Semiconductor device and method

Thermal dissipation in semiconductor devices

Packages with metal line crack prevention design

Semiconductor packages with an intermetallic layer

Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging

Semiconductor package structure and method for manufacturing the same

Package structures and methods of forming the same

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

Integrated circuit package and method of forming same

Semiconductor devices including seed structure and method of manufacturing the semiconductor devices

Electronics assemblies employing copper in multiple locations

Semiconductor device

Electronic package, manufacturing method thereof and conductive structure

Package structure

Electronic discharge device and split multi rail network with symmetrical layout design technique

Solderless interconnection structure and method of forming same

Integrated circuit package with integrated voltage regulator

3D IC method and device

Semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor packages

Manufacturing method of a semiconductor package

Wafer level chip scale packaging intermediate structure apparatus and method

Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die

Semiconductor package and method

Semiconductor device with conductive protrusions and method for fabricating the same

Substrate and package structure

Semiconductor device and manufacturing method thereof

Metal bumps and method forming same

Semiconductor device and semiconductor package

Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the same

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

Semiconductor Device and Method

Semiconductor device package including stress buffering layer

Semiconductor device and semiconductor device manufacturing method

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Semiconductor devices including a thick metal layer and a bump

3D IC method and device

Antenna with graded dielectirc and method of making the same

Semiconductor device having laterally offset stacked semiconductor dies

Semiconductor package having varying conductive pad sizes

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Method of manufacturing semiconductor device

Integrated circuit packages having mechanical brace standoffs

Manufacturing method of carrier for semiconductor chip mounting thereon

SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT

Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

Semiconductor device with integrated heat distribution and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor package

Method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the same

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

Packaged die and RDL with bonding structures therebetween

Low pressure sintering powder

Package structure with underfill

SEMICONDUCTOR PACKAGES

Semiconductor package system and method

Flip chip packaging rework

Chip package with redistribution structure having multiple chips

Reducing loss in stacked quantum devices

Mixed under bump metallurgy (UBM) interconnect bridge structure

Semiconductor structure and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of making a wafer-level chip-scale package

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression bonding with passivated copper-based contacting metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Semiconductor device and method of manufacturing the same

Semiconductor packages and methods of forming the same

Structures and methods for low temperature bonding using nanoparticles

Semiconductor structure and method of fabricating the same

Conductive bump of a semiconductor device and fabricating method thereof

Semiconductor package

Semiconductor device and method of manufacture

Thermocompression bonding with passivated nickel-based contacting metal

Thermocompression bonding using metastable gas atoms

Transistor level interconnection methodologies utilizing 3D interconnects

3D image sensor

Stacked semiconductor die assemblies with partitioned logic and associated systems and methods

Chip on Package Structure and Method

Semiconductor devices including thick pad

Package with metal-insulator-metal capacitor and method of manufacturing the same

Packaging mechanisms for dies with different sizes of connectors

Passivation layer for integrated circuit structure and forming the same

SEMICONDUCTOR DEVICE HAVING STACKED CHIPS

Pre-molded leadframes in semiconductor devices

Methods of manufacturing a semiconductor device including a joint adjacent to a post

Semiconductor structure and manufacturing method thereof

Electrical connection placement of semiconductor device package and method of manufacturing the same

Semiconductor package

Modular WLCSP die daisy chain design for multiple die sizes

Integrated circuit component and package structure having the same

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

Photonic semiconductor device and method

Interconnect structure with redundant electrical connectors and associated systems and methods

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

WLCSP package with different solder volumes

Microelectronic devices and apparatuses having a patterned surface structure

Method for preparing a semiconductor device with spacer over sidewall of bonding pad

Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same

Semiconductor device package and method of manufacturing the same

3DI solder cup

Info structure with copper pillar having reversed profile

Semiconductor device assembly with surface-mount die support structures

Semiconductor package and manufacturing method thereof

Methods for forming substrate terminal pads, related terminal pads and substrates and assemblies incorporating such terminal pads

Brass-coated metals in flip-chip redistribution layers

Semiconductor device with interconnect structure and method for preparing the same

Multi-die memory device

Semiconductor device

Semiconductor package

Semiconductor packages including stacked substrates and penetration electrodes

Semiconductor package

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Conductive traces in semiconductor devices and methods of forming same

Package structures and method of forming the same

Semiconductor device with a protection mechanism and associated systems, devices, and methods

Semiconductor device assembly with pillar array

Semiconductor devices with package-level configurability

Stacked chips comprising interconnects

Contact pad for semiconductor device

Method for manufacturing a semiconductor device including patterning a polymer layer to reduce stress

Semiconductor device assembly with die support structures

Semiconductor package

Through-substrate via structure and method of manufacture

Pillar-last methods for forming semiconductor devices

Back-illuminated semiconductor photodetection element

High density interconnection using fanout interposer chiplet

Semiconductor package with protected sidewall and method of forming the same

IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

Composition for cobalt or cobalt alloy electroplating

Variation of metal layer stack under under bump metallization (UBM)

Device and Method for UBM/RDL Routing

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device and method of manufacturing the semiconductor device

Display device

Conductive members for die attach in flip chip packages

Bump structure and method of manufacturing bump structure

Semiconductor device with spacer over bonding pad

Bond pads of semiconductor devices

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor package including a pad pattern

Semiconductor components having conductive vias with aligned back side conductors

Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip

Semiconductor device

Sawing underfill in packaging processes

Passive devices in package-on-package structures and methods for forming the same

Through-Substrate Vias with Improved Connections

Semiconductor device with contact pad and method of making

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Flip-chip device

Connector structure and method of forming same

Semiconductor device bonding area including fused solder film and manufacturing method

Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same

Chip structure and method for forming the same

PACKAGE STRUCTURE WITH BUMP

Fan-out semiconductor package and electronic device including the same

Package structure and method for forming the same

Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device

Wafer chip scale package

Semiconductor package and method of fabricating the same

MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM

Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar

Electronic package, packaging substrate, and methods for fabricating the same

Alignment carrier for interconnect bridge assembly

Semiconductor devices including a thick metal layer

SILICON ON DIAMOND THERMAL AND SHIELDING MITIGATION

Stacked semiconductor devices and methods of forming same

Redistribution layers and methods of fabricating the same in semiconductor devices

Film structure for bond pad

Semiconductor device and method

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Method for manufacturing a semiconductor device having a dummy section

Semiconductor structure and manufacturing method thereof

Shielding structures

Wafer-level package including under bump metal layer

SEMICONDUCTOR DEVICE

Integrated circuit structure

Package structure and method of fabricating the same

Semiconductor device and manufacturing method thereof

Method of forming an interconnect in a semiconductor device

Fingerprint sensor device and method

Semiconductor device packages and methods of manufacturing the same

Connection arrangement, component carrier and method of forming a component carrier structure

Semiconductor device having first and second terminals

Semiconductor die contact structure and method

Compound semiconductor device

Manufacturing method of chip package

Semiconductor package and manufacturing method thereof

Integrated circuit device having redistribution pattern

IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures

Metal layer patterning for minimizing mechanical stress in integrated circuit packages

Semiconductor device for reducing concentration of thermal stress acting on bonding layers

Semiconductor package with leadframe interconnection structure

Semiconductor chip with solder cap probe test pads

Semiconductor device and amplifier assembly

Semiconductor device and inverter

Semiconductor device package and method of manufacturing the same

Sawing underfill in packaging processes

Semiconductor package

Package and manufacturing method thereof

Semiconductor with through-substrate interconnect

Interconnect structure and method of forming same

Package substrate and semiconductor package including the same

Leadframe package with side solder ball contact and method of manufacturing

Semiconductor device packages including an inductor and a capacitor

Semiconductor package and method of fabricating the same

Semiconductor devices including a thick metal layer and a bump

Package structure and manufacturing method thereof

Semiconductor device and method of forming micro interconnect structures

Front-to-back bonding with through-substrate via (TSV)

Fan-out package with cavity substrate

Package-on-package assembly with wire bond vias

Bump structure having a side recess and semiconductor structure including the same

Method for forming package structure with a barrier layer

Semiconductor bonding structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Pad structure for front side illuminated image sensor

Wirebondable interposer for flip chip packaged integrated circuit die

Semiconductor package with thick under-bump terminal

Polymer resin and compression mold chip scale package

Packaging devices and methods of manufacture thereof

Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages

Semiconductor image sensor module and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Three-dimensional integrated circuit structures and methods of manufacturing the same

Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof

Semiconductor devices having crack-inhibiting structures

Wafer-level stack chip package and method of manufacturing the same

Method of forming semiconductor device having a dual material redistribution line and semiconductor device

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Integrated circuit package and method

Semiconductor device

Multi-stacked package-on-package structures

Stacked semiconductor device assembly in computer system

Package structure

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Thermal pads between stacked semiconductor dies and associated systems and methods

Method of manufacturing semiconductor package structure

Chip package structure

Method of manufacturing package structure

Electrical connection structure and method of forming the same

Method for forming semiconductor structure

System-in-package with double-sided molding

Package structure

Semiconductor package

Semiconductor devices and semiconductor packages including the same

Semiconductor structure

INTEGRATED CIRCUIT STRUCTURE

Package structures and methods of forming the same

Semiconductor device and method to minimize stress on stack via

Package structure and method of forming thereof

Semiconductor device and method of forming SIP module over film layer

Electrical overstress detection device

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Stack packages including a supporting substrate

Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices

Method of manufacturing intergrated fan-out package with redistribution structure

Localized high density substrate routing

Integrated circuit device with bonding structure and method of forming the same

Semiconductor device package with stress buffering layer and method for manufacturing the same

Tool for metal plugging or sealing of casing

Semiconductor structure and manufacturing method thereof

Air channel formation in packaging process

Warpage control of semiconductor die

Semiconductor device structure having protection caps on conductive lines

Method of producing electroconductive substrate, electronic device and display device

Method for manufacturing semiconductor device with metallization structure

Vertical inductor for WLCSP

III-N transistor arrangements for reducing nonlinearity of off-state capacitance

Enhancement-depletion cascode arrangements for enhancement mode III-N transistors

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor package

Conductive external connector structure and method of forming

Integrated circuit structures with contoured interconnects

SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF

Die-on-interposer assembly with dam structure and method of manufacturing the same

Package structure with dummy die

Via structure for packaging and a method of forming

Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Package-on-package and package connection system comprising the same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor package and manufacturing method thereof

Semiconductor substrate and manufacturing method therefor

Multi-chip package and method of providing die-to-die interconnects in same

Through-hole electrode substrate

Method of manufacturing a flip chip package and an apparatus for testing flip chips

Semiconductor device having laterally offset stacked semiconductor dies

Memory device

Semiconductor package and manufacturing method thereof

Semiconductor package device and method of manufacturing the same

Protective layer for contact pads in fan-out interconnect structure and method of forming same

Integrated fan-out package structures with recesses in molding compound