ClassID:

205415

H01J37/3479 - CPC Classification

Classification description:

Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Testing and control Detecting exhaustion of target material

Recent Application in this class:
#1
20250299938
2025-09-25

PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING

#2
20250062165
2025-02-20

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS

#3
20240429036
2024-12-26

PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING

#4
20240191340
2024-06-13

BIAS MAGNETIC FIELD CONTROL METHOD, CONTROL DEVICE, AND SEMICONDUCTOR PROCESS EQUIPMENT

#5
20230067466
2023-03-02

Physical vapor deposition process apparatus and method of optimizing thickness of a target material film deposited using the same

#6
20230026807
2023-01-26

SEMICONDUCTOR MANUFACTURING APPARATUS, CONDITION COMPENSATION METHOD, AND PROGRAM

#7
20220074044
2022-03-10

Film forming method, film forming apparatus, and program

#8
20210407779
2021-12-30

Film forming apparatus and film forming method

#9
20190096643
2019-03-28

Smart chamber and smart chamber components

#10
20180277344
2018-09-27

Magnetron sputtering device, magnetron sputtering apparatus and magnetron sputtering method

#11
20170271133
2017-09-21

Method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes

#12
20160376695
2016-12-29

Method for monitoring usage of a physical vapor deposition (PVD) target with an ultrasonic transducer

#13
20160237555
2016-08-18

Multi-Magnetron Arrangement

#14
20160225591
2016-08-04

SPUTTERING APPARATUS

#15
20160013032
2016-01-14

Cathode assembly, physical vapor deposition system, and method for physical vapor deposition

#16
20150262798
2015-09-17

Smart chamber and smart chamber components

#17
20150021167
2015-01-22

System and method for balancing consumption of targets in pulsed dual magnetron sputtering (DMS) processes

#18
20140246312
2014-09-04

Sputtering apparatus

#19
20140246310
2014-09-04

Sputtering apparatus

#20
20130017316
2013-01-17

SPUTTER GUN

#21
20120131784
2012-05-31

PVD target with end of service life detection capability

#22
20110126397
2011-06-02

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY

#23
20070068804
2007-03-29

PVD target with end of service life detection capability

#24
20070068803
2007-03-29

PVD target with end of service life detection capability

#25
20070068796
2007-03-29

METHOD OF USING A TARGET HAVING END OF SERVICE LIFE DETECTION CAPABILITY