209435 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bonding area, e.g. solder flow barrier
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#2BOND FEATURES FOR REDUCING NON-BOND AND METHODS OF FORMING THE SAME
#3DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
#4SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
#5UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMATION
#6Method for packaging stacking flip chip
#7Bond Features For Reducing Non-Bond and Methods of Forming the Same
#8SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#9BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME
#10MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
#11INTEGRATED CIRCUIT HAVING EXPOSED LEADS
#12Semiconductor Device and Method of Forming Dummy vias in WLP
#13SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
#14Bonding structures of integrated circuit devices and method forming the same
#15DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
#16SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#17STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
#18DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS FOR MANUFACTURING THE SAME
#19SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
#20Semiconductor die with solder restraining wall
#21Display backboard and manufacturing method thereof and display device
#22INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#23ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
#24Semiconductor device and method of manufacturing semiconductor device
#25Semiconductor package and manufacturing method thereof
#26CONTACT STRUCTURES FOR DIRECT BONDING
#27Bonding structures of integrated circuit devices and method forming the same
#28Substrate structure, semiconductor package structure and method for manufacturing a substrate structure
#29Bonding structures of semiconductor devices
#30COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
#31WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#32Interconnect structures for preventing solder bridging, and associated systems and methods
#33Semiconductor structure and method for wafer scale chip package
#34Interconnect structures for preventing solder bridging, and associated systems and methods
#35Structure and method for semiconductor packaging
#36Array substrate
#37High-voltage MOSFET structures
#38Semiconductor devices having metal posts for stress relief at flatness discontinuities
#39Final passivation for wafer level warpage and ULK stress reduction
#40SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
#41Collars for under-bump metal structures and associated systems and methods
#42Semiconductor device and method of making a semiconductor device
#43Interconnect structures for fine pitch assembly of semiconductor structures and related techniques
#44Collars for under-bump metal structures and associated systems and methods
#45Substrate structure with selective surface finishes for flip chip assembly
#46Conductive pillar shaped for solder confinement
#47Method for positioning a carrier with electronic components and electronic component produced with such method
#48Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#49Wire bond mold lock method and structure
#50Semiconductor chip and method of manufacturing the same
#51Semiconductor device with post-passivation interconnect structure and method of forming the same
#52PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
#53Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#54Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#55Waterfall wire bonding
#56Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#57Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon
#58Semiconductor device and method for manufacturing the same
#59Interconnect structures for preventing solder bridging, and associated systems and methods
#60Final passivation for wafer level warpage and ULK stress reduction