209522 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
Method of manufacturing package structure
#1502Package structure
#1503INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
#1504Method for forming superconducting structures
#1505Semiconductor device
#1506Methods of forming integrated circuit structure for joining wafers and resulting structure
#1507Semiconductor chip
#15083DI solder cup
#1509Guard ring for photonic integrated circuit die
#1510Conformal dummy die
#1511Multi-stacked package-on-package structures
#1512Integrated fan-out package and method for fabricating the same
#1513Semiconductor package
#1514Stacked semiconductor devices and methods of forming same
#1515Semiconductor package including thermal relaxation block and manufacturing method thereof
#1516Semiconductor package and manufacturing method thereof
#1517Signal delivery in stacked device
#1518Via structure for packaging and a method of forming
#1519Method of forming a solder bump structure
#1520Semiconductor package having varying conductive pad sizes
#1521Package structure and manufacturing method thereof
#1522Scheme for connector site spacing and resulting structures
#1523Chip structure and method for forming the same
#1524Method of using a sacrificial conductive stack to prevent corrosion
#1525Device package including molding compound having non-planar top surface around a die and method of forming same
#1526Contact pad for semiconductor device
#1527Post passivation interconnect
#1528Fan-out semiconductor package
#1529Semiconductor device
#1530Shielded fan-out packaged semiconductor device and method of manufacturing
#1531Manufacturing method of semiconductor package
#1532Semiconductor device and manufacturing method thereof
#1533Chip packages and methods of manufacture thereof
#1534Package structure and bonding method thereof
#1535Integrated circuit structure having dies with connectors of different sizes
#1536Bridge interconnection with layered interconnect structures
#1537Fan-out semiconductor package and electronic device including the same
#1538Integrated circuit component and package structure having the same
#1539POST CMP PROCESSING FOR HYBRID BONDING
#1540Chip package assembly with enhanced interconnects and method for fabricating the same
#1541Semiconductor package
#1542Three dimensional integrated circuit (3DIC) with support structures
#1543Semiconductor structure and manufacturing method thereof
#1544Multiple sized bump bonds
#1545Die-on-interposer assembly with dam structure and method of manufacturing the same
#1546PACKAGED INTEGRATED CIRCUIT
#1547Multi-die fine grain integrated voltage regulation
#1548Semiconductor package
#1549Electronic Component Package
#1550Inductor structure for integrated circuit
#1551Inductor structure for integrated circuit
#1552Bonding package components through plating
#1553Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#1554Semiconductor package
#1555Substrate with embedded stacked through-silicon via die
#1556Integrated fan-out packages and methods of forming the same
#1557Semiconductor device, integrated fan-out package and method of forming the same
#1558Package with metal-insulator-metal capacitor and method of manufacturing the same
#1559Post-passivation interconnect structure and method of forming the same
#1560Semiconductor device and method
#1561Semiconductor package including heat sink
#1562Method of manufacturing 3DIC structure
#1563Semiconductor chip and semiconductor package including the same
#1564Semiconductor package
#1565Semiconductor device structure and method for forming the same
#1566Integrated fan-out packages
#1567Integrated circuit packages and methods of forming same
#1568Substrate design for semiconductor packages and method of forming same
#1569Four D device process and structure
#1570Superconducting bump bonds
#1571Superconducting bump bonds
#1572Compound semiconductor device
#1573Stress reduction apparatus and method
#1574Fan-out package with cavity substrate
#1575Photonic semiconductor device and method
#1576Semiconductor device including a circuit for transmitting a signal
#1577Semiconductor device with integrated heat distribution and manufacturing method thereof
#1578Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#1579Structure and method of forming a joint assembly
#1580Method of forming contact holes in a fan out package
#1581Method of providing partial electrical shielding
#1582Thermal interface material layer and package-on-package device including the same
#1583Multi-layer passivation structure and method
#1584Warpage control of semiconductor die
#1585Underfill control structures and method
#1586Method of manufacture of a semiconductor device
#1587Semiconductor structure and method for forming the same
#1588Capacitor bank structure and semiconductor package structure
#1589Integrated circuit packages and methods of forming same
#1590Package structure and manufacturing method thereof
#1591Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof
#1592Device and method for UBM/RDL routing
#1593Semiconductor device
#1594Semiconductor structure and method for wafer scale chip package
#1595Micro-transfer-printable flip-chip structures and methods
#1596Through-substrate conductor support
#1597Microelectronics package with vertically stacked dies
#1598Microelectronics package with vertically stacked dies
#1599Laser assisted solder bonding of direct conversion compound semiconductor detector
#1600Semiconductor package and method of manufacturing same
#1601Film scheme for bumping
#1602Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
#1603Memories and memory components with interconnected and redundant data interfaces
#1604Launch structures for radio frequency integrated device packages
#1605Through-substrate via structure and method of manufacture
#1606Method of forming vias using silicon on insulator substrate
#1607Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#1608Method of manufacturing an integrated inductor with protections caps on conductive lines
#1609Integrated Passive Device Transmission-Line Resonator
#1610Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#1611Stacked semiconductor package having mold vias and method for manufacturing the same
#1612ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS
#16133DIC structure and method of manufacturing the same
#1614Method for fabricating the electronic component, and method for transposing a micro-element
#1615Reduction of cross talk in WLCSP's through laser drilled technique
#1616Semiconductor device assembly with heat transfer structure formed from semiconductor material
#1617Monolithic decoupling capacitor between solder bumps
#1618Wiring structure, electronic device and method for manufacturing the same
#1619Fan-out semiconductor package
#1620Method of manufacturing semiconductor device
#1621Method of room temperature covalent bonding
#1622METHOD OF ROOM TEMPERATURE COVALENT BONDING
#1623Hollow metal pillar packaging scheme
#1624Integrated circuit package and methods of forming same
#1625Semiconductor device package and a method of manufacturing the same
#1626Microelectronic device with embedded die substrate on interposer
#1627Power management application of interconnect substrates
#1628Semiconductor package and manufacturing method thereof
#1629Packaging mechanisms for dies with different sizes of connectors
#1630Low cost package warpage solution
#1631Semiconductor device assembly with pillar array and test ability
#1632Stiffener package and method of fabricating stiffener package
#1633Electronic device
#1634Solution for reducing poor contact in InFO package
#1635Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package
#1636Semiconductor device
#1637Contact hole structure and fabricating method of contact hole and fuse hole
#1638Fan-out antenna packaging structure and preparation method thereof
#1639Fan-out antenna packaging structure and preparation method thereof
#1640Barrier structures between external electrical connectors
#1641Semiconductor device and method of manufacturing thereof
#1642System on package architecture including structures on die back side
#1643Wafer level molded PPGA (pad post grid array) for low cost package
#1644Flip chip integrated circuit packages with spacers
#1645Semiconductor structure and manufacturing method thereof
#1646Multilayer pillar for reduced stress interconnect and method of making same
#1647Multilayer pillar for reduced stress interconnect and method of making same
#1648Mechanisms for forming post-passivation interconnect structure
#1649Bump structure having a side recess and semiconductor structure including the same
#1650Semiconductor device and method of manufacture
#1651Interconnect crack arrestor structure and methods
#1652Through-substrate vias with improved connections
#1653WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
#1654Method for manufacturing a semiconductor device having a dummy section
#1655Stacked semiconductor packages
#1656Semiconductor device including semiconductor chip transmitting signals at high speed
#1657Memory device
#1658Reliable passivation for integrated circuits
#1659Systems and methods for improved through-silicon-vias
#1660Transistor level interconnection methodologies utilizing 3D interconnects
#1661Apparatuses comprising semiconductor dies in face-to-face arrangements
#1662Metal pillar in a film-type seconductor package
#1663Semiconductor package
#1664Vertical gallium nitride Schottky diode
#1665Proximity coupling interconnect packaging systems and methods
#1666Semiconductor device
#1667Semiconductor chip and semiconductor package including the same
#1668Flip chip package utilizing trace bump trace interconnection
#1669Metal pad modification
#1670Methods of forming semiconductor packages having a die with an encapsulant
#1671Solderless interconnection structure and method of forming same
#1672Semiconductor devices and methods of forming the same
#1673Grid array connection device and method
#16743D image sensor
#1675Multi-chip modules
#1676INTEGRATED CIRCUIT PACKAGES WITH PLATES
#1677Connector structure and method of forming same
#1678Semiconductor substrate having stress-absorbing surface layer
#1679Fan-out semiconductor package module
#1680Semiconductor package having singular wire bond on bonding pads
#1681Methods of forming microelectronic devices having a patterned surface structure
#1682Semiconductor device and method
#1683Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#1684Semiconductor packages and methods of forming same
#1685Semiconductor package with protected sidewall and method of forming the same
#1686Info structure with copper pillar having reversed profile
#1687Semiconductor package
#1688SEMICONDUCTOR PACKAGE
#1689Chip package structure
#1690Dummy flip chip bumps for reducing stress
#1691Fabrication method of semiconductor structure
#1692Micro-connection structure and manufacturing method thereof
#1693Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#1694Power distribution for active-on-active die stack with reduced resistance
#1695Illumination device
#1696Antenna with graded dielectirc and method of making the same
#1697Micro-LED module and method for fabricating the same
#1698Package structure with dummy die
#1699Methods and systems for improving power delivery and signaling in stacked semiconductor devices
#1700Semiconductor devices and semiconductor devices including a redistribution layer
#1701Semiconductor package
#1702Methods of manufacturing an integrated circuit having stress tuning layer
#1703Fan-out semiconductor package
#1704Interconnect structure for package-on-package devices
#1705Conductive line system and process
#1706Packaged semiconductor components having substantially rigid support members
#1707Semiconductor package with elastic coupler and related methods
#1708Fingerprint sensor device and method
#1709Component with geometrically adapted contact structure and method for producing the same
#1710Power device integration on a common substrate
#1711SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#1712Electronic system having increased coupling by using horizontal and vertical communication channels
#1713Semiconductor package
#1714Semiconductor packages and methods of forming the same
#1715Semiconductor packages
#1716COVER FILM AND APPLICATION THEREOF
#1717Metal pad modification
#1718Interconnect structures and methods of forming same
#1719Semiconductor Devices and Methods of Manufacture Thereof
#1720Methods of forming connector pad structures, interconnect structures, and structures thereof
#1721Semiconductor packages
#1722Packaged semiconductor devices and methods of packaging thereof
#1723Semiconductor device
#1724Method for singulating packaged integrated circuits and resulting structures
#1725Fingerprint sensor device and method
#1726Semiconductor structure and manufacturing method thereof
#1727Method of forming a dummy die of an integrated circuit having an embedded annular structure
#1728Dual sided fan-out package having low warpage across all temperatures
#1729Interconnect structures with intermetallic palladium joints and associated systems and methods
#1730Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#1731VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#1732Semiconductor package
#1733Semiconductor device assembly with heat transfer structure formed from semiconductor material
#1734Reducing loss in stacked quantum devices
#1735Device packaging facility and method, and device processing apparatus utilizing DEHT
#1736Bond pads with surrounding fill lines
#1737Semiconductor chips and semiconductor packages including the same
#1738Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#1739Package with metal-insulator-metal capacitor and method of manufacturing the same
#1740Ball grid array and land grid array assemblies fabricated using temporary resist
#1741POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
#1742Reduction of cross talk in WLCSP's through laser drilled technique
#1743Die encapsulation in oxide bonded wafer stack
#1744Semiconductor device
#1745SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS COPPER AND ASSOCIATED PRODUCTION METHODS
#1746Polymer resin and compression mold chip scale package
#1747Semiconductor package structure and method for manufacturing the same
#1748Vertical inductor for WLCSP
#1749Multi-die memory device
#1750Compound semiconductor device
#1751METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER
#1752Stacked package including exterior conductive element and a manufacturing method of the same
#1753Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package
#1754SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#1755Package with solder regions aligned to recesses
#1756Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board
#1757Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon
#1758Magnetic shielding package structure for MRAM device and method for producing the same
#1759Method of forming a semiconductor device having through silicon vias
#1760SEMICONDUCTOR PACKAGE
#1761Semiconductor package
#1762SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS
#1763Semiconductor memory chip, semiconductor memory package, and electronic system using the same
#1764Semiconductor package having a metal barrier
#1765Semiconductor package
#1766Pillar-last methods for forming semiconductor devices
#1767SEMICONDUCTOR PACKAGE
#1768Semiconductor device packages and stacked package assemblies including high density interconnections
#1769Semiconductor device packages and stacked package assemblies including high density interconnections
#1770Electronic substrates having embedded dielectric magnetic material to form inductors
#1771MULTIPLE SIZED BUMP BONDS
#1772Chip structure
#1773Designs and methods for conductive bumps
#1774Interconnect structures for preventing solder bridging, and associated systems and methods
#1775Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
#1776Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer
#1777Semiconductor package
#1778Dual solder methodologies for ultrahigh density first level interconnections
#1779Package structure with a barrier layer and method for forming the same
#1780Semiconductor devices having discretely located passivation material, and associated systems and methods
#1781Semiconductor chip and method for forming a chip pad
#1782Semiconductor chip
#1783Fan-out semiconductor package
#1784Semiconductor package
#1785Semiconductor device and method of manufacture
#1786Qubit-detector die assemblies
#1787FAN-OUT SENSOR PACKAGE
#1788Method and system for electronic devices with polycrystalline substrate structure interposer
#1789Semiconductor Package Structure and Semiconductor Package Structure Fabricating Method
#1790METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING BOTH SIDE PLATING
#1791Method of forming package structure
#1792Method of manufacturing semiconductor package using side molding
#1793Semiconductor device and a method of manufacturing the same
#1794Semiconductor element
#1795Semiconductor packages
#1796SOI wafers with buried dielectric layers to prevent CU diffusion
#1797Fan-out semiconductor package
#1798Through-hole electrode substrate
#1799Semiconductor apparatus
#1800Semiconductor device structures for burn-in testing and methods thereof