Patents-Review.com
ClassID:

207013 ⎘

H01L21/02098 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning only involving lasers, e.g. laser ablation

Recent Application in this class:
#1
20250192077
2025-06-12

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICATIONS

 #2
20250191905
2025-06-12

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

 #3
20250149326
2025-05-08

Method and System for Torsional Optical Manipulation to Remove Particles from Semiconductor Surfaces

 #4
20240404852
2024-12-05

PROCESSING METHOD AND PROCESSING SYSTEM

 #5
20240379345
2024-11-14

APPARATUS FOR CLEANING A SEMICONDUCTOR FABRICATION CHAMBER

 #6
20240105557
2024-03-28

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTRUDED CONTACTS

 #7
20230395366
2023-12-07

DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

 #8
20210343552
2021-11-04

Dry cleaning apparatus and dry cleaning method

 #9
20210313173
2021-10-07

Subnanometer-level light-based substrate cleaning mechanism

 #10
20210296119
2021-09-23

Substrate processing system and substrate processing method

 #11
20210249616
2021-08-12

Method of fabricating a display apparatus

 #12
20210013031
2021-01-14

WAFER TREATMENT APPARATUS AND METHOD FOR TREATING WAFER

 #13
20210001429
2021-01-07

METHODS OF USING LASER ENERGY TO REMOVE PARTICLES FROM A SURFACE

 #14
20200395210
2020-12-17

Method and apparatus for treating substrate

 #15
20200357637
2020-11-12

Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate

 #16
20200350156
2020-11-05

Apparatus and system for treating substrate

 #17
20200219722
2020-07-09

Subnanometer-level light-based substrate cleaning mechanism

 #18
20200083063
2020-03-12

Dry cleaning apparatus and dry cleaning method

 #19
20190287841
2019-09-19

Dual side de-bonding in component carriers using photoablation

 #20
20180323128
2018-11-08

Semiconductor package with electromagnetic interference shielding

 #21
20170326866
2017-11-16

De-bonding and cleaning process and system

 #22
20170309475
2017-10-26

Electrode manufacturing method for improving battery capacity and electrode manufactured thereby

 #23
20170117139
2017-04-27

System and method for removing dielectric material

 #24
20170036433
2017-02-09

De-bonding and cleaning process and system

 #25
20170025269
2017-01-26

Wafer processing method

 #26
20120247504
2012-10-04

System and Method for Sub-micron Level Cleaning of Surfaces

 #27
20110053349
2011-03-03

Application of millisecond heating source for surface treatment

 #28
20060051951
2006-03-09

Method of clearing electrical contact pads in thin film sealed OLED devices