209451 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in liquid form Spin coating
CONDUCTIVE POLYMER MATERIALS FOR HYBRID BONDING
#2SEMICONDUCTOR PACKAGE STRUCTURE WITH IMPROVED DIE PAD AND METHOD THEREOF
#3BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#4BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#5SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#6SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#7BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#8BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#9STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
#10Semiconductor packages with an intermetallic layer
#11Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#12Method of forming a photoresist over a bond pad to mitigate bond pad corrosion
#13IR assisted fan-out wafer level packaging using silicon handler
#14BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE
#15Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#16Structure and method for semiconductor packaging
#17Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#18IR assisted fan-out wafer level packaging using silicon handler
#19Final passivation for wafer level warpage and ULK stress reduction
#20Barrier layer for interconnects in 3D integrated device
#21IR assisted fan-out wafer level packaging using silicon handler
#22Semiconductor packages with an intermetallic layer
#23Integration of backside heat spreader for thermal management
#24Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#25Integration of backside heat spreader for thermal management
#26Semiconductor arrangement and formation thereof
#27SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
#28Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
#29Semiconductor device
#30Final passivation for wafer level warpage and ULK stress reduction