205421 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus Temperature of target
PLASMA DEPOSITION APPARATUS AND PLASMA DEPOSITION METHOD
#2DEPOSITION SYSTEM AND METHOD
#3Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus
#4Tilted PVD source with rotating pedestal
#5SHUTTER DISK FOR PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER
#6Deposition system and method
#7METHOD OF FORMING MATERIAL LAYER
#8Sputtering apparatus and sputtering method
#9Recipe updating method
#10Ventilated semiconductor processing apparatus
#11Physical vapor deposition processing systems target cooling
#12Cathode unit and film forming apparatus
#13Apparatus for conducting plasma surface treatment, board treatment system having the same
#14Target structure and film forming apparatus
#15MEMS frame heating platform for electron imagable fluid reservoirs or larger conductive samples
#16Sputtering target with backside cooling grooves
#17Physical vapor deposition processing systems target cooling
#18Rotatable sputtering target
#19Sputtering target and manufacturing method thereof
#20FLOW RATE CONTROL METHOD, TEMPERATURE CONTROL METHOD, AND PROCESSING APPARATUS
#21Electrical transfer in an endblock for a sputter device
#22Film forming unit for sputtering apparatus
#23Magnetron having enhanced target cooling configuration
#24HEATING CARRIER DEVICE FOR USE ON SPUTTERING CATHODE ASSEMBLY
#25Physical vapor deposition processing systems target cooling
#26SPUTTERING TARGET WITH MICRO CHANNELS
#27Cathode assembly having a dual position magnetron and centrally fed coolant
#28Sputtering target with backside cooling grooves
#29Physical vapor deposition processing systems target cooling
#30COOLING AND UTILIZATION OPTIMIZATION OF HEAT SENSITIVE BONDED METAL TARGETS
#31ENDBLOCK FOR ROTATABLE TARGET WITH ELECTRICAL CONNECTION BETWEEN COLLECTOR AND ROTOR AT PRESSURE LESS THAN ATMOSPHERIC PRESSURE
#32Rotary cathode unit for magnetron sputtering apparatus
#33Sputtering target with backside cooling grooves
#34Sputtering target and/or coil, and process for producing same
#35Molten target sputtering (MTS) deposition for enhanced kinetic energy and flux of ionized atoms
#36Target assembly
#37SPUTTERING SOURCE ARRANGEMENT, SPUTTERING SYSTEM AND METHOD OF MANUFACTURING METAL-COATED PLATE-SHAPED SUBSTRATES
#38Cooling water jet pack for high power rotary cathodes
#39Thin substrate processing device
#40Hermetically sealed magnetic keeper cathode
#41Target, adapted to an indirect cooling device, having a cooling plate
#42Centering of a plate in a holder both at room temperatures and at higher temperatures
#43Sputtering target having increased power compatibility
#44Film forming apparatus and film forming method
#45Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
#46Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
#47Target adapted to an indirect cooling device
#48Sputtering target with backside cooling grooves
#49Sputter source for use in a semiconductor process chamber
#50Hot tile sputtering system
#51Evaporation source
#52TARGET COOLING FOR PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING SYSTEMS
#53High-power sputtering source
#54Tubular target having a protective device
#55Narrow source for physical vapor deposition processing
#56METHOD FOR PRODUCING COATING LAYER WITH LOW-FRICTION
#57Sputtering target and/or coil, and process for producing same
#58Cooling ring for physical vapor deposition chamber target
#59SPUTTER GUN
#60DEPOSITION SYSTEM HAVING IMPROVED TARGET COOLING
#61Non-adhesive sputtering structure including a sputtering target and backing plate
#62Target cooling through gun drilled holes
#63MAGNETRON ARRANGEMENT WITH A HOLLOW TARGET
#64Method and Apparatus for Super-High Rate Deposition
#65ROTARY MAGNETRON
#66ROTARY MAGNET SPUTTERING APPARATUS
#67Sputtering cathode having a non-bonded semiconducting target
#68COOLED DARK SPACE SHIELD FOR MULTI-CATHODE DESIGN
#69DEVICE FOR SUPPORTING A ROTATABLE TARGET AND SPUTTERING INSTALLATION
#70INDEXING MAGNET ASSEMBLY FOR ROTARY SPUTTERING CATHODE
#71Rotatable sputtering magnetron with high stiffness
#72TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM
#73SPUTTERING SYSTEM, ROTATABLE CYLINDRICAL TARGET ASSEMBLY, BACKING TUBE, TARGET ELEMENT AND COOLING SHIELD
#74Sputtering target temperature control utilizing layers having predetermined emissivity coefficients
#75Rotary magnet sputtering apparatus
#76COOLING PLATE AND MANUFACTURING METHOD THEREFOR
#77Hot tile sputtering system
#78Rotary cathode for magnetron sputtering apparatus
#79Rotatable magnetron sputtering with axially movable target electrode tube
#80VACUUM COATING APPARATUS
#81Rotatable sputter target comprising an end-block with a liquid coolant supply system
#82INSERT PIECE FOR AN END-BLOCK OF A SPUTTERING INSTALLATION
#83Plasma deposition apparatus and method
#84Securing device for a sputtering source
#85COOLING SHIELD FOR SUBSTRATE PROCESSING CHAMBER
#86Single, Right-Angled End-Block
#87Supply end block for rotary magnetron
#88Circulated cooled target
#89COOLED DARK SPACE SHIELD FOR MULTI-CATHODE DESIGN
#90Target for a sputtering source
#91Sputtering with cooled target
#92Target holding apparatus
#93Facing-targets type sputtering apparatus
#94Process kit components for titanium sputtering chamber
#95Target for sputtering chamber
#96Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof
#97Cathode sputtering gas distribution apparatus
#98SPUTTERING TARGET FOR TITANIUM SPUTTERING CHAMBER
#99Sputtering target and method/apparatus for cooling the target
#100Sputtering target and method/apparatus for cooling the target
#101Sputtering target and method/apparatus for cooling the target
#102Plasma CVD apparatus and plasma surface treatment method
#103Monolithic sputter target backing plate with integrated cooling passages
#104Controllable target cooling
#105Module for Coating System and Associated Technology
#106Target assemblies, targets, backing plates, and methods of target cooling
#107Coating installation with coolable diaphragm
#108Target backing plate for sputtering system
#109Sacrificial cathode target for sputtering cathode assembly
#110Magnetically enhanced capacitive plasma source for ionized physical vapor deposition
#111Sputtering cathode, production method and corresponding cathode
#112Rotating tubular sputter target assembly
#113Magnetron sputter cathode
#114Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof
#115Method for magnetron sputtering
#116Cylindrical target with oscillating magnet for magnetron sputtering
#117Sputtering cathode for coating processes
#118Controlled cooling of sputter targets
#119Magnetically enhanced capacitive plasma source for ionized physical vapor deposition
#120Rotating tubular cathode
#121Vacuum sputtering cathode
#122Thermography test method and apparatus for bonding evaluation in sputtering targets
#123Sputtering device
#124Method of manufacturing sputter targets with internal cooling channels
#125Sputtering targets, and related apparatuses and methods
#126Cooling water jet pack for high power rotary cathodes