SEMICONDUCTOR PACKAGE AND OPERATING METHOD THEREOF

BONDED DIE STRUCTURES WITH IMPROVED BONDING AND METHODS OF FORMING THE SAME

LOGIC DRIVE WITH BRAIN-LIKE ELASTICITY AND INTEGRALITY BASED ON STANDARD COMMODITY FPGA IC CHIPS USING NON-VOLATILE MEMORY CELLS

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

SACRIFICIAL TEST PAD

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE

BONDING SCHEME TO PROVIDE IMPROVED COPLANARITY AND HIGH JOINT YIELDS WITH REDUCED COSTS AND METHODS FOR FORMING THE SAME

SHIFTING CONTACT PAD FOR REDUCING STRESS

ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LINE, AND METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LINE

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SACRIFICIAL TEST PAD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Devices and Methods of Manufacturing

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE PROTECTION AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMING SAME

SEMICONDUCTOR STRUCTURE

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

PROFILE CONTROL FOR STRESS RELAXATION

Integrated circuit structure

SEMICONDUCTOR STRUCTURE

REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

Redistribution lines with protection layers and method forming same

Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof

Shifting Contact Pad for Reducing Stress

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

SEMICONDUCTOR PACKAGE

Semiconductor structure and method of manufacturing same

Redistribution layers and methods of fabricating the same in semiconductor devices

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Integrated circuit features with obtuse angles and method of forming same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DISPLAY DEVICE

Semiconductor redistribution structure with integrated test pad and method for preparing the same

Semiconductor devices including recognition marks

Semiconductor devices and methods of manufacturing

Semiconductor device having a dual material redistribution line

Package component with stepped passivation layer

Redistribution lines with protection layers and method forming same

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Silicon photonic interposer with two metal redistribution layers

DISPLAY DEVICE

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

Integrated circuit structure and fabrication method thereof

Barrier structures between external electrical connectors

Multi-bump connection to interconnect structure and manufacturing method thereof

Devices including coax-like electrical connections and methods for manufacturing thereof

Semiconductor package

Semiconductor device

Semiconductor devices and methods of manufacturing

Post passivation interconnect

Package component with stepped passivation layer

Redistribution lines with protection layers and method forming same

Integrated circuit packages having stress-relieving features

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

Semiconductor package

Semiconductor device including redistribution layer and method for fabricating the same

Semiconductor device

Semiconductor device package and method for packaging the same

Redistribution layers and methods of fabricating the same in semiconductor devices

Distribution layer structure and manufacturing method thereof, and bond pad structure

Integrated circuit features with obtuse angles and method of forming same

Integrated circuit structures and methods of forming an opening in a material

Method of forming semiconductor device having a dual material redistribution line and semiconductor device

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Fan-out interconnect structure and method for forming same

Forming bonding structures by using template layer as templates

Semiconductor device with shielding structure for cross-talk reduction

Semiconductor package having multi-level and multi-directional shape narrowing vias

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Through-substrate via structures in semiconductor devices

Integrated circuit features with obtuse angles and method forming same

Semiconductor device having a redistribution line

Bump-on-trace design for enlarge bump-to-trace distance

Semiconductor package and method of manufacturing the same

Redistribution metal and under bump metal interconnect structures and method

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Semiconductor package

Method of using a sacrificial conductive stack to prevent corrosion

Post passivation interconnect

Post-passivation interconnect structure and method of forming the same

Semiconductor structure and method for wafer scale chip package

Semiconductor package device and method of manufacturing the same

Micro-transfer-printable flip-chip structures and methods

Through-substrate conductor support

Integrated circuit structures and methods of forming an opening in a material

Dual-damascene zero-misalignment-via process for semiconductor packaging

Semiconductor device manufacturing method

Semiconductor device

Barrier structures between external electrical connectors

Reliable passivation for integrated circuits

Semiconductor package having singular wire bond on bonding pads

Semiconductor package device and method of manufacturing the same

Semiconductor device and semiconductor package including the same

Semiconductor device with shielding structure for cross-talk reduction

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Dual-damascene zero-misalignment-via process for semiconductor packaging

Semiconductor logic device and system and method of embedded packaging of same

Package structures

Semiconductor package assembly

Redistribution metal and under bump metal interconnect structures and method

Micro-transfer-printable flip-chip structures and methods

Semiconductor chip including a plurality of pads

Semiconductor device

Semiconductor device and a corresponding method of manufacturing semiconductor devices

Semiconductor device and a corresponding method of manufacturing semiconductor devices

Electronic device including redistribution layer pad having a void

Fan-out structure and manufacture thereof

Post-passivation interconnect structure and method of forming the same

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package device and method of manufacturing the same

Chip structure having redistribution layer

Method of forming semiconductor device having a dual material redistribution line

Package structure

Semiconductor device

Fan-out semiconductor package

Forming bonding structures by using template layer as templates

Fan-out semiconductor package

Semiconductor device manufacturing method

SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER

Redistribution layer structure and fabrication method therefor

Post passivation interconnect and fabrication method therefor

Method for manufacturing redistribution layer

Semiconductor device and manufacturing method thereof

Wafer level package and method

Fan-out semiconductor package

Semiconductor device

Semiconductor device

Conductive pad structure for hybrid bonding and methods of forming same

Fan-out semiconductor package

Fan-out semiconductor package

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package assembly

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Fan-out semiconductor package

Wafer-level chip-size package with redistribution layer

Methods and apparatus of packaging semiconductor devices

Barrier structures between external electrical connectors

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Reliable passivation for integrated circuits

METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE ASSEMBLY

Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad

Contact pad for semiconductor devices

Semiconductor device and semiconductor package including the same

Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Interconnect structures for fine pitch assembly of semiconductor structures and related techniques

Semiconductor chip including a plurality of pads

Semiconductor device

Semiconductor chip, semiconductor package including the same, and method of fabricating the same

Method of fabricating chip package with laser

Method of packaging semiconductor devices

Semiconductor device and its manufacturing method

Packaging devices and methods of manufacture thereof

Method of forming a semiconductor device with bump stop structure

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Packaging devices and methods of manufacture thereof

Conductive pad structure for hybrid bonding and methods of forming same

Fan-out interconnect structure and method for forming same

Method of forming redistribution layer

Packaging devices and methods of manufacture thereof

Integrated circuit die with corner IO pads

Image sensor packages and methods of fabricating the same

Chip module and method for forming the same

Chip package and method for forming the same

Bump-on-trace design for enlarge bump-to-trace distance

Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad

Semiconductor structure with oval shaped conductor

Contact pad for semiconductor devices

Substrate structure and method of manufacturing the same

Semiconductor device and method of forming double-sided fan-out wafer level package

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing

Semiconductor device

Chip package and method for forming the same

SEMICONDUCTOR DEVICE

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Chip package and method thereof

Methods and apparatus of packaging semiconductor devices

Packaging devices and methods of manufacture thereof

Copper post structure for wafer level chip scale package

Conductive pad structure for hybrid bonding and methods of forming same

Packaging devices and methods of manufacture thereof

ESD protection device

Chip package

Chip package and method for forming the same

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Fan-out interconnect structure and method for forming same

Chip package and method for forming the same

Packaging devices and methods of manufacture thereof

Fabrication method of wiring structure for improving crown-like defect

Post-passivation interconnect structure and method of forming the same

Electrical connection for chip scale packaging

Semiconductor package with improved redistribution layer design and fabricating method thereof

Metal pads with openings in integrated circuits

Wire-based methodology of widening the pitch of semiconductor chip terminals

WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD

Electronic components assembly

Integrated circuit and method of manufacturing the same

Integrated circuit chip using top post-passivation technology and bottom structure technology

ESD protection device

Methods and apparatus of under bump metallization in packaging semiconductor devices

Semiconductor device and method

Composite layered chip package

Forming wafer-level chip scale package structures with reduced number of seed layers

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

Electrical connection for chip scale packaging

Semiconductor device having a trace comprises a beveled edge

Solder bump interconnect

Semiconductor device and method for manufacturing the same

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

Interconnection structure

Wiring structure for improving crown-like defect and fabrication method thereof

Electrical connector between die pad and z-interconnect for stacked die assemblies

Chip structure having redistribution layer

Crack arrest vias for IC devices

Manufacturing method of semiconductor device

Chip assembly having via interconnects joined by plating

Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

Semiconductor device having pad structure with stress buffer layer

Semiconductor device and manufacturing method of semiconductor device

SEMICONDUCTOR DEVICE

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis

Semiconductor device having a multilayer structure

Integrated circuit system with stress redistribution layer and method of manufacture thereof

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Wafer level chip scale package without an encapsulated via

Solder bump interconnect

Semiconductor device and method for making the same

Thin-film capacitor having a connecting part of a lead conductor disposed within an opening in a protective layer

Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers

Under land routing

SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF AND STACK PACKAGE USING THE SAME

Semiconductor with Bottom-Side Wrap-Around Flange Contact

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor module having semiconductor device mounted on device mounting substrate

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

Semiconductor device and manufacturing method thereof

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

Semiconductor device and method of fabricating semiconductor device

Methods of making compliant semiconductor chip packages

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

Semiconductor with bottom-side wrap-around flange contact

Wafer level edge stacking

Bump structure for a semiconductor device and method of manufacture

Semiconductor device and manufacturing method of the same

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Electrical connecting structure and bonding structure

Device mounting board, and semiconductor module and manufacturing method therefor

Method for manufacturing a wafer level package

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Methods for fabricating sub-resolution alignment marks on semiconductor structures

I/O pad structures for integrated circuit devices

Flip chip structure and method of manufacture

INTERCONNECT ASSEMBLIES AND METHODS

Solder bump interconnect for improved mechanical and thermo-mechanical performance

Semiconductor module manufacturing method, semiconductor module, and mobile device

BUMP STRUCTURE

Semiconductor device and method for manufacturing the same

Highly reliable low cost structure for wafer-level ball grid array packaging

Semiconductor device including redistribution line structure and method of fabricating the same

Thin-film capacitor

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

Methods of forming electronic structures including conductive shunt layers and related structures

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Wafer level chip scale packaging structure and method of fabricating the same

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Semiconductor device and method of manufacturing the same

Methods of forming electronic structures including conductive shunt layers and related structures

Substrate for solder joint

Bump structure for a semiconductor device and method of manufacture

Method of routing an electrical connection on a semiconductor device and structure therefor

Semiconductor device with strain relieving bump design