206684 ⎘
Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Processing objects by plasma generation characterised by the type of processing; Etching; Problems associated with etching Selectivity
METHOD FOR LATERAL ETCH WITH BOTTOM PROTECTION
#2PLASMA PROCESSING SYSTEM
#3SUBSTRATE PROCESSING APPARATUS
#4EXHAUST SYSTEM CONTROL
#5FLOW ADAPTORS FOR GAS FLOWS, AND RELATED PROCESSING CHAMBERS, PROCESSING SYSTEMS, APPARATUS, AND METHODS
#6System and Method for Atomic Layer Etching with Uniformity Control Mechanisms
#7METHOD FOR ETCHING FEATURES USING HF GAS
#8PLASMA PROCESSING APPARATUS
#9System and Method for Atomic Layer Etching and Radical-Based Highly Selective Etching in a Single Process Chamber
#10PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
#11ATOMIC LAYER DEPOSITION APPARATUS
#12ETCHING METHOD AND ETCHING APPARATUS
#13PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#14ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#15METHOD FOR FABRICATING NANOPATTERNED SUBSTRATES
#16SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
#17MULTI-STATE RF PULSING TO CONTROL MASK SHAPE AND BREAKING SELECTIVITY VERSUS PROCESS MARGIN TRADE-OFF
#18ETCHING METHOD AND ETCHING DEVICE
#19SELECTIVE IN-SITU CARBON-BASED MASK PROTECTION
#20PLASMA PROCESSING APPARATUS
#21METHOD OF ETCHING INDIUM-BASED SEMICONDUCTOR MATERIALS
#22SELECTIVE ETCHING OF ALTERNATING LAYERS OF SILICON OXIDE AND SILICON NITRIDE FOR HIGH ASPECT RATIO CONTACTS
#23PLASMA ETCHING DEVICES AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES USING THE SAME
#24SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES
#25ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
#26Multiple State Pulsing for High Aspect Ratio Etch
#27FAST ATOMIC LAYER ETCH
#28PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
#29MANUFACTURING METHOD FOR A PACKAGING SUBSTRATE
#30PLASMA CHAMBER FOR WAFER ETCHING AND WAFER ETCHING METHOD USING PLASMA CHAMBER
#31PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#32MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND MASK SELECTIVITY
#33PLASMA PROCESSING APPARATUS
#34MULTIPLE-CHAMBER REACTOR FOR SELECTIVE DEPOSITION OF SILICON NITRIDE AND METHOD OF USING SAME
#35SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
#36PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
#37METHOD FOR DRY ETCHING USING PLASMA
#38PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#39PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#40ETCHING PROCESSING METHOD
#41PLASMA PROCESSING METHOD
#42PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#43PLASMA-ASSISTED FILM REMOVAL FOR WAFER FABRICATION
#44ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#45ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#46ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#47FAST GAS SWITCHING
#48VOLTAGE WAVEFORM CONTROLLING METHOD, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS
#49ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, ETCHING PROGRAM, AND PLASMA PROCESSING APPARATUS
#50SUBSTRATE PROCESSING METHOD
#51Reducing aspect ratio dependent etch with direct current bias pulsing
#52Multiple state pulsing for high aspect ratio etch
#53System and Method for Plasma Process Uniformity Control
#54In-Situ Adsorbate Formation for Dielectric Etch
#55In-situ adsorbate formation for plasma etch process
#56High Aspect Ratio Contact (HARC) Etch
#57PLASMA ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
#58ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#59ETCHING METHOD AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
#60PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
#61ETCHING METHOD AND PLASMA PROCESSING SYSTEM
#62PLASMA-BASED METHOD FOR DELAYERING OF CIRCUITS
#63METHOD OF TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE
#64Apparatus and method for processing substrate using plasma
#65Method of processing substrate
#66SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#67HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY
#68Multi-state pulsing for achieving a balance between bow control and mask selectivity
#69SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#70Plasma processing method and plasma processing apparatus
#71Multi-state RF pulsing to control mask shape and breaking selectivity versus process margin trade-off
#72Plasma etching techniques
#73Etching method and etching device
#74Selective atomic layer etching
#75Chamber conditioning and removal processes
#76Plasma etching apparatus and method
#77Power modulation for etching high aspect ratio features
#78Method for manufacturing touch screen panels using a dry etching apparatus
#79STRUCTURES AND METHODS FOR IMPROVING SOLAR CELL EFFICIENCY AND MECHANICAL STRENGTH
#80Etch suppression with germanium
#81Plasma etching apparatus and method
#82Etching method
#83Gas cluster ion beam etching process for Si-containing and Ge-containing materials
#84Dry etching apparatus and method for manufacturing touch screen panels using the same
#85Structure and method for improving solar cell efficiency and mechanical strength
#86Plasma etching apparatus and method