H01L21/461 - CPC Classification Index

ClassID:

207258 ⎘

H01L21/461 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups, , , and with or without impurities, e.g. doping materials; Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Sub-classes:

H01L21/463 » Mechanical treatment, e.g. grinding, ultrasonic treatment 84
H01L21/465 » Chemical or electrical treatment, e.g. electrolytic etching 310
H01L21/469 » to form insulating layers thereon, e.g. for masking or by using photolithographic techniques ; After-treatment of these layers 33
H01L21/4763 » Deposition of non-insulating, e.g. conductive -, resistive -, layers on insulating layers; After-treatment of these layers 50

Recent Application in this class:

20260029758

2026-01-29

POLISHING SEMICONDUCTOR WAFERS USING CAUSAL MODELS

20250364334

2025-11-27

ABNORMALITY DETECTION APPARATUS AND ABNORMALITY DETECTION METHOD

20250324639

2025-10-16

FETS AND METHODS OF FORMING FETS

20250149385

2025-05-08

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

20240387711

2024-11-21

Devices Having a Semiconductor Material That Is Semimetal in Bulk and Methods of Forming the Same

20240186289

2024-06-06

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

20230268194

2023-08-24

SUBSTRATE PROCESSING APPARATUS, AND WATERPROOFING DEVICE FOR ACOUSTIC SENSOR

20230215935

2023-07-06

FETS AND METHODS OF FORMING FETS

20220416114

2022-12-29

Method of manufacturing semiconductor structure

#10

20220246474

2022-08-04

Method for manufacturing semiconductor device

#11

20220238704

2022-07-28

Devices having a semiconductor material that is semimetal in bulk and methods of forming the same

#12

20220146991

2022-05-12

POLISHING SEMICONDUCTOR WAFERS USING CAUSAL MODELS

#13

20220097199

2022-03-31

METHOD AND DEVICE OF CHEMICAL MECHANICAL POLISHING

#14

20220059344

2022-02-24

Substrate cleaning solution, and using the same, method for manufacturing cleaned substrate and method for manufacturing device

#15

20210249277

2021-08-12

Substrate processing method and substrate processing apparatus

#16

20210102093

2021-04-08

USE OF A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR POLISHING OF COBALT COMPRISING SUBSTRATES

#17

20210057270

2021-02-25

Semiconductor wafer with low defect count and method for manufacturing thereof

#18

20210046576

2021-02-18

Metal analyzing plasma CNC cutting machine and associated methods

#19

20210043756

2021-02-11

Devices having a semiconductor material that is semimetal in bulk and methods of forming the same

#20

20200365417

2020-11-19

Substrate processing apparatus

#21

20200321221

2020-10-08

Using absolute Z-height values for synergy between tools

#22

20200255713

2020-08-13

Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

#23

20200227553

2020-07-16

Semiconductor device including SGT

#24

20200135448

2020-04-30

Semiconductor manufacturing apparatus and semiconductor manufacturing method

#25

20200119193

2020-04-16

Method for producing a pillar-shaped semiconductor device

#26

20200052098

2020-02-13

FETs and methods of forming FETs

#27

20200027963

2020-01-23

Semiconductor device and manufacturing method thereof

#28

20200006535

2020-01-02

Devices having a semiconductor material that is semimetal in bulk and methods of forming the same

#29

20190359868

2019-11-28

Composite particles, method of refining and use thereof

#30

20190351503

2019-11-21

Metal analyzing plasma CNC cutting machine and associated methods

#31

20190259876

2019-08-22

Semiconductor device including SGT

#32

20190161645

2019-05-30

Chemical mechanical polishing slurry composition for polishing polycrystalline silicon film

#33

20190140070

2019-05-09

Semiconductor device and manufacturing method thereof

#34

20190109217

2019-04-11

FinFET having a non-faceted top surface portion for a source/drain region

#35

20190085206

2019-03-21

Chemical mechanical polishing method for cobalt

#36

20190051523

2019-02-14

Cut first self-aligned litho-etch patterning

#37

20180350923

2018-12-06

Transistor

#38

20180319205

2018-11-08

Electrostatic chuck optimized for refurbishment

#39

20180294378

2018-10-11

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

#40

20180254196

2018-09-06

Polishing method, polishing apparatus, and substrate processing system

#41

20180230333

2018-08-16

Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates

#42

20180197973

2018-07-12

Manufacturing method of top gate thin-film transistor

#43

20180197964

2018-07-12

Semiconductor device including SGT and method for producing the same

#44

20180190799

2018-07-05

Devices having a semiconductor material that is semimetal in bulk and methods of forming the same

#45

20180166598

2018-06-14

High performance solar cells, arrays and manufacturing processes therefor

#46

20180154475

2018-06-07

Metal analyzing plasma CNC cutting machine and associated methods

#47

20180151703

2018-05-31

FETS and methods of forming FETS

#48

20180127618

2018-05-10

Buffered slurry formulation for cobalt CMP

#49

20180082860

2018-03-22

Substrate processing apparatus

#50

20170369743

2017-12-28

Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium

#51

20170369741

2017-12-28

Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates

#52

20170362464

2017-12-21

Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates

#53

20170330765

2017-11-16

Semiconductor fabrication method including non-uniform cover layer

#54

20170294311

2017-10-12

Cut first self-aligned litho-etch patterning

#55

20170283673

2017-10-05

Composite particles, method of refining and use thereof

#56

20170221707

2017-08-03

Semiconductor device and method for manufacturing thereof

#57

20170186911

2017-06-29

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

#58

20170140986

2017-05-18

Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices

#59

20170125554

2017-05-04

Devices having a semiconductor material that is semimetal in bulk and methods of forming the same

#60

20160276343

2016-09-22

Field-effect transistors having transition metal dichalcogenide channels and methods of manufacture

#61

20160265120

2016-09-15

Method of fabricating structures, starting from material rods

#62

20160200943

2016-07-14

Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

#63

20160096155

2016-04-07

Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer

#64

20160079203

2016-03-17

Wafer process for molded chip scale package (MCSP) with thick backside metallization

#65

20160043227

2016-02-11

THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF

#66

20150318309

2015-11-05

Thin film transistor, method for manufacturing the same, and device comprising the same

#67

20150279664

2015-10-01

METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION GAPS

#68

20150206932

2015-07-23

Thin film transistor, method of manufacturing thin film transistor and flat panel display having the thin film transistor

#69

20150187965

2015-07-02

Process for the production of solar cells having a local back surface field (LBSF)

#70

20150175845

2015-06-25

Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant

#71

20150170967

2015-06-18

Methods for Substrate and Device Fabrications

#72

20150159050

2015-06-11

Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives

#73

20150041803

2015-02-12

Semiconductor device and method for manufacturing thereof

#74

20140315350

2014-10-23

Wafer process for molded chip scale package (MCSP) with thick backside metallization

#75

20140295616

2014-10-02

Semiconductor device and method for manufacturing semiconductor device

#76

20140263176

2014-09-18

Electrostatic chuck refurbishment

#77

20140256144

2014-09-11

Method for removing semiconductor fins using alternating masks

#78

20140141612

2014-05-22

Polishing composition, polishing method using same, and method for producing semiconductor device

#79

20140138800

2014-05-22

Small pitch patterns and fabrication method

#80

20140103547

2014-04-17

Alignment key of semiconductor device and method of fabricating the same

#81

20130248816

2013-09-26

Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabrication

#82

20130244436

2013-09-19

Masking techniques and contact imprint reticles for dense semiconductor fabrication

#83

20130221495

2013-08-29

Oxide microchannel with controllable diameter

#84

20130136928

2013-05-30

Fluorine-based surface treating agent for vapor deposition and article finished with the surface treating agent by vapor deposition

#85

20130092928

2013-04-18

Semiconductor device and method for manufacturing semiconductor device

#86

20130081763

2013-04-04

CEILING PLATE AND PLASMA PROCESS APPARATUS

#87

20100258966

2010-10-14

Masking techniques and contact imprint reticles for dense semiconductor fabrication

#88

20100104806

2010-04-29

Method for polishing both sides of a semiconductor wafer

#89

20100032094

2010-02-11

Ceiling plate and plasma process apparatus

#90

20080308527

2008-12-18

Advanced mask patterning with patterning layer

#91

20080200100

2008-08-21

Substrate processing apparatus

#92

20080197488

2008-08-21

Bowed wafer hybridization compensation

#93

20080070418

2008-03-20

Substrate processing apparatus and substrate processing method

#94

20070281219

2007-12-06

Masking techniques and contact imprint reticles for dense semiconductor fabrication

#95

20060240675

2006-10-26

Removal of silicon oxycarbide from substrates

#96

20060215135

2006-09-28

Advanced mask patterning with patterning layer

#97

20060051966

2006-03-09

In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber

#98