURING THE ILLUMINATION AND IMAGING OF AN OBJECT BY MEANS OF AN OPTICAL MEASUREMENT SYSTEM
#7PLANARIZING AGENT FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
#8CLICK-CHEMISTRY COMPATIBLE STRUCTURES, CLICK-CHEMISTRY FUNCTIONALIZED STRUCTURES, AND MATERIALS AND METHODS FOR MAKING THE SAME
#9Coating compositions and methods of forming electronic devices
#10Fluorene derivatized monomers and polymers for volume Bragg gratings
#11Resin formulations for polymer-derived ceramic materials
#12Compound and composition for forming organic film
#13Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
#14Photosensitive composition for hologram recording, hologram recording medium, and hologram
#15Water-soluble diacetylene, photolithography composition comprising water-soluble diacetylene monomer and conductive polymer, and fine pattern preparation method using same
#16Method for forming semiconductor structure
#17Dielectric film forming composition
#18STEPPED SUBSTRATE COATING COMPOSITION INCLUDING COMPOUND HAVING PHOTOCROSSLINKING GROUP DUE TO UNSATURATED BOND BETWEEN CARBON ATOMS
#19Resin formulations for polymer-derived ceramic materials
#20Dielectric film forming composition
#21Method for the preparation of a coating comprising oligomeric alkynes
#22Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same
#23Material composition and methods thereof
#24Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same
#25Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same
#26Resist underlayer film composition, patterning process, method for forming resist underlayer film, and compound for resist underlayer film composition
#27Resin formulations for polymer-derived ceramic materials
#28Chemically amplified resist material and resist pattern-forming method
#29Sulfonic acid derivative compounds as photoacid generators in resist applications
#30Inkless printing method
#31Three-dimensional photoresists via functionalization of polymer thin films fabricated by iCVD
#32Co-Crystals and Their Use
#33Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
#34Polychromic substances and their use
#35Filters
#36NEGATIVE PHOTOSENSITIVE FLUORINATED AROMATIC RESIN COMPOSITION
#37Polychromic substances and their use
#38ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
#39Negative photosensitive fluorinated aromatic resin composition
#40Multi-Colour Printing
#41Radiation sensitive film including a measuring scale
#42Lithium salt of polyacetylene as radiation sensitive filaments and preparation and use thereof