H01J2237/3355 - CPC Classification Index

ClassID:

206688 ⎘

H01J2237/3355 - CPC Classification

Classification description:

Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Processing objects by plasma generation characterised by the type of processing; Cleaning Holes or apertures, i.e. inprinted circuit boards

Recent Application in this class:

20250098248

2025-03-20

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

20250079193

2025-03-06

SUBSTRATE PROCESSING APPARATUS

20250052272

2025-02-13

MULTI-ZONE COATINGS ON PARTS FOR GALLING PREVENTION AND HIGH-TEMPERATURE CHEMICAL STABILITY

20240222089

2024-07-04

ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS

20230022624

2023-01-26

METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURE

20200098540

2020-03-26

Extraction apparatus and system for high throughput ion beam processing

20190096637

2019-03-28

Plasma treatment apparatus and method

20110155060

2011-06-30

Method And Apparatus To Apply Surface Release Coating For Imprint Mold

20080131623

2008-06-05

Method and apparatus to apply surface release coating for imprint mold