207274 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -; Conductive parts; Flat leads, e.g. lead frames with or without insulating supports Cleaning, e.g. removing of solder
SEMICONDUCTOR DEVICE ASSEMBLIES WITH WETTABLE DIE ATTACH AREA AND ASSOCIATED METHODS
#2SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING THE SAME
#3METHOD FOR MANUFACTURING PACKAGED DEVICE CHIPS
#4CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
#5SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND METHOD OF MAKING THE SAME
#6METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#7SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING RECOVERY
#8SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
#9Semiconductor package with nickel-silver pre-plated leadframe
#10CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES
#11Semiconductor package having wettable lead flanks and tie bars and method of making the same
#12METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY
#13Chemically anchored mold compounds in semiconductor packages
#14CLEANING AGENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#15WORKPIECE SUPPORT SYSTEM FOR PLASMA TREATMENT AND METHOD OF USING THE SAME
#16Systems and methods related to wire bond cleaning and wire bonding recovery
#17METAL COMPONENT
#18Semiconductor package with nickel-silver pre-plated leadframe
#19Cleaning process for source/drain epitaxial structures
#20Method of fabricating carrier for wafer level package by using lead frame
#21SEMICONDUCTOR DEVICE PACKAGE
#22Semiconductor packages including roughening features
#23Direct selective adhesion promotor plating
#24SEMICONDUCTOR DEVICE PACKAGE
#25Sawn leadless package having wettable flank leads
#26Direct selective adhesion promotor plating
#27Wire bond cleaning method and wire bonding recovery process
#28Direct selective adhesion promotor plating
#29Lead frame and method for manufacturing same
#30Method of manufacturing semiconductor device and semiconductor device
#31Method of manufacturing semiconductor device
#32Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof
#33METHOD FOR PREPARING GROUNDING SUBSTRATE FOR SEMICONDUCTOR DEVICE
#34ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
#35RADIO FREQUENCY SHIELDING CAVITY PACKAGE
#36STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES
#37STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES
#38Method of manufacturing semiconductor device
#39Processing system and method for providing a heated etching solution
#40Process for etching metals
#41Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#42Semiconductor device and method of forming the same
#43Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same
#44Semiconductor device and method of forming the same
#45PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP
#46Semiconductor device with the leads projected from sealing body
#47Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
#48Selective removal of gold from a lead frame
#49Method of manufacturing semiconductor device and method of manufacturing electronic device
#50MICRO-BLASTING TREATMENT FOR LEAD FRAMES
#51Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#52Method for manufacturing a semiconductor integrated circuit device
#53Coated lead frame
#54Packaged integrated circuit having gold removed from a lead frame
#55Joining method and joining device
#56Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
#57Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
#58Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
#59Method and apparatus for removing molding residues from lead-frames
#60Laser removal of plating tails for high speed packages
#61Method and system for deflashing mold compound
#62Printed circuit board assembly and method