Patents-Review.com
ClassID:

205416 ⎘

H01J37/3482 - CPC Classification

Classification description:

Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Testing and control Detecting or avoiding eroding through

Recent Application in this class:
#1
20250059640
2025-02-20

FILM FORMING APPARATUS AND FILM FORMING METHOD

 #2
20230030464
2023-02-02

SUPPORT UNIT, APPARATUS FOR TREATING SUBSTRATE WITH THE SAME AND METHOD FOR TREATING SUBSTRATE WITH THE SAME

 #3
20220178014
2022-06-09

Film forming apparatus and film forming method

 #4
20220154330
2022-05-19

System and method for detecting abnormality of thin-film deposition process

 #5
20220074044
2022-03-10

Film forming method, film forming apparatus, and program

 #6
20200234934
2020-07-23

Interchangeable magnet pack

 #7
20160289820
2016-10-06

Rotary magnetron magnet bar and apparatus containing the same for high target utilization

 #8
20160247667
2016-08-25

Sputtering apparatus

 #9
20160163521
2016-06-09

Interchangeable magnet pack

 #10
20140110254
2014-04-24

Backing plate for a sputter target, sputter target, and sputter device

 #11
20130043120
2013-02-21

Sputtering target with reverse erosion profile surface and sputtering system and method using the same

 #12
20120261253
2012-10-18

Rotary magnetron magnet bar and apparatus containing the same for high target utilization

 #13
20120175251
2012-07-12

Sputtering apparatus

 #14
20120132518
2012-05-31

Method for predicting and compensating erosion in a magnetron sputtering target

 #15
20120131784
2012-05-31

PVD target with end of service life detection capability

 #16
20110126397
2011-06-02

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY

 #17
20100006423
2010-01-14

MAGNETIC FIELD GENERATION CONTROL UNIT AND MAGNETRON SPUTTERING APPARATUS AND METHOD USING THE SAME

 #18
20090159428
2009-06-25

Prediction and compensation of erosion in a magnetron sputtering target

 #19
20080210556
2008-09-04

Sputtering apparatus

 #20
20070068804
2007-03-29

PVD target with end of service life detection capability

 #21
20070068803
2007-03-29

PVD target with end of service life detection capability

 #22
20070068796
2007-03-29

METHOD OF USING A TARGET HAVING END OF SERVICE LIFE DETECTION CAPABILITY

 #23
20070017800
2007-01-25

System and apparatus for real-time monitoring and control of sputter target erosion

 #24
20060180074
2006-08-17

Plasma processing apparatus and components thereof, and method for detecting life span of the components

 #25
20060054497
2006-03-16

Apparatus, method and system for monitoring chamber parameters associated with a deposition process

 #26
20050236266
2005-10-27

Sputter target monitoring system

 #27
20050211549
2005-09-29

Method and system for target lifetime

 #28
20050023132
2005-02-03

Device for measuring the profile of a metal film sputter deposition target, and system and method employing same