209491 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material using a laser or a focused ion beam [FIB]
Sub-classes:SEMICONDUCTOR PACKAGE INCLUDING THROUGH ELECTRODE
#2MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
#3ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#4LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
#5SEMICONDUCTOR PACKAGE
#6INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#7Die-Beam Alignment for Laser-Assisted Bonding
#8ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTURING THE SAME
#9MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
#10DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY DEVICE INCLUDING THE SAME
#11INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#12METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT
#13Die-beam alignment for laser-assisted bonding
#14Integration and bonding of micro-devices into system substrate
#15Light-emitting device
#16Integration and bonding of micro-devices into system substrate
#17Device architecture