ClassID:

207453

H01L21/746 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Making of buried regions, e.g. buried collector layers, internal connections for AIII-BV integrated circuits

Recent Application in this class:
#1
20240204055
2024-06-20

SCREEN LAYER INTEGRATION IN GALLIUM NITRIDE TECHNOLOGY

#2
20240178220
2024-05-30

Parasitic capacitance reduction in GaN-on-silicon devices

#3
20230058073
2023-02-23

Gallium nitride device for high frequency and high power applications

#4
20220270986
2022-08-25

Enhanced bonding between III-V material and oxide material

#5
20220005764
2022-01-06

Parasitic capacitance reduction in GaN devices

#6
20200118946
2020-04-16

Enhanced bonding between III-V material and oxide material

#7
20190371729
2019-12-05

Parasitic capacitance reduction in GaN-on-silicon devices

#8
20190333873
2019-10-31

Enhanced bonding between III-V material and oxide material

#9
20190280093
2019-09-12

High electron mobility transistor with deep charge carrier gas contact structure

#10
20190229187
2019-07-25

Gallium nitride high-electron mobility transistors with deep implanted p-type layers in silicon carbide substrates for power switching and radio frequency applications and process for making the same

#11
20190013398
2019-01-10

High power compound semiconductor field effect transistor devices with low doped drain

#12
20190006351
2019-01-03

Semiconductor structure with doped layers on fins and fabrication method thereof

#13
20180308834
2018-10-25

Multilevel template assisted wafer bonding

#14
20170221752
2017-08-03

Semiconductor component and method of manufacture

#15
20160111407
2016-04-21

Multilevel template assisted wafer bonding

#16
20160043219
2016-02-11

Semiconductor component and method of manufacture

#17
20160043185
2016-02-11

Semiconductor component and method

#18
20110278598
2011-11-17

Semiconductor structure, an integrated circuit including a semiconductor structure and a method for manufacturing a semiconductor structure

#19
20090020768
2009-01-22

BURIED CONTACT DEVICES FOR NITRIDE-BASED FILMS AND MANUFACTURE THEREOF

#20
16385193
2020-02-04

Regrowth method for fabricating wide-bandgap transistors, and devices made thereby

#21
15921007
2019-08-20

Regrowth method for fabricating wide-bandgap transistors, and devices made thereby

#22
15832377
2018-12-11

Metal-semiconductor heterodimension field effect transistors (MESHFET) and high electron mobility transistor (HEMT) based device and method of making the same