ClassID:

206686

H01J2237/3348 - CPC Classification

Classification description:

Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Processing objects by plasma generation characterised by the type of processing; Etching; Problems associated with etching control of ion bombardment energy

Recent Application in this class:
#1
20260018381
2026-01-15

ETCHING APPARATUS AND ETCHING METHOD

#2
20250292994
2025-09-18

GRID-LESS ION ENERGY DETECTOR

#3
20250291076
2025-09-18

GRID-LESS ION ANGLE DETECTOR

#4
20250246437
2025-07-31

SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES

#5
20250149299
2025-05-08

PLASMA PROCESSING SYSTEM, ASSISTANCE DEVICE, ASSISTANCE METHOD, AND ASSISTANCE PROGRAM

#6
20250054730
2025-02-13

Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System

#7
20240266150
2024-08-08

Semiconductor processing chamber

#8
20240242935
2024-07-18

MULTI-STATE RF PULSING IN CYCLING RECIPES TO REDUCE CHARGING INDUCED DEFECTS

#9
20240203704
2024-06-20

APPARATUS FOR TREATING SUBSTRATE

#10
20230298857
2023-09-21

Systems and methods for extracting process control information from radiofrequency supply system of plasma processing system

#11
20230290616
2023-09-14

SEMICONDUCTOR CHAMBER COMPONENTS WITH MULTI-LAYER COATING

#12
20230282447
2023-09-07

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#13
20220285170
2022-09-08

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING STACKED WIRING STRUCTURE, AND ION BEAM IRRADIATION APPARATUS

#14
20220051875
2022-02-17

Ion Stratification Using Bias Pulses of Short Duration

#15
20180053631
2018-02-22

Low Electron Temperature Etch Chamber with Independent Control Over Plasma Density, Radical Composition Ion Energy for Atomic Precision Etching

#16
20170125217
2017-05-04

Low electron temperature etch chamber with independent control over plasma density, radical composition and ion energy for atomic precision etching

#17
20160322230
2016-11-03

Etching method and etching apparatus

#18
20160181131
2016-06-23

Plasma processing apparatus and plasma processing method

#19
20150357209
2015-12-10

Negative ion control for dielectric etch

#20
20150179402
2015-06-25

Method for preparing samples for imaging

#21
20150155139
2015-06-04

DIELECTRIC WINDOW, ANTENNA AND PLASMA PROCESSING APPARATUS

#22
20150076111
2015-03-19

Feature etching using varying supply of power pulses

#23
20150075717
2015-03-19

INDUCTIVELY COUPLED SPATIALLY DISCRETE MULTI-LOOP RF-DRIVEN PLASMA SOURCE

#24
20150027637
2015-01-29

Plasma processing apparatus

#25
20150013908
2015-01-15

Etching apparatus

#26
20140374919
2014-12-25

Method for producing contact areas on a semiconductor substrate

#27
20140102638
2014-04-17

Plasma processing apparatus

#28
20130196511
2013-08-01

Etching method and etching apparatus

#29
20130136872
2013-05-30

Plasma processing in a capacitively-coupled reactor with trapezoidal-waveform excitation

#30
20130023064
2013-01-24

Negative ion control for dielectric etch

#31
20120252219
2012-10-04

Plasma processing apparatus and plasma processing method

#32
20120214313
2012-08-23

Plasma processing method and plasma processing apparatus

#33
20120052689
2012-03-01

PLASMA ETCHING METHOD AND APPARATUS THEREOF

#34
20100253224
2010-10-07

Modulated multi-frequency processing method

#35
20050159010
2005-07-21

Plasma processing apparatus

#36
16934871
2021-11-30

Ion stratification using bias pulses of short duration