207166 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials Joining of semiconductor bodies for junction formation
Sub-classes:BONDING APPARATUS AND BONDING METHOD
#2WAFER PROCESSING METHOD
#3SEMICONDUCTOR MEMORY DEVICE
#4MANUFACTURING PROCESS COMPRISING AN ASSEMBLY OF SEMICONDUCTOR WAFERS AND CORRESPONDING SEMICONDUCTOR DEVICE
#5SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
#6METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A SUBSTRATE
#7METHODS FOR ENABLING CHEMICAL MECHANICAL POLISHING AND BONDING OF ALUMINUM-CONTAINING MATERIALS
#8PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTAL MATERIAL
#9BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
#10STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS
#11COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
#12METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS
#13TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS
#14BONDED WAFER PROCESSING METHOD
#15PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
#16SEMICONDUCTOR MEMORY DEVICE
#17PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
#18METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#19SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR BONDING
#20WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRUCTURE
#21Semiconductor memory device having a contact plug electrically connected to an interconnection through a narrower via
#22METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
#23SUBSTRATE FOR AN ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME
#24Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers
#25Bonding method, bonding device, and holding member
#26BONDING METHOD AND BONDING DEVICE
#27Semiconductor memory device including integrated control circuit and solid-state drive controller
#28Semiconductor device having a pad proximate to a step structure section of an array chip
#29Pseudo-substrate with improved efficiency of usage of single crystal material
#30Method of forming and transferring thin film using SOI wafer and heat treatment process
#31Semiconductor module and power conversion device
#32SiC composite substrate and method for manufacturing same
#33Three-dimensionally stretchable single crystalline semiconductor membrane
#34METHODS FOR PROCESSING A SUBSTRATE
#35System and method for a transducer in an EWLB package
#36Semiconductor substrate structure and power semiconductor device
#37Semiconductor memory device having an array chip bonded to a circuit chip by a bonding metal
#38Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuit
#39Bonding method, bonding device, and holding member
#40Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package
#41Method for hybrid wafer-to-wafer bonding
#42System and method for a transducer in an eWLB package
#43SEMICONDUCTOR MEMORY DEVICE
#44Semiconductor memory device having bonding metal between an array chip and a circuit chip
#45SiC composite substrate and method for manufacturing same
#46Semiconductor device and method for fabricating the same
#47III-V semiconductor diode
#48III-V semiconductor diode
#49Wafer stacking to form a multi-wafer-bonded structure
#50Metal-metal direct bonding method
#51DIFFUSION TOLERANT III-V SEMICONDUCTOR HETEROSTRUCTURES AND DEVICES INCLUDING THE SAME
#52Solid-state wafer bonding of functional materials on substrates and self-aligned contacts
#53System and method for a transducer in an eWLB package
#54Semiconductor devices with cavities
#55Quasi-vertical diode with integrated ohmic contact base and related method thereof
#56Process for producing a structure by assembling at least two elements by direct adhesive bonding
#57Method for manufacturing semiconductor device using high speed epitaxial lift-off and template for III-V direct growth and semiconductor device manufactured using the same
#58Wafer structure for electronic integrated circuit manufacturing
#59Process for transferring layers
#60Semiconductor memory device with electrode connecting to circuit chip through memory array chip
#61Method for carrying out a conductive direct metal bonding
#62Method of formation of a TI-IGBT
#63Apparatus for molecular adhesion bonding with compensation for radial misalignment
#64Graphene-on-semiconductor substrates for analog electronics
#65Pseudo-substrate with improved efficiency of usage of single crystal material
#66Method of joining semiconductor substrate
#67Semiconductor Device and Method of Forming Shallow P-N Junction with Sealed Trench Termination
#68Semiconductor device and method for forming the same
#69CMOS COMPATIBLE WAFER BONDING LAYER AND PROCESS
#70Systems and methods for post-bonding wafer edge seal
#71Method for bonding of group III-nitride device-on-silicon and devices obtained thereof
#72Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#73Adhesives including a filler material and related methods
#74Strain relaxation using metal materials and related structures
#75COMPRESSIVELY STRAINED SOI SUBSTRATE
#76Semiconductor device and method for fabricating the same
#77SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND BASE MEMBER FOR SEMICONDUCTOR DEVICE FORMATION
#78SOI substrate, method for manufacturing SOI substrate, and method for manufacturing semiconductor device
#79Bonding system and bonding method
#80METHOD FOR MANUFACTURING SOI WAFER
#81Laser-initiated exfoliation of group III-nitride films and applications for layer transfer and patterning
#82Silicon-on-insulator substrate with built-in substrate junction
#83Method for creating semiconductor junctions with reduced contact resistance
#84Substrate and semiconductor device
#85Method for molecular adhesion bonding with compensation for radial misalignment
#86Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates
#87Method for Forming Isolation Trenches in Micro-Bump Interconnect Structures and Devices Obtained Thereof
#88Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen
#89ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME
#90Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
#91Wafer structure for electronic integrated circuit manufacturing
#92Metallic carrier for layer transfer and methods for forming the same
#93Strain relaxation using metal materials and related structures
#94METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#95Method for molecular adhesion bonding with compensation for radial misalignment
#96Semiconductor on glass substrate with stiffening layer and process of making the same
#97Formation of thin layers of semiconductor materials
#98Silicon-on-insulator substrate with built-in substrate junction
#99Substrate structures including buried wiring, semiconductor devices including substrate structures, and method of fabricating the same
#100Silicon-on-insulator substrate with built-in substrate junction
#101Semiconductor-on-diamond devices and associated methods
#102Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#103Process for bonding and electrically connecting microsystems integrated in several distinct substrates
#104Method for manufacturing compound semiconductor substrate
#105Transient liquid phase bonding to cold-worked surfaces
#106Wafer to wafer bonding techniques for III-V wafers and CMOS wafers
#107Low stress bonding of silicon or germanium parts
#108Process for fabrication of superconducting vias for electrical connection to groundplane in cryogenic detectors
#109Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices