206990 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Preparing wafers; Preparing bulk and homogeneous wafers by reclaiming or re-processing
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
#2METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF WHICH HAS BEEN REMOVED BY DELAMINATION
#3FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
#4Method for manufacturing a composite structure comprising a thin layer of monocrystalline SiC on a carrier substrate of polycrystalline SiC
#5Crystal efficient SiC device wafer production
#6Fully automated wafer debonding system and method thereof
#7Healing method before transfer of a semiconducting layer
#8Method of wafer recycling
#9Semiconductor package having high mechanical strength
#10Method and apparatus for a semiconductor-on-higher thermal conductive multi-layer composite wafer
#11Method for manufacturing group-III nitride substrate and group-III nitride substrate
#12REMOVAL OF NON-CLEAVED/NON-TRANSFERRED MATERIAL FROM DONOR SUBSTRATE
#13BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAMATION
#14PLASMA PROCESSING SYSTEM USING ELECTRON BEAM AND CAPACITIVELY-COUPLED PLASMA
#15Method for manufacturing an SOI wafer
#16SOI substrate and manufacturing method thereof
#17Substrate regeneration method and regenerated substrate
#18Method of producing bonded wafer with uniform thickness distribution
#19Substrate recycling method
#20Method for manufacturing SOI wafer
#21Reclaiming processing method for delaminated wafer
#22Method for recycling a substrate holder
#23Substrate recycling method and recycled substrate
#24Reclaimed Wafer And A Method For Reclaiming A Wafer
#25SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL SUBSTRATE WITH MULTILAYER FILM, AND ELEMENT MANUFACTURING METHOD
#26INTERNALLY REFORMED SUBSTRATE FOR EPITAXIAL GROWTH, INTERNALLY REFORMED SUBSTRATE WITH MULTILAYER FILM, SEMICONDUCTOR DEVICE, BULK SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHODS THEREFOR
#27METHOD OF ELIMINATING FRAGMENTS OF MATERIAL PRESENT ON THE SURFACE OF A MULTILAYER STRUCTURE
#28Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
#29METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION
#30METHOD FOR RECYCLING A SOURCE SUBSTRATE
#31METHOD FOR RECYCLING WAFER
#32Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#33Semiconductor substrate having multilayer film and method to reuse the substrate by delaminating a porous layer
#34CONTROL WAFER RECLAMATION PROCESS
#35Method for manufacturing SOI substrate
#36Method for routing a chamfered substrate
#37Methods and apparatus for edge chamfering of semiconductor wafers using chemical mechanical polishing
#38SOI substrate and manufacturing method thereof
#39Semiconductor wafer re-use using chemical mechanical polishing
#40Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of SOI substrate
#41Method for the ultrasonic planarization of a substrate, from one surface of which a buried weakened layer has been uncovered by fracture
#42Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
#43Silicon wafer reclamation process
#44Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
#45Reconditioned substrates for fabricating compound material wafers
#46Method for reprocessing semiconductor substrate and method for manufacturing SOI substrate
#47Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatments
#48Method for transferring a layer from a donor substrate onto a handle substrate
#49Method for reclaiming a surface of a substrate
#50Device for polishing the edge of a semiconductor substrate
#51Methods for recycling substrates and fabricating laminated wafers
#52Wafer reclamation method and wafer reclamation apparatus
#53METHOD OF RECYCLING AN EPITAXIED DONOR WAFER
#54Method for recycling/reclaiming a monitor wafer
#55METHOD FOR PROCESSING A SILICON-ON-INSULATOR STRUCTURE
#56Crystalline silicon substrates with improved minority carrier lifetime including a method of annealing and removing SiOx precipitates and getterning sites
#57Method for preparing thin GaN layers by implantation and recycling of a starting substrate
#58METHOD OF RECYCLING AN EPITAXIED DONOR WAFER
#59Method of forming a device wafer with recyclable support
#60Reclamation method of semiconductor wafer
#61Slurryless mechanical planarization for substrate reclamation
#62CONTROL WAFER RECLAMATION PROCESS
#63METHOD FOR REUSING DELAMINATED WAFER
#64Method for recycling of ion implantation monitor wafers
#65Methods for fabricating compound material wafers
#66Silicon wafer reclamation process
#67Method for manufacturing semiconductor substrate
#68Edge removal of silicon-on-insulator transfer wafer
#69Wafer recycling method
#70Wafer reclaim method based on wafer type
#71Method for manufacturing substrate of semiconductor device
#72METHOD FOR MANUFACTURING COMPOUND MATERIAL WAFER AND CORRESPONDING COMPOUND MATERIAL WAFER
#73Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#74Method of forming a device wafer with recyclable support
#75Method for manufacturing compound material wafers and corresponding compound material wafer
#76Recycling of ion implantation monitor wafers
#77Method to recover patterned semiconductor wafers for rework
#78Edge removal of silicon-on-insulator transfer wafer
#79METHODS OF RECYCLING A SUBSTRATE INCLUDING USING A CHEMICAL MECHANICAL POLISHING PROCESS
#80Methods for manufacturing compound-material wafers and for recycling used donor substrates
#81Process for Regeneration of a Layer Transferred Wafer and Regenerated Layer Transferred Wafer
#82Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer
#83Method of recycling an epitaxied donor wafer
#84Silicon wafer reclamation method and reclaimed wafer
#85Process for producing SOI substrate and process for regeneration of layer transferred wafer in the production
#86Multifunctional metallic bonding
#87Process for transfer of a thin layer formed in a substrate with vacancy clusters
#88Edge removal of silicon-on-insulator transfer wafer
#89Recycling the reconditioned substrates for fabricating compound material wafers
#90Methods for fabricating a wafer structure having a strained silicon utility layer
#91Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
#92Method for recycling/reclaiming a monitor wafer
#93Methods for transferring a useful layer of silicon carbide to a receiving substrate
#94Wafer and the manufacturing and reclaiming methods thereof
#95Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
#96Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
#97Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
#98Method for producing thin layers of semiconductor material from a donor wafer
#99Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
#100Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
#101Method of reclaiming silicon wafers
#102Multifunctional metallic bonding
#103Methods for transferring a useful layer of silicon carbide to a receiving substrate