207286 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -; Conductive parts; Bases, plates or heatsinks Mechanical treatment, e.g. deforming
MECHANISMS FOR DUAL COUPLING A SEMICONDUCTOR PACKAGE ASSEMBLY TO A COMPONENT
#2METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AT LEAST ONE SEMICONDUCTOR ARRANGEMENT AND A HEATSINK
#3METHOD FOR THE PRODUCTION OF A COOLING APPARATUS FOR A SEMICONDUCTOR ARRANGEMENT
#4SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#5SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF FORMING THE SAME
#6METHOD FOR PRODUCING A HEAT SINK HAVING FINS AND A PERIPHERAL SIDE WALL
#7SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND A METHOD FOR FORMING THE SAME
#8ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTRICAL COMPONENTS
#9CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
#10Power Module, Manufacturing Method, and Electronic Device
#11ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE
#12MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE AND A MANUFACTURING METHOD OF A POWER SEMICONDUCTOR MODULE INCLUDING THE SAME
#13SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
#14METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
#15HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE HEAT DISSIPATION MEMBER
#16HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRCUITS
#17SEMICONDUCTOR DEVICE
#18CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#19Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion Device
#20PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#21ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS AND SYSTEMS
#22POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE
#23Package with Heat Dissipation Structure and Method for Forming the Same
#24SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
#25Power Semiconductor Device and Method of Manufacturing the Same, and Power Conversion Device
#26THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROGENEOUS PACKAGES AND METHODS FOR FORMING THE SAME
#27Cooling system and methods
#28POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
#29Package structure and method and equipment for forming the same
#30SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF FORMING THE SAME
#31SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#32Method for manufacturing a power module unit
#33Semiconductor device packaging warpage control
#34SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#35Method forming a semiconductor package device
#36Cyclic cooling embedded packaging substrate and manufacturing method thereof
#37Gas quench for diffusion bonding
#38Semiconductor device package having warpage control and method of forming the same
#39Method for packaging chip
#40Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems
#41Power semiconductor apparatus and method for manufacturing the same
#42Power semiconductor device and substrate with dimple region
#43Substrate structures, methods for forming the same and semiconductor device structures comprising the same
#44Base Plate for a Semiconductor Module Arrangement and Method for Producing a Base Plate
#45Package structure and method and equipment for forming the same
#46COMPOSITE METAL MATERIAL, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE USING COMPOSITE METAL MATERIAL
#47Method for thinning solid-body layers provided with components
#48Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
#49HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PRODUCING A HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN ELECTRONIC MODULE
#50Thermally conductive structure for heat dissipation in semiconductor packages
#51Heat dissipation component and method for manufacturing same
#52Semiconductor module, vehicle and manufacturing method
#53Power semiconductor device and manufacturing method for power semiconductor device
#54Package structure and method and equipment for forming the same
#55Semiconductor device, method for manufacturing the same, and power converter
#56Apparatus and method for bending a substrate
#57Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
#58Thermally conductive structure for heat dissipation in semiconductor packages
#59Cooling apparatus, semiconductor module, vehicle, and manufacturing method
#60Process for fabricating a heterostructure comprising a conductive structure and a semiconductor structure and including a step of electrical discharge machining
#61Power module and production method of the same
#62Folded sheet metal heat sink
#63Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#64Memory heat dissipation unit
#65METHOD OF MANUFACTURING MEMORY HEAT DISSIPATION UNIT
#66Burst resistant thin wall heat sink
#67Enhanced thermal transport across interfaces
#68Semiconductor die assemblies with heat sink and associated systems and methods
#69Crushable heat sink for electronic devices
#70Heat dissipation unit
#71Die-attach method to compensate for thermal expansion
#72Apparatus and method for processing a semiconductor substrate
#73Heat sink and electronic component device
#74METHOD FOR MANUFACTURING LIQUID-COOLED JACKET, AND LIQUID-COOLED JACKET
#75Heat radiating sheet
#76Common procedure of interconnecting electronic chip with connector body and forming the connector body
#77Heat transfer structure and manufacturing method therefore
#78Carbon nanotube structure, heat dissipation sheet, and method of manufacturing carbon nanotube structure
#79Semiconductor device and method for manufacturing the same
#80Power converter
#81Method of producing a liquid cooled coldplate
#82Semiconductor die assemblies with heat sink and associated systems and methods
#83Heat dissipation component and method for manufacturing same
#84Compliant Pin Fin heat sink with base integral pins
#85Baseplate for an electronic module
#86Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#87Molded cavity package with embedded conductive layer and enhanced sealing
#88Method of manufacturing an object with microchannels provided therethrough
#89Packaging for high power integrated circuits and infrared emitter arrays
#90Thermal module
#91Power conversion device
#92COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS
#93Integrated heat spreader having electromagnetically-formed features
#94Thermally conductive structure for heat dissipation in semiconductor packages
#95Heat radiating plate and method for producing same
#96Method for manufacturing shield cans for blocking electromagnetic waves
#97Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the same
#98Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
#99Method of producing a liquid cooled coldplate
#100Burst resistant thin wall heat sink
#101Method of manufacturing power-module substrate with heat-sink
#102Semiconductor die assemblies with heat sink and associated systems and methods
#103Structure for a heat transfer interface and method of manufacturing the same
#104Method of attaching an electronic part to a copper plate having a surface roughness
#105Semiconductor apparatus and manufacturing method for same
#106Method of manufacturing baseplate for an electronic module
#107Assembly of an integrated circuit chip and of a plate
#108Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member
#109Panel level fabrication of package substrates with integrated stiffeners
#110Semiconductor device and manufacturing method for same
#111Semiconductor die assemblies with heat sink and associated systems and methods
#112Power semiconductor module, method for manufacturing the same, and power converter
#113THINNED FLAT PLATE HEAT PIPE FABRICATED BY EXTRUSION
#114Baseplate for an electronic module and method of manufacturing the same
#115MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#116SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#117Electronic component package and method for manufacturing same
#118Heat sink and semiconductor device
#119Semiconductor device and method of manufacturing a semiconductor device
#120Semiconductor package having an isolation wall to reduce electromagnetic coupling
#121Method of producing heat conductive sheet
#122METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION
#123Method of producing heat conductive sheet
#124Power semiconductor arrangement and method of producing a power semiconductor arrangement
#125Method of fabricating a heat sink
#126Power semiconductor module
#127Method of producing electronics substrate with enhanced direct bonded metal
#128Semiconductor device with integral heat sink
#129Forging method
#130THERMAL MODULE AND MANUFACTURING METHOD THEREOF
#131Method of making a heat radiating structure for high-power LED
#132Integrated thermal solutions for packaging integrated circuits
#133Power module and lead frame for power module
#134Method of manufacturing an integrated cold plate for electronics
#135HEAT DISSIPATION DEVICE
#136Process of fabricating heat dissipation substrate
#137HEAT DISSIPATION DEVICE
#138Method for manufacturing a heat sink
#139HEAT RADIATOR
#140Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate
#141HEAT SINK AND A METHOD FOR MAKING THE SAME
#142Lead frame package structure with low electromagnetic interference
#143STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE
#144HEAT SINK
#145Method of producing an enhanced base plate
#146METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION
#147Fin-integrated substrate and manufacturing method of fin-integrated substrate
#148Leadframe-based mold array package heat spreader and fabrication method therefor
#149MANUFACTURING METHOD OF A HEAT SINK
#150Radiator and method of manufacturing radiator
#151THERMAL MODULE AND METHOD OF MANUFACTURING SAME
#152Semiconductor device and method for manufacturing the same
#153THINNED FLAT PLATE HEAT PIPE FABRICATED BY EXTRUSION
#154Heat sink fin including angular dimples
#155Fin fabrication process for entrainment heat sink
#156Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
#157Integrated heat spreader and method of fabrication
#158APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
#159HEAT SINK CORE MEMBER AND ITS FABRICATION PROCEDURE
#160ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL
#161Heat exchanger and method of manufacturing the same
#162HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME
#163CONNECTING PAD PRODUCING METHOD
#164Heat sink
#165Electromagnetic interference shield with integrated heat sink
#166Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
#167COLD PLATE WITH PINS
#168Heat sink, semiconductor device, and method of manufacturing heat sink
#169Method of manufacturing a heat exchanger
#170Mold lock on heat spreader
#171COOLING FIN AND MANUFACTURING METHOD OF THE COOLING FIN
#172Ring heat dissipating device formed by punching and riveting through a shaping mold
#173Heat sink and fabricating method of the same
#174RADIATOR PLATE, PERFORATED PLATE AND METHODS OF MAKING THE SAME
#175ANNULAR HEAT DISSIPATING DEVICE
#176Microchannel heat exchanger fabricated by wire electro-discharge machining
#177Method of manufacturing a semiconductor device and molding die
#178Semiconductor package heat spreader
#179Heat Sink and Method of Manufacturing the Same
#180Integrated heat spreader and method of fabrication
#181PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE
#182Cooling Body for Electronics Housing
#183ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING THE SAME
#184Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
#185Method for manufacturing heat radiator having plate-shaped fins
#186Method of manufacturing a cold plate heat exchanger assembly having a metallic compliant gasket
#187Heat generating member cooling structure and drive unit
#188Working Method of Metal Material and Semiconductor Apparatus Fabricated by the Method
#189CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES
#190COMPOSITE MATERIAL, HAVING HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, AND HEAT-DISSIPATING SUBSTRATE, AND THEIR PRODUCTION METHODS
#191Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof
#192METHODS FOR MANUFACTURING HEAT SINK HAVING RELATIVELY HIGH ASPECTS RATIO THEREOF
#193METHOD FOR MANUFACTURING PHASE CHANGE TYPE HEAT SINK
#194Combination of heat pipe and heat sink and method thereof
#195Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
#196HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#197Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor
#198Method for manufacturing semiconductor package substrate
#199Flip chip heat sink package and method
#200Method of making copper and carbon nanotube thermal conductor
#201Packaged integrated circuit having a heat spreader and method therefor
#202Working method of metal material and semiconductor apparatus fabricated by the method
#203Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
#204Thermally enhanced semiconductor package and fabrication method thereof
#205Heatsink moldlocks
#206Method for manufacturing heat dissipation apparatus
#207Manufacturing system for making a heat dissipating device
#208Semiconductor component having stiffener, circuit decal and terminal contacts
#209Heat dispensing device
#210Microchannel heat exchanger fabricated by wire electro-discharge machining
#211Carrier with metal bumps for semiconductor die packages
#212Methods for fabricating thermal management systems for micro-components
#213Electronic assemblies and methods of making the same
#214Aluminum extruded fin set with noise reduction functionality
#215Heatsink assembly and method of manufacturing the same
#216Heat sink fins processing installation
#217Cold plate and method of making the same
#218Radiator and method of manufacturing the same
#219Semiconductor component having stiffener, stacked dice and circuit decals
#220Method for fabricating semiconductor component with stiffener and circuit decal
#221Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener
#222Fabrication method for semiconductor package heat spreaders
#223Flip chip heat sink package and method
#224Semiconductor component and system having stiffener and circuit decal
#225Thermal management systems for micro-components
#226Leadframe-based mold array package heat spreader and fabrication method therefor
#227Heat dissipating fins of heat sink and manufacturing method thereof
#228Metal substrates with structures formed therein and methods of making same
#229Lid for semiconductor electronic package
#230Lid for semiconductor electronic package
#231Maintaining laminate flatness using magnetic retention during chip joining