209454 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in liquid form by dipping, e.g. in a solder bath
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
#2Contact structures with porous networks for solder connections, and methods of fabricating same
#3Three dimensional microelectronic components and fabrication methods for same
#4THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHODS FOR SAME
#5Semiconductor device