ClassID:

207312

H01L21/64 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups  - 

Recent Application in this class:
#1
20210249616
2021-08-12

Method of fabricating a display apparatus

#2
20210170184
2021-06-10

Manufacturing implantable tissue stimulators

#3
20210143014
2021-05-13

Device and method for measuring film longitudinal temperature field during nitride epitaxial growth

#4
20200235273
2020-07-23

LED package including converter confinement

#5
20200206494
2020-07-02

Overmolded segmented electrode

#6
20200041251
2020-02-06

Measurement apparatus and measurement method

#7
20190385971
2019-12-19

Bonding apparatus and bonding system

#8
20190109268
2019-04-11

LED package including converter confinement

#9
20190103819
2019-04-04

Method of manufacturing actuator

#10
20180318875
2018-11-08

Film production method and system

#11
20180204739
2018-07-19

Selective planishing method for making a semiconductor device

#12
20180182694
2018-06-28

Semiconductor device and manufacturing method of semiconductor device

#13
20180138142
2018-05-17

Film for semiconductor device and fabrication method thereof

#14
20180065816
2018-03-08

Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method

#15
20180047699
2018-02-15

Bonding apparatus and bonding system

#16
20170186629
2017-06-29

SYSTEM AND METHOD FOR REMOVING COATING FROM AN EDGE OF A SUBSTRATE

#17
20150249054
2015-09-03

SUBSTRATE ALIGNMENT MARK AND FABRICATING METHOD THEREOF, AND SUBSTRATE

#18
20150221526
2015-08-06

Selective planishing method for making a semiconductor device

#19
20150171303
2015-06-18

THERMOELECTRIC GENERATOR PIPE AND METHOD FOR PRODUCING THE GENERATOR PIPE

#20
20150110953
2015-04-23

TOUCH PANEL, METHOD FOR MANUFACTURING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE TOUCH PANEL

#21
20150108596
2015-04-23

Method providing an epitaxial photonic device having a reduction in defects and resulting structure

#22
20150102852
2015-04-16

Stressed substrates for transient electronic systems

#23
20150053885
2015-02-26

Piezoelectric ceramic, method for manufacturing piezoelectric ceramic, piezoelectric element, and electronic device

#24
20150047685
2015-02-19

Powder metallurgical production of a thermoelectric component

#25
20150040970
2015-02-12

Vacuum Deposition System For Solar Cell Production And Method Of Manufacturing

#26
20140345779
2014-11-27

Manufacturing method for monolithic ceramic electronic component

#27
20140263582
2014-09-18

Low cost interposer and method of fabrication

#28
20140224409
2014-08-14

Sintering Utilizing Non-Mechanical Pressure

#29
20140224303
2014-08-14

PHOTOVOLTAIC SYSTEM FOR INSTALLATION ON ROOFS, WITH PLASTIC SUPPORT AND PHOTOVOLTAIC MODULE

#30
20140192464
2014-07-10

Masking substrates for application of protective coatings

#31
20140177077
2014-06-26

Optical system and substrate sealing method

#32
20140176631
2014-06-26

Nozzle ejection amount correcting method, functional liquid ejecting method, and organic EL device manufacturing method

#33
20140138811
2014-05-22

A SEMICONDUCTOR DEVICE INCLUDING A HEAT-SPREADING LID

#34
20140106484
2014-04-17

Bonding apparatus and method for display device

#35
20140085841
2014-03-27

Circuit device and method of manufacturing the same

#36
20140072759
2014-03-13

Systems and methods for protection of cosmetic surfaces and overflow prevention on electronic devices

#37
20140053901
2014-02-27

Hydrolysis resistant polyester films

#38
20140048920
2014-02-20

Semiconductor device with selective planished leadframe

#39
20140042476
2014-02-13

Metal oxide thin film substrate, method of fabricating the same, photovoltaic cell and OLED including the same

#40
20140037982
2014-02-06

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

#41
20140017897
2014-01-16

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

#42
20140008112
2014-01-09

Single component, low temperature curable polymeric composition and related method

#43
20130340920
2013-12-26

Manufacturing method for monolithic ceramic electronic component

#44
20130320559
2013-12-05

Chip package and method for forming the same

#45
20130313309
2013-11-28

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

#46
20130298393
2013-11-14

Selective leadframe planishing

#47
20130292811
2013-11-07

Leadframe having selective planishing

#48
20130270744
2013-10-17

SYSTEM AND METHOD FOR REMOVING COATING FROM AN EDGE OF A SUBSTRATE

#49
20130228547
2013-09-05

Method for manufacturing a flexible intraocular retinal implant having doped diamond electrodes

#50
20130187986
2013-07-25

Liquid jet head, liquid jet apparatus, and method of manufacturing liquid jet head

#51
20130068823
2013-03-21

Die bonder and bonding method

#52
20120282483
2012-11-08

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

#53
20120234462
2012-09-20

Manufacturing method for monolithic ceramic electronic component

#54
20120080779
2012-04-05

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

#55
20110162715
2011-07-07

SYSTEM AND METHOD FOR REMOVING COATING FROM AN EDGE OF A SUBSTRATE

#56
20110014489
2011-01-20

Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers

#57
14573753
2015-12-01

Methods of fabricating interconnection structures

#58
14334528
2017-04-25

Package substrate warpage reshaping apparatus and method