209456 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in liquid form Chemical solution deposition [CSD], i.e. using a liquid precursor
MICROELECTRONIC DEVICES, AND RELATED METHODS AND MEMORY DEVICES
#2Method of forming a semiconductor device comprising top conductive pads
#3Methods for forming pillar bumps on semiconductor wafers
#4Mechanically anchored backside C4 pad