ClassID:

207371

H01L21/67336 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders; Trays for chips characterized by a material, a roughness, a coating or the like

Recent Application in this class:
#1
20260018444
2026-01-15

METHODS FOR REDUCING DEFECTS DURING DIE PLACEMENT

#2
20250343062
2025-11-06

RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON

#3
20250336698
2025-10-30

TRAY FOR CARRYING A DEVICE BASED ON CONTACT LIMITED TO AN EDGE PORTION OF THE DEVICE

#4
20250210388
2025-06-26

METHOD FOR FABRICATING SILICON CHIP CARRIERS USING WET BULK MICROMACHINING FOR IR DETECTOR APPLICATIONS

#5
20250112069
2025-04-03

PACKAGE TRAYS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

#6
20250054791
2025-02-13

PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

#7
20240395587
2024-11-28

TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

#8
20240355655
2024-10-24

Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge

#9
20240242989
2024-07-18

GRID STRUCTURE FOR FIXING SPECIMEN

#10
20240047250
2024-02-08

CARRIER PLATE AND TRANSFERRING DEVICE

#11
20230386875
2023-11-30

UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE

#12
20230290661
2023-09-14

SINGULATED DIE SHIPPING TRAY ASSEMBLY

#13
20230282496
2023-09-07

SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

#14
20230079059
2023-03-16

SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR

#15
20220384226
2022-12-01

RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON

#16
20220189911
2022-06-16

AUTOMATED-POSITION-ALIGNING METHOD FOR TRANSFERRING CHIP AND SYSTEM USING THE METHOD

#17
20220172970
2022-06-02

Adsorption device, transferring system having same, and transferring method using same

#18
20220013390
2022-01-13

Patterned carrier assemblies having an integrated adhesive film

#19
20210398832
2021-12-23

Method for making adsorption device

#20
20210005490
2021-01-07

Adsorption device, transferring system having same, and transferring method using same

#21
20210005489
2021-01-07

Adsorption device comprising a magnetic plate having opposite magnetic poles, transferring system having same

#22
20210005488
2021-01-07

Adsorption device and transferring system having same

#23
20200185243
2020-06-11

Carrier structure and micro device structure

#24
20190127573
2019-05-02

POLYLACTIC ACID RESIN COMPOSITION AND APPLICATION THEREOF

#25
20190067061
2019-02-28

RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

#26
20180182654
2018-06-28

Die tray with channels

#27
20180144969
2018-05-24

Hybrid substrate carrier

#28
20180079547
2018-03-22

Magnetic shield tray, magnetic shield wrapper and magnetic memory product shielded from external magnetic field

#29
20170263480
2017-09-14

Method for manufacturing an arrangement including a chip carrier notch

#30
20170186635
2017-06-29

Chip accommodation tray

#31
20170162412
2017-06-08

Methods related to preparation of a stencil to receive a plurality of IC units

#32
20170098586
2017-04-06

Protecting partially-processed products during transport

#33
20160358803
2016-12-08

Transparent electrostatic carrier

#34
20160326637
2016-11-10

Substrate carrier unit for a film deposition apparatus

#35
20150063977
2015-03-05

Methods and structures for handling integrated circuits

#36
20140306356
2014-10-16

Arrangement having a plurality of chips and a chip carrier, and a processing arrangement

#37
20130341835
2013-12-26

Method of forming substrate carriers and articles from compositions comprising carbon nanotubes

#38
20130337202
2013-12-19

Multilayer styrenic resin sheet

#39
20130300857
2013-11-14

Carrier for separated electronic components and method for visual inspection of separated electronic components

#40
20130142979
2013-06-06

Thermoformed IC Trays Of Poly(Phenylene Ether) Compositions

#41
20110113645
2011-05-19

Device and method for drying separated electronic components

#42
20100267883
2010-10-21

Nanotube Polymer Composite Composition and Methods of Making

#43
20090093085
2009-04-09

Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device

#44
20080118997
2008-05-22

Vacuum holder for integrated circuit units

#45
20070272589
2007-11-29

Allowance Method for Point to Ground Resistance of Tray

#46
20070190276
2007-08-16

High temperature, high strength, colorable materials for device processing systems

#47
20070178259
2007-08-02

High temperature, high strength, colorable materials for device processing systems

#48
20060223225
2006-10-05

Method, system, and apparatus for transfer of integrated circuit dies using an attractive force

#49
20060043600
2006-03-02

Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device

#50
20050210665
2005-09-29

Tray for storing and transporting semi-conductor and other microelectronic components