209379 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto Auxiliary members for bonding areas, e.g. spacers
Sub-classes:DEVICE FOR CONTROLLING TRAPPED IONS INCLUDING A SUBSTRATE MOUNTED ON AN APPLICATION BOARD
#2ELECTRONIC MODULE
#3DEVICE FOR CONTROLLING TRAPPED IONS
#4Device for controlling trapped ions and method of manufacturing the same
#5Method for fabricating semiconductor device
#6SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#7Electronic component
#8Semiconductor device with protection layer surrounding a bonding pad
#93D Chip-on-wager-on-substrate structure with via last process
#10Method for improving wire bonding strength of an image sensor
#11Chip-on-wafer package and method of forming same
#123D chip-on-wafer-on-substrate structure with via last process
#13Semiconductor device
#14MEMS having a cutout section on a concave portion between a substrate and a stationary member
#15Chip-on-wafer package and method of forming same
#163D chip-on-wafer-on-substrate structure with via last process
#17Chip-on-wafer package and method of forming same
#18Mems having a cutout section on concave portion of a substrate
#19Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement