G03F7/037 - CPC Classification Index

#1

20260079397

2026-03-19

PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING CURED PRODUCT

#2

20260003274

2026-01-01

PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#3

20260003271

2026-01-01

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME

#4

20250376552

2025-12-11

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#5

20250306465

2025-10-02

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

#6

20250264801

2025-08-21

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#7

20250251663

2025-08-07

PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM

#8

20250138422

2025-05-01

PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

#9

20240329525

2024-10-03

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

#10

20240321803

2024-09-26

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE

#11

20240248400

2024-07-25

DIELECTRIC FILM FORMING COMPOSITION CONTAINING ACYL GERMANIUM COMPOUND

#12

20240210827

2024-06-27

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

#13

20240176239

2024-05-30

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

#14

20230359122

2023-11-09

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT

#15

20230221639

2023-07-13

PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN

#16

20230145446

2023-05-11

LIGHT-SENSITIVE RESIN ORIGINAL PRINTING PLATE FOR LETTERPRESS PRINTING

#17

20230112804

2023-04-13

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND DISPLAY DEVICE

#18

20230104913

2023-04-06

RESIN COMPOSITION, RESIN FILM AND DISPLAY DEVICE

#19

20230101181

2023-03-30

CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

#20

20230094840

2023-03-30

POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE

#21

20220365431

2022-11-17

Binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same

#22

20220334478

2022-10-20

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

#23

20220269170

2022-08-25

Photosensitive resin composition, polyimide production method, and semiconductor device

#24

20220252979

2022-08-11

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF

#25

20220221791

2022-07-14

Chain Extenders And Formulations Thereof For Improving Elongation In Photosensitive Polyimide

#26

20220179311

2022-06-09

Curable composition, cured product, color filter, solid-state imaging element, and image display device

#27

20220171285

2022-06-02

METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#28

20220057711

2022-02-24

RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE

#29

20220017673

2022-01-20

Dielectric Film Forming Compositions

#30

20220011669

2022-01-13

Photosensitive resin composition and method for producing cured relief pattern

#31

20210395195

2021-12-23

Onium salt, chemically amplified negative resist composition, and pattern forming process

#32

20210382391

2021-12-09

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

#33

20210364919

2021-11-25

PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF

#34

20210302836

2021-09-30

PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE

#35

20210223699

2021-07-22

Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper

#36

20210191264

2021-06-24

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR

#37

20210165320

2021-06-03

Photosensitive resin composition and display device

#38

20210116809

2021-04-22

Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

#39

20210088903

2021-03-25

PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF

#40

20210063877

2021-03-04

Water-developable photosensitive resin composition for flexographic printing and photosensitive resin original plate for flexographic printing obtained therefrom

#41

20210011381

2021-01-14

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME

#42

20200409263

2020-12-31

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

#43

20200377745

2020-12-03

Blocked silicone dual cure resins for additive manufacturing

#44

20200356005

2020-11-12

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, DISPLAY DEVICE AND METHOD FOR PRODUCING SAME

#45

20200301273

2020-09-24

PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

#46

20200218152

2020-07-09

Photosensitive polyimide compositions

#47

20200192227

2020-06-18

Resin composition, method for producing heat-resistant resin film, and display device

#48

20200110337

2020-04-09

Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same

#49

20200103753

2020-04-02

Photosensitive resin composition and photosensitive resin printing plate precursor containing the same

#50

20200089113

2020-03-19

Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

#51

20200081344

2020-03-12

Organic EL display device

#52

20200073242

2020-03-05

Photosensitive CTP flexographic printing original plate

#53

20200041900

2020-02-06

Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component

#54

20200019057

2020-01-16

Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

#55

20200012192

2020-01-09

Photosensitive resin composition

#56

20200012191

2020-01-09

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT EQUIPPED WITH CURED FILM, ORGANIC EL DISPLAY DEVICE EQUIPPED WITH CURED FILM, CURED FILM PRODUCTION METHOD, AND ORGANIC EL DISPLAY DEVICE PRODUCTION METHOD

#57

20200004149

2020-01-02

Photosensitive resin composition and cured film comprising the same

#58

20190386217

2019-12-19

Organic EL display device

#59

20190361349

2019-11-28

Photosensitive resin composition, and polymer film made therefrom

#60

20190258164

2019-08-22

Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor

#61

20190218396

2019-07-18

Black pigment, method for producing same, pigment dispersion liquid, photosensitive composition and cured product of said photosensitive composition

#62

20190171105

2019-06-06

Photosensitive polyimide compositions

#63

20190113845

2019-04-18

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

#64

20190081001

2019-03-14

Dielectric film forming composition

#65

20190077913

2019-03-14

Dielectric film forming composition

#66

20190072851

2019-03-07

Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor

#67

20190072850

2019-03-07

Photosensitive resin composition, polyimide production method, and semiconductor device

#68

20190049838

2019-02-14

Photosensitive microcapsules

#69

20190039397

2019-02-07

Photosensitive resin printing plate precursor and method of manufacturing printing plate

#70

20190025697

2019-01-24

Photosensitive resin composition

#71

20190023917

2019-01-24

Method of forming a three-dimensional object comprised of a silicone polymer or co-polymer

#72

20190018321

2019-01-17

Photosensitive stacked structure

#73

20190018320

2019-01-17

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

#74

20180373147

2018-12-27

Photosensitive resin composition and method for producing cured relief pattern

#75

20180356729

2018-12-13

Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor

#76

20180267405

2018-09-20

Negative type colored photosensitive resin composition, cured film, element, and display device

#77

20180259852

2018-09-13

Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same

#78

20180236804

2018-08-23

Photosensitive resin composition for relief printing original plate and relief printing original plate obtained therefrom

#79

20180231889

2018-08-16

Photosensitive resin composition, black pixel defining layer using the same and display device

#80

20180230269

2018-08-16

Photosensitive resin composition, black pixel defining layer using the same and display device

#81

20180224741

2018-08-09

COMPOSITIONS AND METHODS FOR FORMING A PIXEL-DEFINING LAYER

#82

20180215874

2018-08-02

Resin, composition, cured film, method for manufacturing cured film and semiconductor device

#83

20180210342

2018-07-26

Photosensitive dry film and uses of the same

#84

20180157173

2018-06-07

Photosensitive resin composition, black pixel defining layer using the same and display device

#85

20180157172

2018-06-07

Photosensitive resin composition, black pixel defining layer using the same and display device

#86

20180149974

2018-05-31

Photosensitive resin composition, black pixel defining layer using the same and display device

#87

20180136563

2018-05-17

Stripping process

#88

20180120702

2018-05-03

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

#89

20180118887

2018-05-03

Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

#90

20180107114

2018-04-19

Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

#91

20180088465

2018-03-29

Photosensitive resin composition, black pixel defining layer using the same and display device

#92

20180079864

2018-03-22

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

#93

20180052391

2018-02-22

Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board

#94

20180039176

2018-02-08

COLORED RESIN COMPOSITION, COLORED FILM, DECORATIVE SUBSTRATE AND TOUCH PANEL

#95

20180024434

2018-01-25

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film

#96

20180017866

2018-01-18

Photosensitive resin composition, photosensitive resin layer using the same and display device

#97

20180011402

2018-01-11

Resin, photosensitive resin composition, electronic component and display device using the same

#98

20170334837

2017-11-23

DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME

#99

20170299965

2017-10-19

RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE

#100

20170298186

2017-10-19

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film

#101

20170240705

2017-08-24

Block polyimide, block polyamide acid imide and use thereof

#102

20170012022

2017-01-12

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#103

20160313642

2016-10-27

Photosensitive polyimide compositions

#104

20160209744

2016-07-21

Radiation-sensitive resin composition, resin film, and electronic device

#105

20160195709

2016-07-07

Display element, photosensitive composition and electrowetting display

#106

20160178893

2016-06-23

Display element, photosensitive composition and electrowetting display

#107

20160160102

2016-06-09

Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device

#108

20150367668

2015-12-24

Resin printing plate precursor for laser engraving

#109

20150353685

2015-12-10

Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition

#110

20150301453

2015-10-22

Photosensitive resin composition, method for producing heat-resistant resin film and display device

#111

20150205202

2015-07-23

Photo-curable and thermo-curable resin composition and dry film solder resist

#112

20150205201

2015-07-23

Photosensitive resin composition and photosensitive resin printing plate original

#113

20150065598

2015-03-05

Black photosensitive resin composition and light-blocking layer using the same

#114

20140296362

2014-10-02

Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board

#115

20140191222

2014-07-10

Resin composition and display device using the same

#116

20140069702

2014-03-13

Photosensitive resin composition and use thereof

#117

20140011905

2014-01-09

Polyamic acid, photosensitive resin composition, dry film and circuit board

#118

20120308741

2012-12-06

Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof

#119

20120248632

2012-10-04

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

#120

20120244473

2012-09-27

Photosensitive resin composition, laminate utilizing same and solid-state imaging device

#121

20120133061

2012-05-31

PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME

#122

20120118616

2012-05-17

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD

#123

20120115333

2012-05-10

Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device

#124

20120015298

2012-01-19

Photosensitive resin composition and cured film

#125

20120012366

2012-01-19

POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND DRY FILM MANUFACTURED FROM THE SAME

#126

20110284855

2011-11-24

Resin composition and display device using the same

#127

20110278049

2011-11-17

Photosensitive resin composition and dry film comprising the same

#128

20110212402

2011-09-01

PHOTOSENSITIVE RESIN COMPOSITION AND ITS APPLICATION

#129

20110200939

2011-08-18

POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME AND DRY FILM MANUFACTURED BY THE SAME

#130

20110083884

2011-04-14

Polyimide precursor composition and use thereof

#131

20110079927

2011-04-07

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

#132

20110067907

2011-03-24

Low temperature curable photosensitive resin composition and dry film manufactured by using the same

#133

20110065260

2011-03-17

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

#134

20110065043

2011-03-17

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

#135

20110061915

2011-03-17

Resin composition and use thereof

#136

20110061914

2011-03-17

Polyimide precursor composition, use of the of the same, and production method of the same

#137

20110031631

2011-02-10

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

#138

20100314783

2010-12-16

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

#139

20100295190

2010-11-25

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#140

20100285404

2010-11-11

Method for producing polyamide and resin composition

#141

20100218984

2010-09-02

PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

#142

20100167208

2010-07-01

Water soluble photosensitive polymide polymer, its preparation and photoresist containing the same

#143

20100132989

2010-06-03

NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF

#144

20100116532

2010-05-13

Photosensitive resin composition, dry film, and processed product made using the same

#145

20100113640

2010-05-06

Alkali developable photosensitive resin composition and dry film manufactured by the same

#146

20100086874

2010-04-08

Photosensitive polymides

#147

20100086871

2010-04-08

Photosensitive polyimides

#148

20100084172

2010-04-08

Photosensitive resin composition, dry film, and processed product made using the same

#149

20100084171

2010-04-08

Polyimide precursor composition, use thereof and production method thereof

#150

20100059263

2010-03-11

Resin composition, dry film, and processed product made using the same

#151

20100009290

2010-01-14

Photosensitive Polybenzoxazines and Methods of Making the Same

#152

20090202786

2009-08-13

Photosensitive resin composition and circuit substrate employing the same

#153

20080306180

2008-12-11

Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof

#154

20080199804

2008-08-21

Polymerizable composition, lithographic printing plate precursor and lithographic printing method

#155

20080176167

2008-07-24

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

#156

20080108723

2008-05-08

Photosensitive resin composition

#157

20080076849

2008-03-27

Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device

#158

20080057446

2008-03-06

Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

#159

20070154843

2007-07-05

Resin and resin composition

#160

20070141509

2007-06-21

Negative photoresist composition

#161

20070093640

2007-04-26

Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof

#162

20060199920

2006-09-07

Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof

#163

20060159839

2006-07-20

Photosensitive resin composition, electronic component using the same, and display unit using the same

#164

20060142542

2006-06-29

Phosphazene compound, photosensitive resin composition and use thereof

#165

20060110679

2006-05-25

Low-temperature curable photosensitive compositions

#166

20060110678

2006-05-25

Low-temperature curable photosensitive compositions

#167

20050208421

2005-09-22

Photosensitive resin composition and use of the same

#168

20050202337

2005-09-15

Photosensitive resin composition and process for producing heat-resistant resin film

#169

20050170270

2005-08-04

Composition for forming wiring protective film and uses thereof

#170

20050074563

2005-04-07

Alkali-soluble maleimide copolymer and liquid crystal display comprising the same

#171

20050058911

2005-03-17

Holographic recording medium, holographic recording method and holographic information medium