206685 ⎘
Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Processing objects by plasma generation characterised by the type of processing; Etching; Problems associated with etching bottom of holes or trenches
BAFFLE PLATE FOR CONTROLLING WAFER UNIFORMITY AND METHODS FOR MAKING THE SAME
#2PLASMA PROCESSING APPARATUS AND POWER SUPPLY SYSTEM
#3CARBON BASED DEPOSITIONS USED FOR CRITICAL DIMENSION CONTROL DURING HIGH ASPECT RATIO FEATURE ETCHES AND FOR FORMING PROTECTIVE LAYERS
#4METHOD TO CONTROL ETCH PROFILE BY RF PULSING
#5PLASMA PROCESSING METHOD
#6MULTI-STATE RF PULSING IN CYCLING RECIPES TO REDUCE CHARGING INDUCED DEFECTS
#7Method for Etching Features in a Layer in a Substrate
#8PLASMA PROCESSING EQUIPMENT
#9BAFFLE PLATE FOR CONTROLLING WAFER UNIFORMITY AND METHODS FOR MAKING THE SAME
#10Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layers
#11Substrate processing apparatus and plasma processing apparatus
#12Plasma etching apparatus, plasma etching method, and semiconductor device fabrication method including the plasma etching method
#13Control method and plasma processing apparatus
#14Substrate processing method and substrate processing apparatus
#15Method for forming silicon nitride film selectively on top/bottom portions
#16Gas showerhead, manufacturing method, and plasma apparatus including the gas showerhead
#17Baffle plate for controlling wafer uniformity and methods for making the same
#18Plasma processing equipment
#19RAISING-AND-LOWERING MECHANISM, STAGE AND PLASMA PROCESSING APPARATUS
#20Plasma processing method and plasma processing apparatus
#21Metal recess for semiconductor structures
#22Metal recess for semiconductor structures
#23Plasma treatment apparatus and method of fabricating semiconductor device using the same
#24PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#25Method for forming silicon nitride film selectively on top surface
#26Plasma etching method
#27Etching method and plasma processing apparatus
#28Processing method and plasma processing apparatus
#29Ion beam processing device
#30Dry etching method
#31PLASMA SYSTEM AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
#32PLASMA PROCESSING METHOD
#33Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
#34Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch
#35Method of fabricating a semiconductor device
#36Substrate processing apparatus and methods
#37Method of forming a pattern and substrate processing system
#38Ion beam processing method and ion beam processing apparatus
#39Method for etching deep, high-aspect ratio features into glass, fused silica, and quartz materials
#40Method for producing contact areas on a semiconductor substrate
#41PULSE-PLASMA ETCHING METHOD AND PULSE-PLASMA ETCHING APPARATUS
#42PLASMA ETCHING METHOD AND APPARATUS THEREOF
#43Etch depth control for dual damascene fabrication process
#44Apparatus for etching high aspect ratio features
#45Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
#46Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
#47PLASMA PROCESSING METHOD, APPARATUS AND STORAGE MEDIUM
#48Plasma etching method
#49ETCHING METHODS AND APPARATUS AND SUBSTRATE ASSEMBLIES PRODUCED THEREWITH
#50High aspect ratio etch using modulation of RF powers of various frequencies
#51System and method for anisotropically etching a recess in a silicon substrate
#52High aspect ratio etch using modulation of RF powers of various frequencies
#53Plasma etching method