H01L2224/03902 - CPC Classification Index

ClassID:

209514 ⎘

H01L2224/03902 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Methods of manufacturing bonding areas involving a specific sequence of method steps with repetition of the same manufacturing step Multiple masking steps

Recent Application in this class:

20150214162

2015-07-30

Passive component structure and manufacturing method thereof

20120261812

2012-10-18

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION

20110233769

2011-09-29

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

20100081269

2010-04-01

Method for manufacturing semiconductor device having electrode for external connection