H01L21/02109 - CPC Classification Index

ClassID:

207017 ⎘

H01L21/02109 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates

Sub-classes:

H01L21/02112 » {characterised by the material of the layer} 369
H01L21/022 » {the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides } 1,4K
H01L21/02203 » {the layer being porous} 776
H01L21/02205 » {the layer being characterised by the precursor material for deposition} 681

Recent Application in this class:

20240170342

2024-05-23

TRANSISTOR AND METHOD FOR FABRICATING THE SAME

20240087903

2024-03-14

PACKAGE STRUCTURE

20230230924

2023-07-20

METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION STRUCTURES

20220223424

2022-07-14

Package structure and method of manufacturing the same

20220068817

2022-03-03

Substrate with thermal vias and sinter-bonded thermal dissipation structure

20210280412

2021-09-09

Semiconductor component and method for fabricating the same

20210104398

2021-04-08

Planarizing process and composition

20200357647

2020-11-12

Shaped gate caps in spacer-lined openings

20200343096

2020-10-29

Package structure and method of manufacturing the same

#10

20200258871

2020-08-13

Package stack structure and method for manufacturing the same

#11

20190326304

2019-10-24

Memory device and manufacturing method thereof

#12

20190325924

2019-10-24

Differential type sensing circuit with differential input and output terminal pair

#13

20190157256

2019-05-23

Fully-printed stretchable thin-film transistors and integrated logic circuits

#14

20190148138

2019-05-16

Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

#15

20190139896

2019-05-09

Package structure and method of manufacturing the same

#16

20190051863

2019-02-14

Fabrication of multilayer nanograting structures

#17

20180350818

2018-12-06

Semiconductor device including contact structure

#18

20180337201

2018-11-22

Method of fabricating electrodes, method of fabricating thin film transistor, method of fabricating array substrate, thin film transistor, array substrate, and display apparatus

#19

20180294414

2018-10-11

QLED device and manufacturing method thereof, QLED display panel and QLED display device

#20

20180288886

2018-10-04

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

#21

20180277370

2018-09-27

Hybrid carbon hardmask for lateral hardmask recess reduction

#22

20180149809

2018-05-31

Method for producing semiconductor device

#23

20180069074

2018-03-08

Method for oxidizing a substrate surface using oxygen

#24

20180050904

2018-02-22

Fabrication of multilayer nanograting structures

#25

20170207088

2017-07-20

Hybrid carbon hardmask for lateral hardmask recess reduction

#26

20170110588

2017-04-20

Semiconductor device and method for manufacturing the same

#27

20160284541

2016-09-29

Deposition of metal dielectric film for hardmasks

#28

20160155642

2016-06-02

Deposited material and method of formation

#29

20160049295

2016-02-18

Method for oxidizing a substrate surface using oxygen

#30

20150364318

2015-12-17

Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium

#31

20150357273

2015-12-10

Semiconductor substrate, eletronic device and method for manufacturing the same

#32

20150243602

2015-08-27

Sputter and surface modification etch processing for metal patterning in integrated circuits

#33

20150236111

2015-08-20

METHODS OF MANUFACTURING NON-VOLATILE MEMORY DEVICES

#34

20150214096

2015-07-30

Sinker with a reduced width

#35

20150179559

2015-06-25

Forming functionalized carrier structures with coreless packages

#36

20150140831

2015-05-21

Crack control for substrate separation

#37

20150118863

2015-04-30

METHODS AND APPARATUS FOR FORMING FLOWABLE DIELECTRIC FILMS HAVING LOW POROSITY

#38

20150118862

2015-04-30

Treatment for flowable dielectric deposition on substrate surfaces

#39

20150011074

2015-01-08

METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING WRAPPING LAYER

#40

20140342573

2014-11-20

Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium

#41

20140315389

2014-10-23

Crack control for substrate separation

#42

20140291745

2014-10-02

Deposited material and method of formation

#43

20140239459

2014-08-28

Method for producing mechanically flexible silicon substrate

#44

20140235069

2014-08-21

MULTI-PLENUM SHOWERHEAD WITH TEMPERATURE CONTROL

#45

20140235058

2014-08-21

Method for forming a power semiconductor device

#46

20140206202

2014-07-24

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

#47

20140186773

2014-07-03

Coating material and method for photolithography

#48

20140151749

2014-06-05

High electron mobility transistor and method of manufacturing the same

#49

20140110708

2014-04-24

Semiconductor device and method for manufacturing the same

#50

20140004711

2014-01-02

Method for manufacturing semiconductor device

#51

20140001647

2014-01-02

Flip-chip electronic device and production method thereof

#52

20140001596

2014-01-02

Sinker with a reduced width

#53

20130214331

2013-08-22

Method for treating a substrate and a substrate

#54

20130093048

2013-04-18

Deposited material and method of formation

#55

20130075930

2013-03-28

Semiconductor substrate, electronic device and method for manufacturing the same

#56

20120286355

2012-11-15

Power semiconductor device and a method for forming a semiconductor device

#57

20120132982

2012-05-31

Non-Volatile Memory Devices

#58

20110254124

2011-10-20

Forming functionalized carrier structures with coreless packages

#59

20100330812

2010-12-30

Method for manufacturing semiconductor device

#60

20060207965

2006-09-21

Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits

#61

15811298

2018-11-27

Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

#62

14332690

2015-12-22

Devices employing semiconductor die having hydrophobic coatings, and related cooling methods