207270 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -; Conductive parts for containers, e.g. caps
INTEGRATED CIRCUIT DEVICE HAVING A TWO-PHASE THERMAL MANAGEMENT DEVICE
#2Semiconductor Device and Method for Partial EMI Shielding
#3REINFORCED STRUCTURE WITH CAPPING LAYER
#4ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE MANUFACTURING METHOD
#5PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
#6PACKAGE STRUCTURE WITH PROTECTIVE LID
#7DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#8SEMICONDUCTOR PACKAGE
#93D DIE STACKING WITH HYBRID BONDING AND THROUGH DIELECTRIC VIA STRUCTURES
#10METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
#11ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#12INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#13SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THEREFOR
#14Packaged Integrated Circuit Device Having A Deformable Lid, And Associated Methods
#15SEMICONDUCTOR DEVICE
#16PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FINS AND METHODS OF FORMING THE SAME
#17PACKAGE STRUCTURE
#18SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME
#19STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
#20EMBEDDED SEMICONDUCTOR DEVICE
#21Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
#22PACKAGE STRUCTURE WITH PROTECTIVE LID
#23SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#24OPTICAL DEVICE PACKAGE
#25MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#26INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED ARTICLE
#27PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
#28METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
#29FLOATING HEAT SPREADER WITH GUIDED MECHANISM
#30PACKAGE STRUCTURE WITH PROTECTIVE LID
#31PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER
#32INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR FOR RADIOFREQUENCY POWER DEVICES AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
#33Semiconductor package including shielding cover that covers molded body
#34SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#35SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORMING THE SAME
#36POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR ASSEMBLING THE SAME
#37WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
#38PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER ON TOP OF ELECTRONIC COMPONENT
#39Integrated Circuit Packages and Methods of Forming the Same
#40Semiconductor Device and Method for Partial EMI Shielding
#41PACKAGE STRUCTURE
#42ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#43ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
#44SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#45SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#46SEMICONDUCTOR DEVICE
#47REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE SAME
#48Package structure with protective lid
#49Electronic device packages with internal moisture barriers
#50DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
#51ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#52SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#53SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#54Ceramic semiconductor device package with copper tungsten conductive layers
#55SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE
#56POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE
#57SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#58Warpage Compensation for BGA Package
#59SEMICONDUCTOR APPARATUS
#60Semiconductor device having an insulating sheet and a conductive film, and method of manufacturing the same
#61SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#62Waferscale physiological characteristic sensor package with integrated wireless transmitter
#63Semiconductor package and manufacturing method thereof
#64Package structures and method for forming the same
#65DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#66Semiconductor module and manufacturing method therefor
#67SEMICONDUCTOR APPARATUS
#68Integrated passive device (IPD) components and a package and processes implementing the same
#69FARADAY CAGE PLASTIC CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME
#70Electronics unit with integrated metallic pattern
#71Semiconductor package structure and method for forming the same
#72Package structures and method for forming the same
#73Power semiconductor module arrangement
#74Structure and formation method of chip package with protective lid
#75Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device
#76Semiconductor device and manufacturing method thereof
#77Embedded lid for low cost and improved thermal performance
#78Power semiconductor module with injection-molded or laminated cooler assembly
#79Structure and formation method of chip package with protective lid
#80Power semiconductor module having a current sensor module fixed with potting material
#81Optical device package with compatible lid and carrier
#82Power module
#83FORMATION METHOD OF CHIP PACKAGE
#84Semiconductor apparatus and manufacturing method of semiconductor apparatus
#85Packaged RF power device with PCB routing outside protective member
#86Package structure and measurement method for the package structure
#87Manufacturing method of housing for semiconductor device
#88Electronic device packages with internal moisture barriers
#89Power module
#90Thermal transfer structures for semiconductor die assemblies
#91Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof
#92Through-hole sealing structure
#93Semiconductor device
#94Semiconductor module and method for manufacturing the same
#95Case with a plurality of pair case components for a semiconductor device
#96Radio frequency package implementing a window frame with edge plating and processes of implementing the same
#97Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure
#98Electronics unit with integrated metallic pattern
#99Packaged die and assembling method
#100Antenna Module
#101Radio-frequency device comprising semiconductor device and waveguide component
#102Radar component package and method for manufacturing the same
#103Heterogenous integration for RF, microwave and MM wave systems in photoactive glass substrates
#104Optical device package
#105Waferscale physiological characteristic sensor package with integrated wireless transmitter
#106Semiconductor package including sheilding cover that covers molded body
#107Semiconductor Device and Method
#108Device thermal management
#109Method of manufacturing semiconductor device
#110Semiconductor device and method of manufacture
#111Power semiconductor module arrangement and method for producing the same
#112Package structure and manufacturing method thereof
#113Semiconductor device and method for manufacturing semiconductor device
#114Semiconductor device and semiconductor device manufacturing method
#115Semiconductor device manufacturing method and semiconductor device
#116Semiconductor package
#117Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body
#118Semiconductor device packages and methods of manufacturing the same
#119Power module and method for fabricating the same, and power conversion device
#120Semiconductor device manufacturing method and semiconductor device
#121Semiconductor device
#122Method of making semiconductor device package including conformal metal cap contacting each semiconductor die
#123Enclosure for an electronic component
#124Structure and formation method of chip package with shielding structure
#125Semiconductor device, control device, and method for manufacturing semiconductor device
#126Fabrication method of semiconductor package including shielding wall and cover
#127Gas sensor module and method of manufacturing gas sensor module
#128Package structure with multiple substrates
#129Proximity coupling interconnect packaging systems and methods
#130Semiconductor device and method of manufacturing the same
#131Method for manufacturing hermetic sealing lid member
#132PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES
#133Semiconductor device and manufacturing method thereof
#134Device package with reduced radio frequency losses
#135III-V CHIP-SCALE SMT PACKAGE
#136Method of forming a semiconductor package
#137Method of manufacturing a semiconductor device
#138Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#139Wafer storage container
#140Semiconductor packages
#141Semiconductor device and method for manufacturing the same
#142Semiconductor device and method for manufacturing semiconductor device
#143Power semiconductor module with partially coated power terminals and method of manufacturing thereof
#144Molded air cavity packages and methods for the production thereof
#145Customized module lid
#146MANUFACTURING PROCESS FOR FABRICATION OF A WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE
#147Waferscale physiological characteristic sensor package with integrated wireless transmitter
#148Semiconductor device and method of manufacture
#149Molded air cavity packages and methods for the production thereof
#150Molded air cavity packages and methods for the production thereof
#151Molded air cavity packages and methods for the production thereof
#152Phase changing on-chip thermal heat sink
#153Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
#154Proximity coupling interconnect packaging systems and methods
#155Semiconductor package device and method of manufacturing the same
#156Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing package
#157Radio frequency circuit, wireless communication device, and method of manufacturing radio frequency circuit
#158Semiconductor device and method of manufacturing the semiconductor device
#159Semiconductor device and method of manufacturing semiconductor device
#160Electronic component mounting board and electronic device
#161Semiconductor device with heat dissipation and method of making same
#162Lid attach optimization to limit electronic package warpage
#163Electronic package and method for fabricating the same
#164Semiconductor device and its manufacturing method
#165COWOS structures and method of forming the same
#166Semiconductor device and method of manufacturing semiconductor device
#167Thermal interface material on package
#168Phase changing on-chip thermal heat sink
#169Case, semiconductor device and manufacturing method of case
#170Semiconductor module cooling system
#171Method of producing a housing cover, method of producing an optoelectronic component, and optoelectronic component
#172Semiconductor package and method of forming the same
#173Resin molding and sensor device
#174Semiconductor device
#175Chip package structure and manufacturing method thereof
#176Chip package structure and manufacturing method thereof
#177Semiconductor device
#178Electronic component storage substrate and housing package
#179Electrolytic seal
#180Electrolytic seal
#181Air cavity packages and methods for the production thereof
#182Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case
#183Semiconductor packages and methods of fabricating the same
#184Electronic element package and method for manufacturing the same
#1853D printed hermetic package assembly and method
#186Vertical shielding and interconnect for SIP modules
#187Thermal interface material on package
#188Remapped packaged extracted die with 3D printed bond connections
#189Thermal transfer structures for semiconductor die assemblies
#190Semiconductor device
#191Hermetic sealing lid member
#192Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same
#193WAFER LEVEL PACKAGING USING A TRANSFERABLE STRUCTURE
#194Board-to-board contactless connectors and methods for the assembly thereof
#195Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#196Semiconductor device having a resin case with a notch groove
#197Electronic element package and method for manufacturing the same
#198Packaging for high power integrated circuits and infrared emitter arrays
#199LASER MANUFACTURING OF SOLDER PREFORMS
#200Ceramic combo lid with selective and edge metallizations
#201Double-sided package module and substrate strip
#202Semiconductor device and method of manufacture
#203Cavity package with pre-molded substrate
#204Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
#205Chip package and method for forming the same
#206CAPILLARY BLOCK
#207Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement
#208SEMICONDUCTOR DEVICE
#209Molded composite enclosure for integrated circuit assembly
#210Semiconductor package system and related methods
#211Lid attach optimization to limit electronic package warpage
#212Power semiconductor module and manufacturing method of power semiconductor module
#213Phase changing on-chip thermal heat sink
#214Use of an external getter to reduce package pressure
#215Method for producing a power semiconductor module
#216Proximity coupling of interconnect packaging systems and methods
#217Semiconductor device package including conformal metal cap contacting each semiconductor die
#218Method of manufacturing a cooler for semiconductor modules
#219ELECTRIC MODULE COMPRISING A TENSIONING DEVICE
#220Method for Cleaning Hermetic Semiconductor Packages
#221Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
#222Method for manufacturing shield cans for blocking electromagnetic waves
#223Package module and method of fabricating the same
#224Ceramic package with brazing material near seal member
#225Functionalized carbon nanotube sensors, method of making same and uses thereof
#226Low profile, highly configurable, current sharing paralleled wide band gap power device power module
#227Package assembly
#228Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
#229Wafer level fan-out with electromagnetic shielding
#230Embedded electronic packaging and associated methods
#231Phase changing on-chip thermal heat sink
#232Power module and method for manufacturing the same
#233VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES
#234Molded composite enclosure for integrated circuit assembly
#2353D shielding case and methods for forming the same
#236Semiconductor device and method for manufacturing same
#237Optoelectronic light-emitting component and leadframe assemblage
#238Semiconductor device and its manufacturing method
#239Electronic module and method of manufacturing the same
#240Integrated circuit with printed bond connections
#241Manufacturing method of semiconductor package
#242Customized module lid
#243INTEGRATED CIRCUIT PACKAGE
#244Phase changing on-chip thermal heat sink
#245Power semiconductor module and method for producing a power semiconductor module
#246Method of manufacturing semiconductor device
#247Electronic module and method for producing an electronic module
#248Semiconductor package with structures for cooling fluid retention
#249Phase changing on-chip thermal heat sink
#250Thermal interface material on package
#251Thermal interface material on package
#252Thermal interface material on package
#253Thermal interface material on package
#254Thermal interface material on package
#255Thermal interface material on package
#256Package and method for fabricating package
#257Method of making a ceramic combo lid with selective and edge metallizations
#258Method for forming a metal cap in a semiconductor memory device
#259Integrated electronic device including an interposer structure and a method for fabricating the same
#260Radio frequency semiconductor device package and method for manufacturing same, and radio frequency semiconductor device
#261Phase changing on-chip thermal heat sink
#262Stiffener with embedded passive components
#263SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#264Cavity package with pre-molded substrate
#265Phase changing on-chip thermal heat sink
#266Phase changing on-chip thermal heat sink
#267SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD
#268Method and apparatus for printing integrated circuit bond connections
#269Phase changing on-chip thermal heat sink
#270Electronic device and method of manufacturing the same
#271SELECTIVE PLATING OF FRAME LID ASSEMBLY
#272Method of Producing Covers for Electronics
#273SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES
#274Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap
#275Power semiconductor module method
#276Power semiconductor module
#277Manufacturing Method for Producing Wick Structures of a Vapor Chamber by Using a Powder Thermal Spray Gun
#278Semiconductor device and method of manufacturing the same
#279COMFORMAL COVERINGS FOR ELECTRONIC DEVICES
#280Method for wafer level packaging and fabricating cap structures
#281Wafer level packaging cap and fabrication method thereof
#282Conformal coverings for electronic devices
#283Method for attaching shields on substrates
#284Semiconductor module with external power sensor
#285Substrate-less waveguide active circuit module with current mode power combining
#286Substrate-less waveguide active circuit module
#287Integrated circuit package comprising an enhanced electromagnetic shield
#288Electromagnetic interference absorber ring
#289Wafer level package with EMI shielding
#290Stacked silicon package assembly having enhanced stiffener
#291Metal protected fan-out cavity
#292Integrated circuit package, and methods and tools for fabricating the same
#293EMI absorber ring
#294Integrated RF subsystem
#295Electromagnetic wall in millimeter-wave cavity
#296Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same