209517 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Methods of manufacturing bonding areas involving a specific sequence of method steps the bonding area, e.g. under bump metallisation [UBM], being used as a mask for patterning other parts
Semiconductor Device and Method
#2DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY ENHANCEMENT
#3REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
#4Chip package structure
#5SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
#6Semiconductor device and method
#7SEMICONDUCTOR DEVICE
#8Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same
#9Chip package structure
#10Package structure and method of fabrcating the same
#11Silicon photonic interposer with two metal redistribution layers
#12Semiconductor device and method
#13Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#14Semiconductor device
#15Semiconductor device bonding area including fused solder film and manufacturing method
#16Semiconductor package and method of fabricating the same
#17Method of fabricating package structure
#18Semiconductor device
#19Chip package structure
#20Semiconductor structure and method for forming the same
#21Semiconductor device
#22Scheme for connector site spacing and resulting structures
#23Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#24Semiconductor device
#25Hollow metal pillar packaging scheme
#26SYSTEMS AND METHODS FOR WAFER-LEVEL MANUFACTURING OF DEVICES HAVING LAND GRID ARRAY INTERFACES
#27Semiconductor devices and semiconductor devices including a redistribution layer
#28Bond structures and the methods of forming the same
#29Multiple plated via arrays of different wire heights on same substrate
#30Semiconductor device bonding area including fused solder film and manufacturing method
#31Semiconductor device
#32Semiconductor device and a corresponding method of manufacturing semiconductor devices
#33Integrated circuit system with carrier construction configuration and method of manufacture thereof
#34Semiconductor package and method of fabricating the same
#35Multiple bond via arrays of different wire heights on a same substrate
#36Semiconductor device
#37Bond structures and the methods of forming the same
#38Semiconductor device and method for manufacturing the same
#39Semiconductor device and method of manufacturing the same
#40Semiconductor device
#41Hollow metal pillar packaging scheme
#42Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the same
#43Manufacturing method of semiconductor package
#44Semiconductor devices including conductive pillars
#45Copper structures with intermetallic coating for integrated circuit chips
#46Power MOSFET
#47Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
#48Integrated circuit chip and integrated circuit wafer with guard ring
#49Hollow metal pillar packaging scheme
#50Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#51Semiconductor structure
#52Integrated circuit package
#53Use of electrical power multiplication for power smoothing in power distribution
#54Scheme for connector site spacing and resulting structures
#55Method of manufacturing wafer level packaging including through encapsulation vias
#56Semiconductor device
#57Semiconductor device and method for producing semiconductor device
#58Semiconductor device
#59Reliable device assembly
#60Power MOSFET and manufacturing method thereof
#61Semiconductor device and manufacturing method of same
#62Hollow metal pillar packaging scheme
#63Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
#64Package having substrate with embedded metal trace overlapped by landing pad
#65Integrated device package comprising photo sensitive fill between a substrate and a die
#66Scheme for connector site spacing and resulting structures
#67Multiple bond via arrays of different wire heights on a same substrate
#68Multiple bond via arrays of different wire heights on a same substrate
#69Semiconductor device having solderable and bondable electrical contact pads
#70Semiconductor device
#71Integrated circuit package
#72Mechanically anchored backside C4 pad
#73Copper post structure for wafer level chip scale package
#74Semiconductor device
#75Package having substrate with embedded metal trace overlapped by landing pad
#76Chip stack with electrically insulating walls
#77Semiconductor device and method for producing the same
#78Semiconductor device and method for manufacturing the same
#79Semiconductor device for use in flip-chip bonding, which reduces lateral displacement
#80Semiconductor device
#81Hollow metal pillar packaging scheme
#82Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing
#83Semiconductor device
#84Method of forming a reliable microelectronic assembly
#85Semiconductor device
#86Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
#87Transistor formation using cold welding
#88Transistor formation using cold welding
#89Plating structure for wafer level packages
#90Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
#91Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections
#92Semiconductor device and manufacturing method of same
#93Semiconductor Constructions and Methods of Forming Semiconductor Constructions
#94Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts
#95Shallow via formation by oxidation
#96Semiconductor device
#97Semiconductor constructions
#98Self-aligned polymer passivation/aluminum pad
#99Bumping process and structure thereof
#100Integrated Circuit Die And Method Of Fabricating
#101Semiconductor devices with compliant interconnects
#102WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF
#103Methods of fabricating semiconductor chip solder structures
#104Bumping process and structure thereof
#105Methods of forming a metal pattern
#106Etchant and method for manufacturing semiconductor device using same
#107Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
#108SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#109BALL GRID ARRAY METHOD AND STRUCTURE
#110Solder bump connections
#111Method of forming semiconductor die
#112Method for fabricating bump structure without UBM undercut
#113Methods of forming a metal pattern and semiconductor device structure
#114Semiconductor device and method for manufacturing the same
#115Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
#116Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
#117Chip-size-package semiconductor chip and manufacturing method
#118Semiconductor device
#119Method for manufacturing semiconductor device having electrode for external connection
#120Methods of forming solder connections and structure thereof
#121Semiconductor device
#122UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION
#123SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME
#124Method to create a metal pattern using a damascene-like process
#125Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
#126Methods of forming electronic structures including conductive shunt layers and related structures
#127Flip chip package and method of fabricating the same
#128Methods of forming solder connections and structure thereof
#129Method for Electroplating and Contact Projection Arrangement
#130Intermediate semiconductor device structures
#131Use of electrical power multiplication for power smoothing in power distribution
#132Systems and methods for power smoothing in power distribution
#133Methods of forming electronic structures including conductive shunt layers and related structures
#134INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
#135High performance system-on-chip discrete components using post passivation process
#136High performance system-on-chip discrete components using post passivation process
#137Bath and method for high rate copper deposition
#138Processes and tools for forming lead-free alloy solder precursors
#139Under-bump metallization layers and electroplated solder bumping technology for flip-chip
#140Chip package structure and method for forming the same