206989 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Preparing wafers; Preparing bulk and homogeneous wafers Making porous regions on the surface
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
#2SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#3Substrate For Epitaxial Growth, Manufacturing Method of the Same, Semiconductor Device Including the Same and Manufacturing Method Using the Same
#4METHOD FOR DETECTING ANALYTES
#5Manufacturing and reuse of semiconductor substrates
#6METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#7Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
#8Method of porosifying part of a semiconductor wafer
#9Method of electrochemically processing a substrate and integrated circuit device
#10BIASED PULSE CMP GROOVE PATTERN
#11Semiconductor surface smoothing and semiconductor arrangement
#12Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
#13Direct growth methods for preparing diamond-assisted heat-dissipation silicon carbide substrates of GaN-HEMTs
#14Method for partially removing a semiconductor wafer
#15Foam in ion implantation system
#16SEMICONDUCTOR DEVICE WITH STRAINED SILICON LAYERS ON POROUS SILICON
#17Biased pulse CMP groove pattern
#18Controlled residence CMP polishing method
#19Uniform CMP polishing method
#20High-throughput batch porous silicon manufacturing equipment design and processing methods
#21Porous semiconductor handle substrate
#22Detection of analytes using porous mass spectrometry surface
#23Display device with reduced warping and method for fabricating the same
#24Silicon-containing semiconductor structures, methods of making the same and devices including the same
#25Thermally stable charge trapping layer for use in manufacture of semiconductor-on-insulator structures
#26METHODS OF FORMING A SUBSTRATE HAVING AN OPEN PORE THEREIN AND PRODUCTS FORMED THEREBY
#27HIGH-THROUGHPUT BATCH POROUS SILICON MANUFACTURING EQUIPMENT DESIGN AND PROCESSING METHODS
#28High-throughput batch porous silicon manufacturing equipment design and processing methods
#29Method for processing an oxygen containing semiconductor body
#30Enhanced porosification
#31Electro-polishing and porosification
#32Method for Separating a Layer and a Chip Formed on a Layer
#33Solar cell wafer and method of producing the same
#34High-Throughput batch porous silicon manufacturing equipment design and processing methods
#35METHOD OF FORMING MICRO-PORE STRUCTURES OR TRENCH STRUCTURES ON SURFACE OF SILICON WAFER SUBSTRATE
#36Semiconductor substrate having multilayer film and method to reuse the substrate by delaminating a porous layer
#37Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost
#38Porous silicon and method of preparing the same
#39Multi-channel optical receiver module
#40Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost
#41Method of fabricating multi-freestanding GaN wafer
#42Member which includes porous silicon region, and method of manufacturing member which contains silicon