207531 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
METHOD FOR MANUFACTURING ENGINEERED GROWTH SUBSTRATE FOR GROUP III NITRIDE POWER DEVICE HAVING HIGH-QUALITY NUCLEATION REGION
#2Semiconductor Exfoliation Method
#3SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
#4SILICON CARBIDE WAFER MANUFACTURING METHOD
#5PROCESS OF FORMING A THIN SEMICONDUCTOR LAYER BONDED TO A PROCESSING SUBSTRATE AND AN ELECTRONIC DEVICE INCLUDING THE THIN SEMICONDUCTOR LAYER
#6METHOD OF INSPECTING GROUP-III ELEMENT NITRIDE SUBSTRATE, METHOD OF PRODUCING GROUP-III ELEMENT NITRIDE SUBSTRATE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#7Methods of Semiconductor Device Fabrication Involving Porous Silicon Carbide
#8METHOD FOR TRANSFERRING A LAYER FROM A SOURCE SUBSTRATE TO A DESTINATION SUBSTRATE
#9METHOD FOR TRANSFERRING A LAYER FROM A SOURCE SUBSTRATE TO A DESTINATION SUBSTRATE
#10Silicon Carbide Epitaxy
#11METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR CHIP
#12SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
#13SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#14METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIVER SUBSTRATE BY IMPLANTING IONS IN THE DONOR SUBSTRATE THROUGH A MASK, BONDING THE DONOR SUBSTRATE TO THE RECEIVER SUBSTRATE, AND DETACHING THE DONOR
#15Process for the Pulsed Laser Ejection of Multiple Epitaxial Structures from one Thin Film Growth
#16METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR STRUCTURE
#17SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#18MANUFACTURING METHOD OF SUBSTRATE UNIT, AND SUBSTRATE UNIT
#19METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE
#20METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#21CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
#22MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#23LIFT-OFF METHOD
#24Semiconductor Exfoliation Method
#25Wide band gap semiconductor process, device, and method
#26COUPON WAFER AND METHOD OF PREPARATION THEREOF
#27Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ions in the donor substrate through a mask, bonding the donor substrate to the receiver substrate, and detaching the donor substrate along an embrittlement plane
#28Semiconductor device manufacturing method and wafer-attached structure
#29Methods of forming semiconductor devices in a layer of epitaxial silicon carbide
#30Semiconductor device manufacturing process including forming a bonded assembly and substrate recycling
#31Silicon carbide components and methods for producing silicon carbide components
#32Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
#33CHIP BONDING SYSTEM AND CHIP BONDING METHOD
#34SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
#35STRUCTURES AND METHODS FOR PRODUCING AN OPTOELECTRONIC DEVICE
#36Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC
#37Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrate
#38SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#39TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE
#40Silicon carbide wafer and method for manufacturing the same
#41Method for manufacturing semiconductor device
#42MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#43Method for separating a solid body
#44SEMICONDUCTOR CONTINUOUS ARRAY LAYER
#45SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE REUSING METHOD
#46Method of removing a substrate with a cleaving technique
#47Method and structure for thin-film fabrication
#48Semiconductor chip and method for manufacturing the same
#49Separating device and method of separation
#50Patterned nanochannel sacrificial layer for semiconductor substrate reuse
#51Semiconductor chip, processed wafer, and method for manufacturing semiconductor chip
#52Laser lift-off method for separating substrate and semiconductor-epitaxial structure
#53Carrier substrate and element transfer method using the same
#54Crystal efficient SiC device wafer production
#55METHOD FOR REMOVING A BAR OF ONE OR MORE DEVICES USING SUPPORTING PLATES
#56EPITAXIAL GROWTH AND TRANSFER VIA PATTERNED TWO-DIMENSIONAL (2D) LAYERS
#57Semiconductor device manufacturing method and wafer-attached structure
#58Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ions in the donor substrate through a mask, bonding the donor substrate to the receiver substrate, and detaching the donor substrate along an embrittlement plane
#59Processed wafer and method of manufacturing chip formation wafer
#60Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrate
#61Glass substrate, laminated substrate, and laminate
#62Three-dimensional memory device including III-V compound semiconductor channel layer and method of making the same
#63Transferring large-area group III-nitride semiconductor material and devices to arbitrary substrates
#64Semiconductor device with two-dimensional materials
#65Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers
#66Method for manufacturing gallium nitride semiconductor device
#67Silicon carbide components and methods for producing silicon carbide components
#68Wafer separating method
#69Methods of re-using a silicon carbide substrate
#70Method for producing a detachment area in a solid body
#71METHOD OF REMOVING SEMICONDUCTING LAYERS FROM A SEMICONDUCTING SUBSTRATE
#72Method for forming a layer by cyclic epitaxy
#73Method for reducing the thickness of solid-state layers provided with components
#74Nonpolar or semipolar group III-nitride substrates
#75Method for producing GaN layered substrate
#76Method for preparing a heterostructure
#77Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices
#78Reusable wide bandgap semiconductor substrate
#79Method for manufacturing flexible OLED device and support substrate
#80Water soluble oxide liftoff layers for GaAs photovoltaics
#81Method for transferring a layer by using a detachable structure
#82Method for producing wafers with modification lines of defined orientation
#83Method of manufacture of group III nitride semiconductor
#84Method for manufacturing semiconductor structure
#85EPITAXIAL GROWTH AND TRANSFER VIA PATTERNED TWO-DIMENSIONAL (2D) LAYERS
#86Fabrication of thin-film electronic devices with non-destructive wafer reuse
#87LASER LIFT-OFF PROCESSING METHOD AND FLATTENING JIG USED THEREIN
#88Micro-LED display device and a manufacturing method thereof
#89Method of removing a substrate with a cleaving technique
#90Semiconductor substrate, semiconductor element and method for producing semiconductor substrate
#91Semiconductor device manufacturing method and wafer-attached structure
#92Reusable wide bandgap semiconductor substrate
#93Preparation of compound semiconductor substrate for epitaxial growth via non-destructive epitaxial lift-off
#94IR assisted fan-out wafer level packaging using silicon handler
#95SiC substrate processing method
#96SiC substrate processing method
#97SYSTEMS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES VIA REMOTE EPITAXY
#98Method of manufacturing group III nitride semiconductor substrate, group III nitride semiconductor substrate, and bulk crystal
#99Narrow gap device with parallel releasing structure
#100Narrow gap device with parallel releasing structure
#101Method for recovering carbon-face-polarized silicon carbide substrate
#102A FLEXIBLE OLED DISPLAY PANEL AND A MANUFACTURING METHOD THEREOF
#103Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers
#104Laser lift off systems and methods
#105Location-specific growth and transfer of single crystalline TMD monolayer arrays
#106Wafer composite and method for producing a semiconductor component
#107Wafer composite and method for producing semiconductor components
#108Method for arranging a plurality of seed substrates on a carrier element and carrier element having seed substrates
#109Independently-driven film separation mechanism
#110Stripped method for preparing semiconductor structure
#111Semiconductor continuous array layer
#112Systems and methods for perforation and ohmic contact formation for GaN epitaxial lift-off using an etch stop layer
#113Deep photoenhanced wet material etching using high-power ultraviolet light emitting diodes
#114Silicon carbide components and methods for producing silicon carbide components
#115METHOD OF BATCH TRANSFERRING MICRO SEMICONDUCTOR STRUCTURES
#116EFFECTIVE COMPOUND SUBSTRATE FOR NON-DESTRUCTIVE EPITAXIAL LIFT-OFF
#117High-quality, single-crystalline silicon-germanium films
#118Heterostructure with sacrificial layer
#119Method for manufacturing flexible electrical device
#120Method of making a peeled substrate using laser irradiation
#121Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
#122Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means
#123Lift off process for chip scale package solid state devices on engineered substrate
#124Laser epitaxial lift-off GaAs substrate
#125Glass substrate, laminated substrate, and laminate
#126Devices and methods for a power transistor having a Schottky or Schottky-like contact
#127Systems and methods for controlling release of transferable semiconductor structures
#128Thin low defect relaxed silicon germanium layers on bulk silicon substrates
#129IR assisted fan-out wafer level packaging using silicon handler
#130RAMO4 monocrystalline substrate
#131Laser lift-off method of wafer
#132Thin low defect relaxed silicon germanium layers on bulk silicon substrates
#133Method for manufacturing semiconductor device by epitaxial lift-off using plane dependency of III-V compound
#134Method of removing a growth substrate from a layer sequence
#135Method for producing Group III nitride semiconductor including growing Group III nitride semiconductor through flux method
#136Method of transferring a semiconductor layer
#137Strain relief epitaxial lift-off via pre-patterned mesas
#138BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAMATION
#139Semiconductor layer separation from single crystal silicon substrate by infrared irradiation of porous silicon separation layer
#140Method for manufacturing semiconductor substrate, semiconductor substrate, method for manufacturing combined semiconductor substrate, combined semiconductor substrate, and semiconductor-joined substrate
#141Methods of filling a flowable material in a gap of an assembly module
#142Laser-based separation method
#143Method for forming a semiconductor device and a semiconductor device
#144IR assisted fan-out wafer level packaging using silicon handler
#145METHOD FOR PRODUCING GROUP III NITRIDE CRYSTAL, AND RAMO4 SUBSTRATE
#146Reusable nitride wafer, method of making, and use thereof
#147Method for manufacturing semiconductor structure
#148Systems and methods for controlling release of transferable semiconductor structures
#149Epitaxial lift-off process with guided etching
#150Lift off process for chip scale package solid state devices on engineered substrate
#151NON-DESTRUCTIVE EPITAXIAL LIFT-OFF OF LARGE AREA III-V THIN-FILM GROWN BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION AND SUBSTRATE REUSE
#152Process for producing group III nitride crystal and apparatus for producing group III nitride crystal
#153Method for producing group-III nitride crystal, group-III nitride crystal, semiconductor device, and device for producing group-III nitride crystal
#154Fabrication of thin-film devices using selective area epitaxy
#155Method for producing a semiconductor layer sequence
#156Method for forming a semiconductor device and a semiconductor device
#157Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure
#158Method for manufacturing a handle substrate for the temporary bonding of a substrate
#159Substrate structure removal
#160Semiconductor die singulation method
#161Systems and methods for laser splitting and device layer transfer
#162Fabrication of thin-film electronic devices with non-destructive wafer reuse
#163Method for the reuse of gallium nitride epitaxial substrates
#164Laser liftoff of epitaxial thin film structures
#165Substrate cleaving under controlled stress conditions
#166Method for dicing a substrate with back metal
#167Conductivity based on selective etch for GaN devices and applications thereof
#168Method of producing bonded wafer with uniform thickness distribution
#169Tape-based epitaxial lift off apparatuses and methods
#170Reusable nitride wafer, method of making, and use thereof
#171Lift-off method
#172Method for the reuse of gallium nitride epitaxial substrates
#173Epitaxial lift off stack having a pre-curved handle and methods thereof
#174Semiconductor die singulation method
#175Thin epitaxial silicon carbide wafer fabrication
#176METHOD FOR PRODUCING A COMPOSITE WAFER AND A METHOD FOR PRODUCING A SEMICONDUCTOR CRYSTAL LAYER FORMING WAFER
#177Laser lift off systems and methods
#178Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures
#179STRAIN CONTROL FOR ACCELERATION OF EPITAXIAL LIFT-OFF
#180Substrate cleaving under controlled stress conditions
#181Crack control for substrate separation
#182Apparatus and method for separating a stacked arrangement
#183Method for the reuse of gallium nitride epitaxial substrates
#184Lift-off of epitaxial layers from silicon carbide or compound semiconductor substrates
#185Narrow gap device with parallel releasing structure
#186Controlled process and resulting device
#187Release strategies for making transferable semiconductor structures, devices and device components
#188Semiconductor device and method for producing the same
#189Epitaxial lift off systems and methods
#190Systems and methods for separating components of a multilayer stack of electronic components
#191System and method for improved epitaxial lift off
#192Method for dicing a substrate with back metal
#193Method of large-area circuit layout recognition
#194Method for manufacturing semiconductor device, epitaxial substrate for use therein and semi-finished semiconductor device
#195High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
#196High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
#197Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth
#198Laminate and method for separating the same
#199Method for the reuse of gallium nitride epitaxial substrates
#200Methods of fabricating printable compound semiconductor devices on release layers
#201Controlled process and resulting device
#202High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
#203High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
#204High throughput epitaxial lift off for flexible electronics
#205Conductivity based on selective etch for GaN devices and applications thereof
#206Method for controlled removal of a semiconductor device layer from a base substrate
#207Method for controlled removal of a semiconductor device layer from a base substrate
#208Method for forming two device wafers from a single base substrate utilizing a controlled spalling process
#209Epitaxial lift off stack having a non-uniform handle and methods thereof
#210System and method for improved epitaxial lift off
#211Substrate cleaving under controlled stress conditions
#212Method of fabricating epitaxial semiconductor devices
#213Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components
#214CONTROLLED PROCESS AND RESULTING DEVICE
#215Method of forming nitride semiconductor epitaxial layer and method of manufacturing nitride semiconductor device
#216Epitaxial lift off systems and methods
#217Substrate clean solution for copper contamination removal
#218Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth
#219Release strategies for making transferable semiconductor structures, devices and device components
#220Laser lift off systems and methods
#221Controlled process and resulting device
#222Tape-based epitaxial lift off apparatuses and methods
#223Method for transferring chips onto a substrate
#224LED-laser lift-off method
#225Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells
#226Epitaxial lift off stack having a multi-layered handle and methods thereof
#227Epitaxial lift off stack having a non-uniform handle and methods thereof
#228Epitaxial lift off stack having a unidirectionally shrunk handle and methods thereof
#229Epitaxial lift off stack having a universally shrunk handle and methods thereof
#230Epitaxial lift off stack having a pre-curved handle and methods thereof
#231Method of producing a nitride semiconductor device and nitride semiconductor device
#232Method for producing a thin chip comprising an integrated circuit
#233Method for producing a thin semiconductor chip comprising an integrated circuit
#234Method and device for controlled cleaving process
#235Method and structure of a reusable substrate
#236Controlled process and resulting device
#237Controlled cleaving process
#238Release strategies for making transferable semiconductor structures, devices and device components
#239Method and device for controlled cleaving process
#240Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting Device
#241Controlled process and resulting device
#242Controlled process and resulting device
#243Method of producing a nitride semiconductor device and nitride semiconductor device
#244Semiconductor device with reduced thickness of the semiconductor substrate
#245Method for manufacturing semiconductor device, and semiconductor device
#246Controlled cleaving process
#247Controlled cleaving process
#248Detachable substrate or detachable structure and method for the production thereof
#249Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices
#250Method for avoiding crack formation during laser lift-off process
#251Controlled spalling using a reactive material stack