207538 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
Sub-classes:WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
#2Semiconductor Device
#3SEMICONDUCTOR DEVICE AND PROCESSES FOR MAKING SAME
#4INTEGRATED CIRCUIT PACKAGES AND METHODS
#5ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
#6ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS
#7METHOD OF SINGULATION OF DIES FROM A WAFER
#8WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD
#9CHIP MANUFACTURING METHOD
#10Imaging device, method of manufacturing imaging device, and electronic device
#11POWER SWITCH CIRCUIT, IC STRUCTURE OF POWER SWITCH CIRCUIT, AND METHOD OF FORMING IC STRUCTURE
#12Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor Wafer
#13PROCESSING METHOD OF WORKPIECE
#14METHOD FOR MANUFACTURING CAPACITOR
#15Semiconductor substrate and semiconductor device
#16Semiconductor Packages and Methods of Forming
#17REDUCING CROSS-WAFER VARIABILITY FOR MINIMUM WIDTH RESISTORS
#18Chip scale package (CSP) process
#19Semiconductor device and semiconductor device identification method
#20Semiconductor device
#21Monolithic multi-I region diode limiters
#22INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
#23Semiconductor device for attaching to a flexible display
#24Wafer dicing using femtosecond-based laser and plasma etch
#25DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER
#26MONOLITHIC MULTI-I REGION DIODE SWITCHES
#27SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
#28SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#29Semiconductor device
#30SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#31Semiconductor device
#32Semiconductor device
#33Vertical etch heterolithic integrated circuit devices
#34TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
#35Integrated circuit device and method
#36Basic logic element, semiconductor device including the same, output control method for basic logic element, and non-transitory computer readable medium
#37CHIP MANUFACTURING METHOD
#38Electrostatic discharge protection circuit having a metal connection and method for manufacturing the electrostatic discharge protection circuit
#39Imaging device, method of manufacturing imaging device, and electronic device
#40Capacitor
#41Water soluble organic-inorganic hybrid mask formulations and their applications
#42Imaging device, method of manufacturing imaging device, and electronic device
#43Monolithic multi-I region diode limiters
#44Water soluble organic-inorganic hybrid mask formulations and their applications
#45Method of manufacturing a semiconductor device for attaching to a flexible display
#46Fin height monitoring structure and fin height monitoring method
#47Power switch circuit, IC structure of power switch circuit, and method of forming IC structure
#48Semiconductor device
#49Semiconductor substrate and semiconductor device
#50Wafer dicing using femtosecond-based laser and plasma etch
#51Reducing cross-wafer variability for minimum width resistors
#52Chip package and method of fabricating the same
#53Semiconductor device and semiconductor device identification method
#54Semiconductor device having oxide containing gallium indium and zinc
#55Electronic package for integrated circuits and related methods
#56Method of planarizing insulating layer for memory device
#57Semiconductor integrated circuit device
#58Techniques for an inductor at a second level interface
#59WIRELESS COMMUNICATION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#60Semiconductor memory device
#61Wafer dicing using femtosecond-based laser and plasma etch
#62Monolithic multi-I region diode switches
#63Terahertz device
#64Chip, manufacturing method, and mobile terminal
#65Monolithic multi-I region diode limiters
#66Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
#67Wiring structure, semiconductor device and display device
#68IC with ion milled thin-film resistors
#69Transistor and electronic device
#70Wafer dicing using femtosecond-based laser and plasma etch
#71Semiconductor device for attaching to a flexible display and a method of manufacturing the same
#72Method for fabricating a semiconductor device
#73Thin film capacitor and method of manufacturing the same
#74Semiconductor substrate and semiconductor device
#75Semiconductor device
#76Semiconductor device
#77Vertical etch heterolithic integrated circuit devices
#78Chip package and method of fabricating the same
#79Semiconductor device and manufacturing method
#80Techniques for an inductor at a second level interface
#81Techniques for an inductor at a first level interface
#82Capacitor
#83Methods and apparatus for MOS capacitors in replacement gate process
#84Capacitor
#85Load drive apparatus
#86Constant current circuit, semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#87TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
#88Semiconductor device
#89Semiconductor device
#90Integrating metal-insulator-metal capacitors with fabrication of vertical field effect transistors
#91Integrating metal-insulator-metal capacitors with fabrication of vertical field effect transistors
#92Semiconductor integrated circuit device
#93Capacitor
#94Semiconductor device
#95Display driver IC
#96Semiconductor circuit, control method of semiconductor circuit, and electronic apparatus
#97Semiconductor device
#98High frequency attenuator
#99Semiconductor devices and methods of fabricating the same
#100Sensor device
#101Site-selective metal plating onto a package dielectric
#102Semiconductor device and method of manufacturing the same
#103Resistive element
#104SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
#105Electronic package for integrated circuits and related methods
#106Analog-to-digital converter, solid-state imaging apparatus, and electronic apparatus
#107Imaging device, method of manufacturing imaging device, and electronic device
#108Capacitor with limited substrate capacitance
#109Integrated circuit copy prevention device powered by a photoelectric cell
#110HIGH QUALITY FACTOR FIN METAL OXIDE SEMICONDUCTOR VARACTOR WITH IMPROVED NUMBER OF FINS
#111TFT substrate, scanned antenna having TFT substrate, and method for manufacturing TFT substrate
#112Semiconductor device and method of controlling semiconductor device
#113Capacitor
#114Wafer dicing using femtosecond-based laser and plasma etch
#115Method of producing optical waveguides, corresponding system and device
#116Semiconductor integrated circuit device
#117SEMICONDUCTOR DEVICE
#118Wafer processing method
#119Semiconductor device including circuit having security function
#120Semiconductor device and production method
#121Semiconductor integrated circuit and control method thereof
#122Die and package
#123Method for manufacturing semiconductor device
#124Die and package
#125Semiconductor device and method of controlling the semiconductor device
#126Igniter
#127Semiconductor device and method of manufacturing the same
#128Semiconductor device
#129CHIP, MANUFACTURING METHOD, AND MOBILE TERMINAL
#130Integrating metal-insulator-metal capacitors with fabrication of vertical field effect transistors
#131Semiconductor device
#132SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#133Semiconductor device
#134ELECTROOPTICAL DEVICE, MANUFACTURING METHOD OF ELETROOPTICAL DEVICE, AND ELECTRONIC APPARATUS
#135LC composite device, processor, and method for manufacturing LC composite device
#136Secondary battery mounted chip manufacturing method
#137Switch element and load driving device
#138Semiconductor element
#139Semiconductor device
#140Scan driving circuit
#141Preparation method for heterogeneous SiGe based plasma P-I-N diode string for sleeve antenna
#142Semiconductor chip having on-chip noise protection circuit
#143On-board control device, on-board integrated circuit
#144SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#145Semiconductor device and system thereof
#146Imaging device with analog to digital coverters
#147System and method for output voltage overshoot suppression
#148Composite semiconductor device
#149Semiconductor device
#150Dynamic random access memory with low leakage current and related manufacturing method thereof
#151Semiconductor device
#152Semiconductor device, display system, and electronic device
#153TVS structures for high surge and low capacitance
#154Thin-film transistor array, image display device, and method for manufacturing thin-film transistor array
#155Semiconductor integrated circuit
#156Semiconductor device
#157On-chip monitor circuit and semiconductor chip
#158Nitride semiconductor device
#159Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object
#160Sensor system and device
#161Analog-to-digital converter, solid-state imaging apparatus, and electronic apparatus
#162Semiconductor device
#163Thin-film device
#164Semiconductor device
#165Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film
#166Multi-finger transistor and semiconductor device
#167Semiconductor device
#168Sensor device including diode elements connected in series in opposite directions to each other
#169LAYOUT STRUCTURE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
#170Method of manufacturing semiconductor device
#171Semiconductor device
#172TVS structures for high surge and low capacitance
#173Semiconductor integrated circuit
#174Semiconductor device
#175Multiple-unit semiconductor device
#176Pseudo resistance circuit and charge detection circuit
#177Semiconductor device
#178Diode string implementation for electrostatic discharge protection
#179Active matrix substrate and display device including active matrix substrate
#180Semiconductor device
#181Methods of manufacturing a semiconductor device by forming a separation trench
#182Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures
#183Methods and apparatus for MOS capacitors in replacement gate process
#184Electronic component and method for manufacturing electronic component
#185Drive circuit of voltage-controlled device
#186Capacitive device
#187Method and system for CMOS image sensing device
#188Wafer dicing using femtosecond-based laser and plasma etch
#189Circuit and method for monolithic stacked integrated circuit testing
#190Semiconductor device with upset event detection and method of making
#191Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
#192Integrated circuits including a MIMCAP device and methods of forming the same for long and controllable reliability lifetime
#193Manufacturing method of semiconductor device
#194Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
#195Method of making a vertical NAND device using a sacrificial layer with air gap and sequential etching of multilayer stacks
#196Solid-state imaging device and electronic apparatus
#197Wedge bond foot jumper connections
#198Semiconductor workpiece having a semiconductor substrate with at least two chip areas
#199Analog circuits incorporating magnetic logic units
#200Three-dimensional integrated circuit having ESD protection circuit
#201Wafer processing method
#202Method of making a vertical NAND device using sequential etching of multilayer stacks
#203Diode string implementation for electrostatic discharge protection
#204Electronic structure, a battery structure, and a method for manufacturing an electronic structure
#205Wafer dicing using femtosecond-based laser and plasma etch
#206Method and system for template assisted wafer bonding
#207METHOD FOR CUTTING WAFER
#208Method of making a vertical NAND device using sequential etching of multilayer stacks
#209Simultaneous processing of multiple photonic device layers
#210Coating adhesives onto dicing before grinding and micro-fabricated wafers
#211Electrostatic discharge protection
#212Wafer dicing from wafer backside
#213SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#214Method of manufacturing a semiconductor device and a semiconductor workpiece
#215Organic light emitting diode display device having built-in touch panel and method of manufacturing the same
#216Method of forming an ESD device and structure therefor
#217Low capacitance transient voltage suppressor (TVS) with reduced clamping voltage
#218Wafer dicing using femtosecond-based laser and plasma etch
#219Silicon shaping
#220Solid-state imaging device and manufacturing method
#221Semiconductor die singulation method
#222Integrated circuit die stacks with rotationally symmetric VIAS
#223Methods and apparatus for MOS capacitors in replacement gate process
#224Electrostatic discharge protection
#225Methods of forming an anode and a cathode of a substrate diode by performing angled ion implantation processes
#226Coating adhesives onto dicing before grinding and micro-fabricated wafers
#227Low capacitance transient voltage suppressor (TVS) with reduced clamping voltage
#228Method and system for template assisted wafer bonding
#229Method and system for template assisted wafer bonding
#230Methods of Manufacturing Three Dimensional Semiconductor Devices
#231Wafer dicing using femtosecond-based laser and plasma etch
#232Method and system for CMOS image sensing device
#233Integrated circuit die stacks with rotationally symmetric vias
#234SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
#235Microelectronic component and assembly having leads with offset portions
#236Microelectronic assembly having encapsulated wire bonding leads
#237Methods for fabricating fuse programmable three dimensional integrated circuits
#238Method of fabricating high voltage device using double epitaxial growth
#239High-density packaging of integrated circuits
#240Microelectronic component and assembly having leads with offset portions
#241Methods for producing passive components on a semiconductor substrate
#242Placement of delay circuits for avoiding hold violations
#243High frequency attenuator
#244Methods for forming isolation blocks of semiconductor devices, semiconductor devices and methods for manufacturing the same
#245Structure of ESD protection circuits on BEOL layer
#246Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
#247Hybrid dicing process using a blade and laser