209437 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for protecting parts during the process
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#2WAFER STACKING METHOD AND WAFER STACK STRUCTURE
#3INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#4CAP LAYER FOR PAD OXIDATION PREVENTION
#5Aluminum Oxide Crystallization Barrier for Hybrid Bonding
#6METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE
#7SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#8METHOD AND APPARATUS FOR IMPROVED WAFER COATING
#9FILM STRUCTURE FOR BOND PAD
#10SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
#11INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME
#12CAP LAYER FOR PAD OXIDATION PREVENTION
#13APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME
#14INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CONTACT WITH A HIGH VOLTAGE BONDING PAD AND METHOD OF MAKING
#15STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
#16Adding Sealing Material to Wafer edge for Wafer Bonding
#17DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY DEVICE INCLUDING THE SAME
#18DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
#19THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
#20Stacked semiconductor structure and method
#21METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#22MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#23SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFACTURING THESE
#24INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#25Apparatus including integrated segments and methods of manufacturing the same
#26Integrated circuit chip including a passivation nitride layer in contact with a high voltage bonding pad and method of making
#27METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT
#28Semiconductor structure
#29Method and apparatus for improved wafer coating
#30Interposer, method for fabricating the same, and semiconductor package having the same
#31Semiconductor device with edge-protecting spacers over bonding pad
#32Film structure for bond pad
#33Semiconductor structures with via openings and methods of making the same
#34Semiconductor device with spacer over bonding pad
#35Method for manufacturing a wafer level chip scale package (WLCSP)
#36Semiconductor package and manufacturing method of semiconductor package
#37Solder joints on nickel surface finishes without gold plating
#38Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#39Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#40Packaged semiconductor device with electroplated pillars
#41Display panel, manufacturing method of display panel, and display device
#42Semiconductor packaging method and semiconductor package device
#43Stacked semiconductor structure and method
#44Semiconductor device with edge-protecting spacers over bonding pad
#45Semiconductor device and method of manufacturing the semiconductor device
#46Semiconductor device with spacer over bonding pad
#47Film structure for bond pad
#48Bond pad reliability of semiconductor devices
#49Semiconductor structure and method for forming the same
#50Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#51Packaged semiconductor device with electroplated pillars
#52Semiconductor device and method of manufacturing a semiconductor device
#53Stacked semiconductor structure and method
#54Contact hole structure and fabricating method of contact hole and fuse hole
#55Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#56Display device and preparation method therefor
#57Fabrication method of semiconductor structure
#58Display device and method of manufacturing the same
#59Display substrate, production method thereof, and display apparatus
#60Stacked semiconductor structure and method
#61Semiconductor structure and method for forming the same
#62Method of manufacturing semiconductor device
#63Method of forming solder bumps
#64Semiconductor device and method of manufacturing a semiconductor device
#65Semiconductor device and method of manufacturing a semiconductor device
#66Semiconductor device and method of manufacturing the same
#67Semiconductor devices having metal posts for stress relief at flatness discontinuities
#68Contact hole structure and fabricating method of contact hole and fuse hole
#69Method of forming solder bumps
#70Method of forming solder bumps
#71PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
#72Stacked semiconductor structure and method
#73Fabrication method of semiconductor structure
#74Pre-plated substrate for die attachment
#75Display device and method of manufacturing the same
#76Semiconductor structure with sacrificial anode and method for forming
#77Semiconductor structure and method of fabricating the same
#78Stacked semicondcutor structure and method
#79Stacked semiconductor structure and method
#80Semiconductor device with post-passivation interconnect structure and method of forming the same
#81Leadless semiconductor package with optical inspection feature
#82Semiconductor structure with sacrificial anode and passivation layer and method for forming
#83SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS
#84Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
#85Method for manufacturing semiconductor devices having a glass substrate
#86Method for manufacturing semiconductor devices having a glass substrate
#87Method for manufacturing semiconductor devices having a glass substrate
#88WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING
#89Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#90Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#91Process for making a semiconductor device having a roughened surface
#92Semiconductor device and manufacturing method thereof