207006 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning Cleaning for reclaiming
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#2Ultrasonic cleaning method
#3FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
#4Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC
#5TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE
#6Epitaxial alkali halide layers for III-V substrate recycling
#7Method for manufacturing a composite structure comprising a thin layer made of monocrystalline sic on a carrier substrate made of SiC
#8SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#9SEMICONDUCTOR CHIP DELAMINATION DEVICE AND CONTROL METHOD THEREFOR
#10SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELING
#11METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND STRIPPING COMPOSITION
#12COMPOSITION, AND METHOD FOR CLEANING ADHESIVE POLYMER
#13Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate
#14SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
#15Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer
#16Processing method of device wafer
#17Fully automated wafer debonding system and method thereof
#18Metrology method in wafer transportation
#19Composition for forming a coating film for removing foreign matters
#20Device modified substrate article and methods for making
#21Substrate processing apparatuses and substrate processing methods
#22Metrology method in wafer transportation
#23Methods of Transferring a Graphene Monolayer via a Stacked Structure and Devices Fabricated Thereby
#24Polysilicon chip reclamation assembly and method of reclaiming polysilicon chips from a polysilicon cleaning apparatus
#25Systems and methods for anisotropic material breakthrough
#26Method for manufacturing restored substrate and method for manufacturing light emitting element
#27High performance solar cells, arrays and manufacturing processes therefor
#28De-bonding and cleaning process and system
#29Sapphire substrate recycling method
#30Device modified substrate article and methods for making
#31Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures
#32SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE
#33Recycle photochemical to reduce cost of material and environmental impact
#34Rework and stripping of complex patterning layers using chemical mechanical polishing
#35Methods of forming a protection layer to protect a metal hard mask layer during lithography reworking processes
#36Method for recovering metal copper from coated copper wires
#37Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#38CONTROL WAFER RECLAMATION PROCESS
#39METHOD FOR REWORKING SILICON-CONTAINING ARC LAYERS ON A SUBSTRATE
#40Electron induced chemical etching and deposition for local circuit repair
#41Method for fabricating a semiconductor on insulator type substrate
#42Device for polishing the edge of a semiconductor substrate
#43METHODS OF REMOVING MULTI-LAYERED STRUCTURE AND OF MANUFACTURING SEMICONDUCTOR DEVICE
#44Method for recycling/reclaiming a monitor wafer
#45METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION
#46Composition for removing an insulation material and related methods
#47Slurryless mechanical planarization for substrate reclamation
#48CONTROL WAFER RECLAMATION PROCESS
#49Reworked integrated circuit device and reworking method thereof
#50Tri-layer plasma etch resist rework
#51Wafer recycling method
#52METHOD FOR REMOVING POLY SILICON
#53Wafer recycling method using laser films stripping
#54Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#55Mask rework method
#56Copper process methodology
#57Floating gate process methodology
#58Method for processing semiconductor wafer
#59METHODS OF RECYCLING A SUBSTRATE INCLUDING USING A CHEMICAL MECHANICAL POLISHING PROCESS
#60METHOD OF RECYCLING DUMMY WAFER
#61Electron induced chemical etching and deposition for local circuit repair
#62Cleaning composition for removing impurities and method of removing impurities using the same
#63Refurbishing a wafer having a low-k dielectric layer
#64REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER
#65REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER BY CHEMICAL MECHANICAL POLISHING
#66FINE GRINDING A LOW-K DIELECTRIC LAYER OFF A WAFER
#67Semiconductor processes and apparatuses thereof
#68Composition for removing an insulation material, method of removing an insulation layer and method of recycling a substrate using the same
#69Composition for removing an insulation material and related methods
#70Silicon wafer reclamation method and reclaimed wafer
#71Polishing slurry and method of reclaiming wafers
#72Removal of silicon oxycarbide from substrates
#73Method of reworking a semiconductor structure
#74Refreshing wafers having low-k dielectric materials
#75Method and apparatus for removing SiC or low k material film
#76Method for recycling/reclaiming a monitor wafer
#77Method for reclaiming and reusing wafers
#78Wafer and the manufacturing and reclaiming methods thereof
#79Method of reworking layers over substrate