209455 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in liquid form Immersion coating, e.g. in a solder bath
SEMICONDUCTOR PACKAGING METHOD INCLUDING FORMING BOND CONNECTIONS WITH SUPPRESSED COPPER OUTDIFFUSION
#2Barrier structures between external electrical connectors
#3Barrier structures between external electrical connectors
#4Acoustic wave resonator and method for manufacturing the same
#5Remapped packaged extracted die
#6Repackaged integrated circuit assembly method
#7INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND FORMING METHODS
#8Semiconductor device and method of making a semiconductor device
#9Radio frequency integrated circuit module
#10Repackaged integrated circuit and assembly method
#11Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias
#12Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#13Method of forming post-passivation interconnect structure
#14Method for processing a semiconductor workpiece and semiconductor workpiece
#15Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
#16Method of fabricating bump structure and bump structure
#17Copper pillar bump and flip chip package using same
#18Methods to fabricate a radio frequency integrated circuit
#19Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
#20Method of forming bump structure
#21Power device and power device module
#22Post-passivation interconnect structure and method of forming the same
#23Wire bond pad system and method
#24SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
#25Under-bump metallization (UBM) structure and method of forming the same
#26Method of fabricating bump structure
#27Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device