207012 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning only mechanical cleaning
SHEET FIXING APPARATUS AND METHOD OF MANUFACTURING COMBINATION OF WORKPIECE AND SHEET FIXED THERETO
#2PROTECTIVE LAYER FORMING METHOD AND WORKPIECE PROCESSING METHOD
#3WAFER CLEANING DEVICE, WAFER POLISHING EQUIPMENT AND METHOD FOR CLEANING WAFER
#4NON-DEGRADABLE SUBSTANCE DEGRADATION DEVICE USING ULTRASOUND AND DEGRADATION METHOD THEREOF
#5APPARATUS AND METHOD OF BRUSH CLEANING USING PERIODIC CHEMICAL TREATMENTS
#6SUBSTRATE PROCESSING MODULE AND SUBSTRATE PROCESSING METHOD
#7SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#8Apparatus and method of brush cleaning using periodic chemical treatments
#9SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
#10SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
#11BRUSHES, SYSTEMS, AND METHODS FOR DISPENSING MULTIPLE FLUIDS DURING CLEANING OF A SURFACE
#12Laminates for Cleaning Substrate Surfaces and Methods of Use Thereof
#13METHODS OF SEPARATING SEMICONDUCTOR DIES
#14EPITAXIAL WAFER CLEANING METHOD
#15Substrate cleaning device and substrate cleaning method
#16Substrate cleaning device and substrate cleaning method
#17MIRROR DEVICE MANUFACTURING METHOD AND MIRROR UNIT MANUFACTURING METHOD
#18Semiconductor fabricating system having hybrid brush assembly
#19MACHINE LEARNING DEVICE, SUBSTRATE PROCESSING DEVICE, TRAINED MODEL, MACHINE LEARNING METHOD, AND MACHINE LEARNING PROGRAM
#20SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
#21Treating a silicon on insulator wafer in preparation for manufacturing an atomistic electronic device interfaced with a CMOS electronic device
#22SYSTEM AND METHOD FOR CLEANING CONTACT ELEMENTS AND SUPPORT HARDWARE USING FUNCTIONALIZED SURFACE MICROFEATURES
#23SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
#24SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
#25Method for cleaning semiconductor wafer backside surface by hybrid brush assembly
#26Treating a silicon on insulator wafer in preparation for manufacturing an atomistic electronic device interfaced with a CMOS electronic device
#27System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
#28Device and method for cleaning a printing device
#29Laminate of aluminum nitride single-crystal substrate
#30Automated particle removal system
#31Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
#32Hybrid material post-CMP brushes and methods for forming the same
#33Substrate cleaning method and substrate cleaning apparatus
#34Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool
#35BACKSIDE BRUSH FOR CLEANING WAFER AND CLEANING APPARATUS HAVING THE SAME
#36Substrate processing method
#37Method of producing a component of a device, and the resulting components and devices
#38Substrate cleaning device and substrate cleaning method
#39Substrate processing apparatus and substrate processing method
#40HYBRID MATERIAL POST-CMP BRUSHES AND METHODS FOR FORMING THE SAME
#41Buff processing device and substrate processing device
#42Method to remove sidewall damage after MTJ etching
#43Polishing method, polishing apparatus, and substrate processing system
#44Substrate cleaning apparatus and substrate processing apparatus
#45Substrate treatment method and substrate treatment device
#46Substrate processing apparatus, substrate processing method and recording medium
#47Manufacturing method of gallium nitride substrate
#48Substrate cleaning apparatus and substrate processing apparatus X
#49Drying high aspect ratio features
#50Cleaning apparatus and substrate processing apparatus
#51Cleaning sponge and cleaning method
#52De-bonding and cleaning process and system
#53Substrate processing system
#54Cleaning method and laminate of aluminum nitride single-crystal substrate
#55Apparatus and method for cleaning semiconductor wafer
#56Removing particulate contaminants from the backside of a wafer or reticle
#57Cleaning device and roll cleaning member
#58Sacrificial layer for post-laser debris removal systems
#59Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#60De-bonding and cleaning process and system
#61Wiping device and stack manufacturing apparatus
#62Nodule ratios for targeted enhanced cleaning performance
#63CLEANING SPONGE AND CLEANING METHOD
#64De-bonding and cleaning process and system
#65CLEANING MEMBER, CLEANING APPARATUS, AND CLEANING METHOD
#66Mechanism for forming metal gate structure
#67Conical sponge brush for cleaning semiconductor wafers
#68METHOD OF PRODUCING A COMPONENT OF A DEVICE, AND THE RESULTING COMPONENTS AND DEVICES
#69Methods and apparatus for post-chemical mechanical planarization substrate cleaning
#70Apparatus for Cleaning a Semiconductor Substrate
#71Substrate cleaning method
#72High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods
#73CONCAVE NODULE SPONGE BRUSH
#74Conical sponge brush for cleaning semiconductor wafers
#75Methods for particle reduction in semiconductor processing
#76Methods for cleaning a semiconductor substrate
#77Method and apparatus for cleaning semiconductor substrates
#78Method and system for extracting samples after patterning of microstructure devices
#79Method of producing a component of a device, and the resulting components and devices
#80Method of reducing contamination by providing a removable polymer protection film during microstructure processing
#81Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus
#82Material for cleaning a substrate
#83Two-phase substrate cleaning material
#84Apparatus for cleaning contaminants from substrate
#85Method for removing contamination from a substrate and for making a cleaning solution
#86Washing device and method for fabricating the same
#87Method and apparatus for removing contamination from substrate
#88Method and material for cleaning a substrate
#89Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus
#90Apparatus for removing foreign material from substrate and method for removing foreign material from substrate
#91Methods for treating surfaces
#92Method for removing particles from a semiconductor surface
#93Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
#94TUNABLE MEGASONICS CAVITATION PROCESS USING MULTIPLE TRANSDUCERS FOR CLEANING NANOMETER PARTICLES WITHOUT STRUCTURE DAMAGE
#95METHOD OF REMOVING IMPURITIES ON A GRINDING SURFACE OF A SEMICONDUCTOR WAFER, EQUIPMENT OF REMOVING IMPURITIES ON A GRINDING SURFACE OF A SEMICONDUCTOR WAFER, PROCESS OF MANUFACTURE OF SEMICONDUCTOR WAFER, PROCESS OF MANUFACTURE OF SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#96Method of reducing contamination by providing a removable polymer protection film during microstructure processing
#97Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions
#98Method and system for using a two-phases substrate cleaning compound
#99Method and apparatus for cleaning a semiconductor substrate
#100Method and apparatus for cleaning a semiconductor substrate
#101Method and apparatus for removing contamination from substrate
#102METHOD FOR CLEANING PARTICULATE FOREIGN MATTER FROM THE SURFACES OF SEMICONDUCTOR WAFERS
#103Systems and methods for removing wafer edge residue and debris using a residue remover mechanism
#104Method for treating a wafer edge
#105Method for CuO reduction by using two step nitrogen oxygen and reducing plasma treatment
#106Method for removing contamination from a substrate and for making a cleaning solution
#107Wafer bonded virtual substrate and method for forming the same