209518 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Methods of manufacturing bonding areas involving a specific sequence of method steps a passivation layer being used as a mask for patterning the bonding area
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
#2METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
#3SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
#4Patterned and planarized under-bump metallization
#5Passivation structure with planar top surfaces
#6Through silicon via design for stacking integrated circuits
#7Passivation structure with planar top surfaces
#8Method for fabricating semiconductor device
#9Through silicon via design for stacking integrated circuits
#10Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#11SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#12Connector structure and method of forming same
#13Semiconductor structure and manufacturing method thereof
#14Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
#15Through silicon via design for stacking integrated circuits
#16Vias with metal caps for underlying conductive lines
#17Through silicon via design for stacking integrated circuits
#18Through silicon via design for stacking integrated circuits
#19Connector structure and method of forming same
#20Fabrication method of semiconductor structure
#21Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#22Semiconductor devices and semiconductor devices including a redistribution layer
#23Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#24Method of forming a contact
#25Semiconductor devices including conductive pillars
#26Fabrication method of semiconductor structure
#27Connector structure and method of forming same
#28Semiconductor device with metal structure electrically connected to a conductive structure
#29Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
#30Semiconductor structure and method of fabricating the same
#31Semiconductor devices including protected barrier layers
#32Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products
#33SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION
#34Etchant and method for manufacturing semiconductor device using same
#35Chip bump structure and method for forming the same
#36SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#37Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit