207040 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
Sub-classes:METHOD FOR OXIDISING A SILICON LAYER
#2SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL
#3METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS
#4FILM FORMING METHOD AND FILM FORMING APPARATUS
#5Semiconductor Processing Using a Two-Dimensional Polymer
#6DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#7FILM FORMING METHOD AND FILM FORMING APPARATUS
#8INTEGRATED METHOD AND TOOL FOR HIGH QUALITY SELECTIVE SILICON NITRIDE DEPOSITION
#9METHOD AND APPARATUS FOR FILLING A GAP
#10Semiconductor structure and related methods
#11Method and apparatus for filling a gap
#12Dielectric layer, interconnection structure using the same, and manufacturing method thereof
#13Method and Apparatus for Selective Deposition of Dielectric Films
#14Method of forming a FinFET device by implantation through capping layer
#15PERC solar cell capable of improving photoelectric conversion efficiency and preparation method thereof
#16Dielectric layer, interconnection structure using the same, and manufacturing method thereof
#17Deposition and etch processes of chromium-containing thin films for semiconductor manufacturing
#18Mitigation of hot carrier damage in field-effect transistors
#19Methods to improve front-side process uniformity by back-side metallization
#20Integrated cluster tool for selective area deposition
#21Uniform gate dielectric for DRAM device
#22Capacitor including electrode and dielectric layer each containing silicon, and method for manufacturing capacitor
#23Method for manufacturing a semiconductor device and film deposition apparatus
#24ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
#25Engineering of ferroelectric materials in semiconductor devices by surface potential modulation
#26Gallium nitride based semiconductor device and manufacturing method of gallium nitride based semiconductor device
#27Selective deposition of dielectric materials
#28Techniques for filling a structure using selective surface modification
#29Nanolaminate structure, semiconductor device and method of forming nanolaminate structure
#30Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware components
#31Method and structure for gap filling improvement
#32Method of evaluating semiconductor substrate and method of manufacturing semiconductor substrate
#33Monolayer film mediated precision film deposition
#34INP-based transistor fabrication
#35Self-limiting and saturating chemical vapor deposition of a silicon bilayer and ALD
#36Methods of modulating the morphology of epitaxial semiconductor material
#37Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
#38Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
#39Method of manufacturing semiconductor device
#40Dislocation SMT for FinFET device
#41Self-limiting and saturating chemical vapor deposition of a silicon bilayer and ALD
#42Nitridation on HDP oxide before high-k deposition to prevent oxygen ingress
#43Nitridation on HDP oxide before high-k deposition to prevent oxygen ingress
#44Method of selective gas phase film deposition on a substrate by modifying the surface using hydrogen plasma
#45Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
#46Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
#47Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
#48Method for forming a semiconductor device
#49Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
#50Na dosing control method
#51Film-forming method for forming silicon oxide film on tungsten film or tungsten oxide film
#52Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
#53VERTICAL HEAT TREATMENT APPARATUS, METHOD OF OPERATING VERTICAL HEAT TREATMENT APPARATUS, AND STORAGE MEDIUM
#54Manufacturing method for semiconductor device
#55Method and structure for gap filling improvement
#56Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming
#57A-Si seasoning effect to improve SiN run-to-run uniformity
#58Layer deposition on III-V semiconductors
#59Methods for masking and applying protective coatings to electronic assemblies
#60Flowable oxide film with tunable wet etch rate
#61FILM-FORMING METHOD FOR FORMING SILICON OXIDE FILM ON TUNGSTEN FILM OR TUNGSTEN OXIDE FILM
#62THIN FILM DIELECTRIC LAYER FORMATION
#63Patterned thin film dielectric stack formation
#64Flowable oxide film with tunable wet etch rate
#65DISLOCATION SMT FOR FINFET DEVICE
#66High-K heterostructure
#67Systems and methods for improving front-side process uniformity by back-side metallization
#68InP-based transistor fabrication
#69Modifying growth rate of a device layer
#70FILM-FORMING METHOD AND FILM-FORMING APPARATUS FOR FORMING SILICON OXIDE FILM ON TUNGSTEN FILM OR TUNGSTEN OXIDE FILM
#71Method for copper hillock reduction
#72a-Si seasoning effect to improve SiN run-to-run uniformity
#73Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating
#74High-k heterostructure
#75METHOD OF FORMING A SEMICONDUCTOR DEVICE
#76MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
#77InP-based transistor fabrication
#78INTEGRATED DEVICE
#79Semiconductor substrate and method for production thereof
#80METHOD OF FABRICATING GATE DIELECTRIC LAYER
#81Manufacturing method for SIMOX substrate
#82High-performance field effect transistors with self-assembled nanodielectrics
#83Semiconductor device and method of manufacturing the same
#84PLANAR ULTRA-THIN SEMICONDUCTOR-ON-INSULATOR CHANNEL MOSFET WITH EMBEDDED SOURCE/DRAIN
#85Compound semiconductor device and its manufacture
#86Method of manufacturing a semiconductor device by forming separation regions which do not extend to the peripherals of a substrate, and structures thereof
#87Manufacturing method of gate oxidation films
#88Method of making a high quality thin dielectric layer
#89Method for forming a (TaO)(TiO)N dielectric layer in a semiconductor device
#90Method for forming bottle shaped trench
#91Method for manufacturing semiconductor device
#92Semiconductor substrate and method for production thereof
#93Semiconductor device and method for fabricating the same
#94Method to improve adhesion of dielectric films in damascene interconnects
#95Methods for forming a thin film on an integrated circuit device by sequentially providing energies to activate the reactants