TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN

Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component

METHOD FOR EXTENSION OF THE SHELF LIFE OF POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE PRECURSORS IN SOLUTION

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME

PHOTOSENSITIVE RESIN COMPOSITION

BISMALEIMIDE COMPOUND, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT THEREFROM, SEMICONDUCTOR ELEMENT AND DRY FILM RESIST

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME

POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

POLYIMIDE RESIN PRECURSOR

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN

POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME

Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component

COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD OF LAMINATE, LAMINATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE

RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD

PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS

RESIST COMPOSITION AND PATTERN FORMING PROCESS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

RESIST COMPOSITION AND PATTERN FORMING PROCESS

POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME

PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE

METHOD FOR PRODUCING PATTERNED SUBSTRATE

Polymer material in a redistribution structure of a semiconductor package and method of manufacture

UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FORMED USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILAYER MATERIAL

Manufacturing method for cured substance, manufacturing method for laminate, and manufacturing method for semiconductor device, and treatment liquid

Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN

MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Polypeptide, photoresist composition including the same, and method of forming pattern using the same

Photosensitive composition, negative photosensitive composition, pixel division layer and organic EL display device

LIQUID EJECTION HEAD, AND METHOD FOR PRODUCING LIQUID EJECTION HEAD

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN

PHOTOSENSITIVE TRANSFER MATERIAL AND METHOD OF PRODUCING THE SAME, FILM, TOUCH PANEL, METHOD OF SUPPRESSING DETERIORATION, AND LAMINATE AND METHOD OF PRODUCING THE SAME

Photoresist composition and method of forming photoresist pattern

PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED MATERIAL AND ELECTRONIC COMPONENT

Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device

Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component

Photosensitive resin composition, polyimide production method, and semiconductor device

Negative resist composition and pattern forming process

Chain Extenders And Formulations Thereof For Improving Elongation In Photosensitive Polyimide

POLYMER AND RESIN COMPOSITION THEREOF

Polymer layer in semiconductor device and method of manufacture

SOLUBLE POLYIMIDES AND DIIMIDES FOR SPIN-ON CARBON APPLICATIONS

Photosensitive resin composition, film, and electronic device

Photosensitive resin composition and method for producing cured relief pattern

Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

Photosensitive resin composition, pattern forming method, cured film, laminate, and device

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME

Resin composition, resin sheet, cured film, organic el display device, semiconductor electronic component, semiconductor equipment, and method for producing organic el display device

WATER-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXOGRAPHIC PRINTING AND PHOTOSENSITIVE RESIN ORIGINAL PLATE FOR FLEXOGRAPHIC PRINTING OBTAINED THEREFROM

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT COMPRISING CURED FILM, ORGANIC EL DISPLAY DEVICE COMPRISING CURED FILM, METHOD FOR PRODUCING CURED FILM, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE

Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device

Crosslinking agent compound, photosensitive composition comprising the same, and photosensitive material using the same

Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device

Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component

METHOD OF FORMING INSULATING LAYER

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME

Chain extenders and formulations thereof for improving elongation in photosensitive polyimide

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT HAVING CURED FILM, ORGANIC EL DISPLAY, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof

Photoresist composition and method of forming photoresist pattern

Photosensitive polyimide compositions

PHOTOSENSITIVE RESIN COMPOSITION

Branched copolymer, and photosensitive resin composition, photosensitive resin film and optical device using the same

Resin composition, method for producing heat-resistant resin film, and display device

Photosensitive resin composition and cured film

Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same

Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, INSULATING FILM, AND ELECTRONIC COMPONENT

Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Photosensitive resin composition, and polymer film made therefrom

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, DISPLAY DEVICE PROVIDED WITH ELEMENT, AND ORGANIC EL DISPLAY

Photosensitive resin composition, photosensitive resin laminate, and pattern forming process

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND ELECTRONIC DEVICE

Polyimides

Resin composition

Photoresist topcoat compositions and methods of processing photoresist compositions

Energy-sensitive resin composition

Photosensitive polyimide compositions

Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

POLYIMIDE PRECURSOR AND LITHOGRAPHY PATTERN FORMED BY THE SAME

Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component

Method of forming a passivation layer

Polyimides

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

Photosensitive composition that can be activated by multiphoton absorption for three-dimensional fabrication

Dielectric film forming composition

Dielectric film forming composition

Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

THERMALLY CONDUCTIVE TYPE PHOTOSENSITIVE RESIN

Photosensitive resin composition and method for producing cured relief pattern

Compound, photopolymerization initiator comprising said compound, and photosensitive resin composition containing said photopolymerization initiator

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

Heat-sensitive recording material

NEGATIVE TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE

Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Polysulfone amide compound, and resin composition containing same

Negative type colored photosensitive resin composition, cured film, element, and display device

Photosensitive and via-forming circuit board

Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same

TRANSPARENT PHOTOSENSITIVE RESIN

Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process

Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device

Resin, composition, cured film, method for manufacturing cured film and semiconductor device

Cured film formed by curing photosensitive resin composition and method for manufacturing same

Precursor for polyimide and use thereof

PHOTOSENSITIVE COMPOSITION

Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device

Photoresist topcoat compositions and methods of processing photoresist compositions

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

COLORED RESIN COMPOSITION, COLORED FILM, DECORATIVE SUBSTRATE AND TOUCH PANEL

Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film

Resin composition, resin film, and electronic device

Photosensitive colored resin composition

RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film

Additions of organic species to facilitate crosslinker removal during PSPI cure

Method for microwave processing of photosensitive polyimides

Black photosensitive resin composition, photosensitive resin layer, and display device comprising the same

Resin laminate and relief printing original plate

Photoresist compositions and methods

Photosensitive polyimide compositions

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

Diamine, polyamic acid, and polyimide

Method for forming micropattern of polyimide using imprinting

Curable resin, blue photoresist, color filter, and methods of preparing the same, and color display device

Active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, mask blank provided with active light sensitive or radiation sensitive film, pattern forming method, method for manufacturing electronic device, electronic device and novel compound

Resist composition and method of forming resist pattern

Positive photosensitive resin composition and polyhydroxyamide resin

Display element, photosensitive composition and electrowetting display

Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device

Low surface energy photoresist composition and process

Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition

Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device

Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition

Energy-sensitive resin composition

Polymide precursor resin composition

Photosensitive resin composition, method for producing heat-resistant resin film and display device

Polyimide compositions

Method for microwave processing of photosensitive polyimides

ABLATION IMAGEABLE LITHOGRAPHIC PRINTING PLATE

Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board

Lithographic printing plate precursor and a method for making a printing plate

Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition

Developing solution and development processing method of photosensitive resin composition

Photosensitive composition, cured film and production process thereof, and electronic part

Positive-type photosensitive resin composition, and insulating film and OLED formed using the same

Method of applying photoresist to a semiconductor substrate

PHOTOSENSITIVE POLYIMIDE AND NEGATIVE TYPE PHOTORESIST COMPOSITION CONTAINING THE SAME

Self-assembled structures, method of manufacture thereof and articles comprising the same

Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component

Photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, and pattern forming method and article using the photosensitive resin composition

POLYIMIDE PRECURSOR COMPOSITION, AND WIRING CIRCUIT BOARD EMPLOYING THE COMPOSITION

Photosensitive resin composition and circuit formation substrate using the same

Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof

BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD

Base generator, photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, pattern forming method using the photosensitive resin composition and products comprising the same

Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition

POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND DRY FILM MANUFACTURED FROM THE SAME

Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition

POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME AND DRY FILM MANUFACTURED BY THE SAME

Negative-type photosensitive resin composition, pattern forming method and electronic parts

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition

Base generator

PHOTOSENSITIVE RESIN COMPOSITION, METAL-BASE-CONTAINING CIRCUIT BOARD PRODUCTION METHOD EMPLOYING THE PHOTOSENSITIVE RESIN COMPOSITION, AND METAL-BASE-CONTAINING CIRCUIT BOARD

THERMALLY STABLE ALIGNMENT MATERIALS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR CONTROL OF REFRACTIVE INDEX, AND OPTICAL WAVEGUIDE AND OPTICAL COMPONENT USING THE SAME

Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method

Photosensitive resin composition and circuit formation substrate using the same

Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation

Photosensitive Polyimides and Methods of Making the Same

Polyimide resin and photosensitive polyimide resin composition

Method for forming a pattern on a semiconductor device using an organic hard mask

Electrode patterning layer comprising polyamic acid or polyimide, and electronic device employing it

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DPOLYHYDROXYAMIDE RESIN

Photosensitive polymides

Photosensitive polyimides

Photosensitive Polybenzoxazines and Methods of Making the Same

Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition

Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same

Photosensitive resin composition and circuit substrate employing the same

Photosensitive polyimides

Negative-type photosensitive resin composition, pattern forming method and electronic parts

Photosensitive polyimide composition and polyimide precursor composition

Heat-resistant resin

NEGATIVE PHOTOSENSITIVE MATERIAL AND CIRCUIT BOARD

Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part

Dye-containing curable composition, color filter, and producing process thereof

Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin Composition Containing Same, And Cured Product Thereof

Negative photosensitive polyimide polymer and uses thereof

Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

Heat-Resistant Resin

Polyamide

Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition

Positive photosensitive resin composition, method for forming pattern, and electronic part

Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof

Composition of polyimide and sterically-hindered hydrophobic epoxy

Photosensitive polyimide compositions

Photosensitive resin composition for forming optical waveguide, optical waveguide, and method for forming optical waveguide pattern

Antireflective hardmask composition and methods for using same

Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition

Composition for an organic hard mask and method for forming a pattern on a semiconductor device using the same

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film

Method for forming photosensitive polyimide pattern and electronic devices having the pattern

Highly heat-resistant, negative-type photosensitive resin composition

Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material

Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained

Photosensitive resin composition, ink-jet recording head using the composition, and production method for the same

Alkali-soluble maleimide copolymer and liquid crystal display comprising the same

Polymer, method for preparing the same, and a photosensitive resin composition thereof