ClassID:

205409

H01J37/3461 - CPC Classification

Classification description:

Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Constructional aspects of the reactor Means for shaping the magnetic field, e.g. magnetic shunts

Recent Application in this class:
#1
20260132019
2026-05-14

Anti-Stiction Process for Mems Device

#2
20260094797
2026-04-02

SPUTTERING APPARATUS, APPARATUS FOR MANUFACTURING MAGNETIC RECORDING MEDIUM, THIN FILM FORMING METHOD, AND METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM

#3
20260031312
2026-01-29

Beam Plasma Source Enhanced Magnetron Sputtering

#4
20250087472
2025-03-13

SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES

#5
20240212980
2024-06-27

PLASMA PROCESS APPARATUS

#6
20240194464
2024-06-13

STABLE GROUND ANODE FOR THIN FILM PROCESSING

#7
20240191340
2024-06-13

BIAS MAGNETIC FIELD CONTROL METHOD, CONTROL DEVICE, AND SEMICONDUCTOR PROCESS EQUIPMENT

#8
20240021421
2024-01-18

Vacuum deposition into trenches and vias

#9
20230307218
2023-09-28

Physical vapor deposition apparatus and method thereof

#10
20230282466
2023-09-07

SPUTTER MAGNETRON FOR OPERATING WITH OTHER PLASMA SOURCES

#11
20230091273
2023-03-23

Deposition method for tuning magnetic field distribution of deposition equipment

#12
20230055004
2023-02-23

Semiconductor apparatus and magnetic structure of semiconductor apparatus

#13
20230052340
2023-02-16

Movable magnet array for magnetron sputtering

#14
20220406582
2022-12-22

Multifocal magnetron design for physical vapor deposition processing on a single cathode

#15
20220384166
2022-12-01

MAGNETIC-FIELD-DISTRIBUTION TUNER, DEPOSITION EQUIPMENT AND METHOD OF DEPOSITION

#16
20220367161
2022-11-17

Physical vapor deposition apparatus and method thereof

#17
20220341029
2022-10-27

EM SOURCE FOR ENHANCED PLASMA CONTROL

#18
20220242724
2022-08-04

Anti-stiction process for MEMS device

#19
20220223392
2022-07-14

Thermally controlled magnetic fields optimization system for sputter deposition processes

#20
20210407779
2021-12-30

Film forming apparatus and film forming method

#21
20210123130
2021-04-29

Method and apparatus for depositing a material

#22
20210020417
2021-01-21

Depositing apparatus

#23
20200123003
2020-04-23

Anti-stiction process for MEMS device

#24
20200105511
2020-04-02

Physical vapor deposition apparatus and method thereof

#25
20190180991
2019-06-13

Multifocal magnetron design for physical vapor deposition processing on a single cathode

#26
20190174003
2019-06-06

Providing voice call support in a network

#27
20190035611
2019-01-31

Systems and methods for uniform target erosion magnetic assemblies

#28
20190031503
2019-01-31

Anti-stiction process for MEMS device

#29
20180323048
2018-11-08

Flexible adjustable return path magnet assembly and methods

#30
20170369985
2017-12-28

Laterally adjustable return path magnet assembly and methods

#31
20170175251
2017-06-22

Surrounding field sputtering source

#32
20160289815
2016-10-06

Method and apparatus for depositing a material

#33
20160273094
2016-09-22

Magnetic Configuration for a Magnetron Sputter Deposition System

#34
20160247667
2016-08-25

Sputtering apparatus

#35
20160035547
2016-02-04

Magnetron assembly for physical vapor deposition chamber

#36
20160013034
2016-01-14

Online adjustable magnet bar

#37
20150307985
2015-10-29

Rotation plus vibration magnet for magnetron sputtering apparatus

#38
20150303042
2015-10-22

Sputtering apparatus

#39
20150194294
2015-07-09

Method of fine tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device

#40
20150107992
2015-04-23

Sputtering apparatus and magnet unit

#41
20150075979
2015-03-19

Intaglio printing plate coating apparatus

#42
20150075970
2015-03-19

PVD plasma control using a magnet edge lift mechanism

#43
20140265857
2014-09-18

Apparatus and arrangements of magnetic field generators to facilitate physical vapor deposition to form semiconductor films

#44
20140246314
2014-09-04

Configurable variable position closed track magnetron

#45
20140158523
2014-06-12

Adjustable shunt assembly for a sputtering magnetron and a method for adjusting such a shunt

#46
20130299349
2013-11-14

Magnetic-field-generating apparatus for magnetron sputtering

#47
20130213797
2013-08-22

Rotation plus vibration magnet for magnetron sputtering apparatus

#48
20130186744
2013-07-25

Method of switching magnetic flux distribution

#49
20130180851
2013-07-18

Magnetic field generator, magnetron cathode and spattering apparatus

#50
20120111724
2012-05-10

MAGNETIC CIRCUIT FOR SPUTTERING APPARATUS

#51
20120027954
2012-02-02

MAGNET FOR PHYSICAL VAPOR DEPOSITION PROCESSES TO PRODUCE THIN FILMS HAVING LOW RESISTIVITY AND NON-UNIFORMITY

#52
20120024229
2012-02-02

CONTROL OF PLASMA PROFILE USING MAGNETIC NULL ARRANGEMENT BY AUXILIARY MAGNETS

#53
20120012458
2012-01-19

Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system

#54
20110311735
2011-12-22

Magnetron design for RF/DC physical vapor deposition

#55
20110186427
2011-08-04

Cylindrical magnetron having a shunt

#56
20110186421
2011-08-04

TARGET ASSEMBLY FOR A MAGNETRON SPUTTERING APPARATUS, A MAGNETRON SPUTTERING APPARATUS AND A METHOD OF USING THE MAGNETRON SPUTTERING APPARATUS

#57
20100018854
2010-01-28

Trim magnets to adjust erosion rate of cylindrical sputter targets

#58
20090229977
2009-09-17

Magnet Structure and Cathode Electrode Unit for Magnetron Sputtering System, and Magnetron Sputtering System

#59
20090200158
2009-08-13

HIGH POWER IMPULSE MAGNETRON SPUTTERING VAPOUR DEPOSITION

#60
20090078571
2009-03-26

MAGNET ASSEMBLY CAPABLE OF GENERATING MAGNETIC FIELD HAVING DIRECTION THAT IS UNIFORM AND CAN BE CHANGED AND SPUTTERING APPARATUS USING THE SAME

#61
20070209927
2007-09-13

Magnetron Sputtering Device In which Two Modes Of Magnetic Flux Distribution (Balanced Mode/Unbalanced Mode) Can Be Switched From One To The Other And Vice Versa, A Film Formation Method For Forming A Film From An Inorganic Film Formation Material Using The Device, And A Dual Mode Magnetron Sputtering Device And Film Formation Method For Forming A Film From An Inorganic Film Formation Material At A Low Temperature Using The Device

#62
20070080056
2007-04-12

Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths

#63
20070007130
2007-01-11

Enhanced magnetron sputtering target

#64
20060207873
2006-09-21

Split magnet ring on a magnetron sputter chamber

#65
20060197457
2006-09-07

Magnetically enhanced capacitive plasma source for ionized physical vapor deposition

#66
20050205412
2005-09-22

Sputtering device for manufacturing thin films

#67
20050194910
2005-09-08

Magnetically enhanced capacitive plasma source for ionized physical vapor deposition

#68
20050082166
2005-04-21

Cathode structure for vacuum sputtering machine