209436 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for aligning the bonding area, e.g. marks, spacers
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR DIE AND METHODS OF FORMATION
#3METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#4FINE-PITCH JOINING PAD STRUCTURE
#5SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
#6INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#7ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD FOR MOUNTING BOARD
#8Method for permanent connection of two metal surfaces
#9Semiconductor device having alignment pads and method of manufacturing the same
#10Method for preparing a semiconductor device with spacer over sidewall of bonding pad
#11Semiconductor device with interconnect structure and method for preparing the same
#12Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same
#13Integrated circuit backside metallization
#14Integrated circuit backside metallization
#15Methods of forming connector pad structures, interconnect structures, and structures thereof
#16Methods of forming connector pad structures, interconnect structures, and structures thereof
#17Semiconductor device and a corresponding method of manufacturing semiconductor devices
#18VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
#19Methods of forming connector pad structures, interconnect structures, and structures thereof
#20Semiconductor structure with sacrificial anode and method for forming
#21Method for permanent connection of two metal surfaces
#22Semiconductor device package and method of the same
#23Semiconductor structure with sacrificial anode and passivation layer and method for forming
#24Method for manufacturing semiconductor devices having a glass substrate
#25Method for permanent connection of two metal surfaces
#26Method for manufacturing semiconductor devices having a glass substrate
#27Method for manufacturing semiconductor devices having a glass substrate