207256 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups, , , and with or without impurities, e.g. doping materials; Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups - involving the application of mechanical vibrations, e.g. ultrasonic vibrations
ULTRASONIC BONDING FOR PROCESS CHAMBER COMPONENTS
#2THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND CIRCUIT
#3SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#4SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
#5Spin coating process and apparatus with ultrasonic viscosity control
#6Method for transferring micro device
#7Method for transferring micro device
#8Systems and methods for bonding semiconductor elements
#9Method and system of flattening a surface formed by sealant of packaging cover plate, and packaging method
#10Megasonic multifrequency apparatus with matched transducer
#11Megasonic multifrequency apparatus with matched transducers and mounting plate