205414 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering Testing and control
Sub-classes:SYSTEM FOR TARGET ARCING MAPPING AND PLASMA DIAGNOSIS
#2System and Method for Atomic Layer Etching with Uniformity Control Mechanisms
#3PHYSICAL VAPOR DEPOSITION APPARATUS
#4SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
#5SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#6Magnetron Sputtering Apparatus and Control Method for Timely Detecting Target Shorting by Monitoring Electrical Resistance Between PVD Target Cathode and Electrical Ground in Real Time
#7SENSOR SUBSTRATE AND INTEGRATED SENSING SURFACES
#8SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#9DEPOSITION SYSTEM AND METHOD
#10Method for Improving Deposition Process
#11PHYSICAL VAPOR DEPOSITION APPARATUS
#12SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#13REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING
#14PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING THE SAME
#15DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYER
#16Power Compensation in PVD Chambers
#17DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYER
#18FILM FORMING APPARATUS AND FILM FORMING METHOD
#19THIN FILM FORMING APPARATUS AND METHOD
#20Semiconductor processing tool and methods of operation
#21Film forming position misalignment correction method and film forming system
#22SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
#23SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#24System and method for residual gas analysis
#25FABRICATION OF ELECTROCHROMIC DEVICES
#26FABRICATION OF ELECTROCHROMIC DEVICES
#27SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
#28Two-dimensional electronic component and method of manufacturing same
#29METHOD FOR ATOMICALLY MANIPULATING AN ARTIFICIAL TWO-DIMENSIONAL MATERIAL AND APPARATUS THEREFOR
#30Deposition method for tuning magnetic field distribution of deposition equipment
#31Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate and additional plasma sources
#32Physical vapor deposition apparatus
#33Sputtering apparatus, film formation method, and method for manufacturing product
#34DEPOSITION SYSTEM AND METHOD
#35Methods and apparatus for processing a substrate
#36ANALYZING METHOD
#37Niobium sputtering target
#38MAGNET BAR WITH ATTACHED SENSOR
#39Sputtering apparatus and sputtering method
#40Method for processing substrate, processing apparatus, and processing system
#41System and method for residual gas analysis
#42Methods and apparatus for processing a substrate
#43SPUTTERING DEVICE AND SPUTTERING METHOD
#44MAGNETRON WITH CONTROLLER FOR MONITORING AND CONTROL
#45Coating control using forward parameter correction and adapted reverse engineering
#46Dual reverse pulse sputtering system
#47Measuring apparatus and film forming apparatus
#48Arc detector for detecting arcs, plasma system and method of detecting arcs
#49RATE ENHANCED PULSED DC SPUTTERING SYSTEM
#50Film manufacturing apparatus and manufacturing method of double-sided laminated film
#51Sputtering method
#52Real-time detection of particulate matter during deposition chamber manufacturing
#53Fabrication of electrochromic devices
#54Fabrication of electrochromic devices
#55Fabrication of electrochromic devices
#56Analyzing method
#57FILLING A CAVITY IN A SUBSTRATE USING SPUTTERING AND DEPOSITION
#58Feedback system
#59Method for improving deposition process
#60Apparatus and methods for depositing variable interference filters
#61Fabrication of electrochromic devices
#62THIN FILM FORMATION APPARATUS, SPUTTERING CATHODE, AND METHOD OF FORMING THIN FILM
#63FABRICATION OF ELECTROCHROMIC DEVICES
#64Smart chamber and smart chamber components
#65Sputtering gap measurement apparatus and magnetron sputtering device
#66Fabrication of electrochromic devices
#67Apparatus and method for film formation by physical sputtering
#68FILM FORMATION APPARATUS AND FILM FORMATION METHOD
#69Plasma chamber target for reducing defects in workpiece during dielectric sputtering
#70Sputtering apparatus, film deposition method, and control device
#71CERAMIC METALLIC COATINGS
#72Sputtering target having RFID information
#73Sputtering apparatus and sputtering method
#74Rate enhanced pulsed DC sputtering system
#75Rate enhanced pulsed DC sputtering system
#76FABRICATION OF ELECTROCHROMIC DEVICES
#77Fabrication of electrochromic devices
#78Pulse shape controller for sputter sources
#79Physical vapor deposition (PVD) plasma energy control per dynamic magnetron control
#80Sputtering apparatus and sputtering method using the same
#81Filling a cavity in a substrate using sputtering and deposition
#82Treating arcs in a plasma process
#83Method and Device for Particle Measurement
#84Ionized physical vapor deposition (IPVD) apparatus and method for an inductively coupled plasma sweeping source
#85Film formation apparatus and film formation method
#86DEVICE EQUIPPED WITH AN ION BEAM SOURCE FOR COATING A SUBSTRATE IN A VACUUM CHAMBER
#87Vacuum device
#88RF sputtering apparatus and sputtering method
#89METHODS AND APPARATUS FOR STABLE SUBSTRATE PROCESSING WITH MULTIPLE RF POWER SUPPLIES
#90Sputtering system and method including an arc detection
#91APPARATUS AND METHOD FOR DEPOSITING HYDROGEN-FREE TA-C LAYERS ON WORKPIECES AND WORKPIECE
#92Film forming system
#93Sputtering apparatus and processing apparatus
#94GENERATOR OF TRANSIENT, HEAVY ELECTRONS AND APPLICATION TO TRANSMUTING RADIOACTIVE FISSION PRODUCTS
#95Sputter System for Uniform Sputtering
#96HIGH POWER PULSE IONIZED PHYSICAL VAPOR DEPOSITION
#97Systems and methods for single magnetron sputtering
#98Film Forming Apparatus and Film Forming Method
#99Method and Apparatus for Coating Nanoparticulate Films on Complex Substrates
#100Cover with a sensor system for a configurable measuring system for a configurable sputtering system
#101Sputter unit
#102Rate enhanced pulsed DC sputtering system
#103Method and apparatus for depositing a material
#104Method of manufacturing tunnel magnetoresistive effect element and sputtering apparatus
#105Sputtering apparatus
#106MODULATION OF REVERSE VOLTAGE LIMITED WAVEFORMS IN SPUTTERING DEPOSITION CHAMBERS
#107Defect-mitigation layers in electrochromic devices
#108COPPER SUBSTRATE FOR DEPOSITION OF GRAPHENE
#109Target age compensation method for performing stable reactive sputtering processes
#110Method for inspecting magnetron
#111METHOD FOR FILLING VIAS AND SUBSTRATE-VIA FILLING VACUUM PROCESSING SYSTEM
#112Sputtering apparatus, film deposition method, and control device
#113Sustained self-sputtering of lithium for lithium physical vapor deposition
#114METHOD AND APPARATUS FOR SURFACE PROCESSING OF A SUBSTRATE USING AN ENERGETIC PARTICLE BEAM
#115PROCESSING APPARATUS
#116Sputtering apparatus
#117Defect-mitigation layers in electrochromic devices
#118THIN FILM FORMATION APPARATUS, SPUTTERING CATHODE, AND METHOD OF FORMING THIN FILM
#119Smart chamber and smart chamber components
#120ASSEMBLY FOR USE IN A VACUUM TREATMENT PROCESS
#121METHOD AND SYSTEM OF PROVIDING DOPANT CONCENTRATION CONTROL IN DIFFERENT LAYERS OF A SEMICONDUCTOR DEVICE
#122Method for producing a multilayer coating and device for carrying out said method
#123SUBSTRATE PROCESSING APPARATUS
#124Cathodic arc deposition
#125Sputtering apparatus
#126Variable radius dual magnetron
#127Recycling method for tantalum coil for sputtering and tantalum coil obtained by the recycling method
#128Deposition system with a rotating drum
#129METHODS OF ARC DETECTION AND SUPPRESSION DURING RF SPUTTERING OF A THIN FILM ON A SUBSTRATE
#130Sputtering apparatus, sputtering method, and electronic device manufacturing method
#131High Power Pulse Ionized Physical Vapor Deposition
#132Substrate processing apparatus and particle adhesion preventing method
#133Sputtering system and method including an arc detection
#134Method and apparatus for surface processing of a substrate using an energetic particle beam
#135Method for producing a multilayer coating and device for carrying out said method
#136High deposition rate sputtering
#137High deposition rate sputtering
#138Optimizing cadmium (Cd) alloy solar cells with sputtered copper-doped zinc telluride (ZnTe:Cu) back contacts in the presence of hydrogen
#139System for target arcing mapping and plasma diagnosis