209522 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
Combing bump structure and manufacturing method thereof
#2102Semiconductor memory chip, semiconductor memory package, and electronic system using the same
#2103Composite antenna substrate and semiconductor package module
#2104Solder ball protection in packages
#2105Semiconductor chip, and fabrication and packaging methods thereof
#2106Semiconductor structure having bump on tilting upper corner surface
#2107Methods for forming through-substrate vias penetrating inter-layer dielectric
#21083D integration method using SOI substrates and structures produced thereby
#2109Post-passivation interconnect structure and method of forming the same
#2110Metal oxide layered structure and methods of forming the same
#2111Pad structure for front side illuminated image sensor
#2112Proximity coupling interconnect packaging systems and methods
#2113Stacked semiconductor package having mold vias and method for manufacturing the same
#2114Power converter monolithically integrating transistors, carrier, and components
#2115Semiconductor packages
#2116Method of fabricating a semiconductor package
#2117ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR THE PRODUCTION THEREOF
#2118Semiconductor device and manufacturing method thereof
#2119Mixed UBM and mixed pitch on a single die
#2120Semiconductor package system and method
#2121Fan-out semiconductor package
#2122Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#2123RFIC device and method of fabricating same
#2124Semiconductor die singulation and structures formed thereby
#2125Method of making fully molded peripheral package on package device
#2126Termination structure for gallium nitride Schottky diode including junction barriar diodes
#2127Semiconductor die with back-side integrated inductive component
#2128Fabrication and use of through silicon vias on double sided interconnect device
#2129Protrusion bump pads for bond-on-trace processing
#2130Fluorescence based thermometry for packaging applications
#2131Power amplifier with RF structure
#2132INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#2133Method for making an electronic component package
#2134Semiconductor device with post passivation structure and fabrication method therefor
#2135SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2136Circuitized substrate with electronic components mounted on transversal portion thereof
#2137Circuitized substrate with electronic components mounted on transversal portion thereof
#2138SACRIFICIAL TEST PADS FOR INLINE TEST ACCESS
#2139Wafer level dicing method and semiconductor device
#21403D integration method using SOI substrates and structures produced thereby
#2141Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer
#2142Semiconductor device and method of manufacturing the same
#2143Semiconductor device with discrete blocks
#2144Manufacturing method of semiconductor structure
#2145ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#2146Fan-out semiconductor package
#21473D-interconnect
#2148Semiconductor structure and manufacturing method thereof
#2149Integrated circuit packages and methods for forming the same
#2150IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
#2151Multiple bond via arrays of different wire heights on a same substrate
#2152Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof
#2153Semiconductor structure and manufacturing method thereof
#2154Semiconductor device
#2155Package structure
#2156Integrated circuit package and method of fabricating the same
#2157Substrate design for semiconductor packages and method of forming same
#2158METHOD FOR FABRICATING MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED PASSIVE ELEMENT
#2159Semiconductor device
#2160Semiconductor package structure
#2161Manufacturing method of package structure having embedded bonding film
#2162Semiconductor package including a rewiring layer with an embedded chip
#2163Semiconductor package having exposed redistribution layer features and related methods of packaging and testing
#2164System on package architecture including structures on die back side
#2165Monolithic decoupling capacitor between solder bumps
#2166Methods of interconnect for high density 2.5D and 3D integration
#2167Monolithic decoupling capacitor between solder bumps
#2168Power mesh-on-die trace bumping
#2169Leadframe package with side solder ball contact and method of manufacturing
#2170Method of forming semiconductor device having a dual material redistribution line
#2171Memory module and memory system
#2172RF resonators and filters
#2173RF resonators and filters
#2174Semiconductor device
#2175Injection molded solder bumping
#2176Method and apparatus for back-biased switch transistors
#2177Semiconductor device and method of manufacturing thereof
#2178Methods and apparatus for semiconductor device having bi-material die attach layer
#2179Methods and apparatus for a semiconductor device having bi-material die attach layer
#2180Method of forming SIP module over film layer
#2181System-in-package with double-sided molding
#2182Chip-size, double side connection package and method for manufacturing the same
#2183Semiconductor package device
#2184VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#2185Composition for removing silicone resins and method of thinning substrate by using the same
#2186Semiconductor device and method of forming a 3D interposer system-in-package module
#2187Fabrication method of semiconductor package with stacked semiconductor chips
#2188Semiconductor device and method of forming partition fence and shielding layer around semiconductor components
#2189Chip package having die structures of different heights and method of forming same
#2190Semiconductor device and method of forming WLCSP
#2191Electronic assembly using bismuth-rich solder
#2192Copper pillar bump structure and manufacturing method therefor
#2193Semiconductor substrate and semiconductor packaging device, and method for forming the same
#2194Flexible integrated heat spreader
#2195Semiconductor device and method of packaging
#2196Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#2197Semiconductor device
#2198Grid array connection device and method
#2199Methods of forming microelectronic structures having a patterned surface structure
#2200Semiconductor package
#2201Semiconductor device including first and second wirings
#2202Acoustic wave device
#2203Semiconductor package structure and semiconductor process
#2204Semiconductor package and manufacturing method thereof
#2205Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element
#2206Method of forming contact holes in a fan out package
#2207Fan-out semiconductor package
#2208Mechanisms for forming metal-insulator-metal (MIM) capacitor structure
#2209Embedded trace substrate structure and semiconductor package structure including the same
#2210Package structure
#2211HYBRID LOW METAL LOADING FLUX
#2212Micro-LED module and method for fabricating the same
#2213Semiconductor device and method of integrating power module with interposer and opposing substrates
#2214Semiconductor device
#2215Semiconductor package with rigid under bump metallurgy (UBM) stack
#2216Manufacturing method of semiconductor package
#2217Semiconductor device and method for manufacturing the same
#2218Semiconductor device with contact pad and fabrication method therefore
#2219Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods
#2220RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#2221Chip scale package
#2222Fan-out semiconductor package
#2223Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#2224Semiconductor device and method for manufacturing the same
#2225Integrated circuit structures with recessed conductive contacts for package on package
#2226Method for preparing a semiconductor apparatus
#2227Three-layer package-on-package structure and method forming same
#2228Bonded structures
#2229Interconnect structures and methods of forming same
#2230PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#2231Package with solder regions aligned to recesses
#2232Warpage control in package-on-package structures
#2233Fan-out semiconductor package and method of manufacturing the same
#2234Thin film element and method for manufacturing the same
#2235Forming bonding structures by using template layer as templates
#2236Package structure and manufacturing method thereof
#2237Protective layer for contact pads in fan-out interconnect structure and method of forming same
#2238Structures and methods for low temperature bonding using nanoparticles
#2239METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
#2240Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure
#2241Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
#2242Semiconductor structure with conductive structure
#2243Integrated DRAM with low-voltage swing I/O
#2244Surface mounting semiconductor components
#2245Methods of forming connector pad structures, interconnect structures, and structures thereof
#2246Thin 3D die with electromagnetic radiation blocking encapsulation
#2247Method and structure for wafer level packaging with large contact area
#2248Package with metal-insulator-metal capacitor and method of manufacturing the same
#2249Interconnect structure for package-on-package devices
#2250Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#2251Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer
#2252Integrated circuit sensor and sensor substrate
#2253Advanced node cost reduction by ESD interposer
#2254Chip integration module, chip package structure, and chip integration method
#2255Packaging through pre-formed metal pins
#2256Semiconductor device and semiconductor device manufacturing method
#2257Cured film formed by curing photosensitive resin composition and method for manufacturing same
#2258Integrated circuit package having wirebonded multi-die stack
#2259Packages with metal line crack prevention design
#2260Fan-out semiconductor package
#2261Three dimensional integrated circuit (3DIC) with support structures
#2262Semiconductor device and its manufacturing method
#2263Package structure and method of manufacturing the same
#2264Interconnect structures with intermetallic palladium joints and associated systems and methods
#2265Semiconductor devices having metal posts for stress relief at flatness discontinuities
#2266Sintered solder for fine pitch first-level interconnect (FLI) applications
#2267Contact hole structure and fabricating method of contact hole and fuse hole
#2268Fan-out semiconductor package
#2269Semiconductor package with embedded MIM capacitor, and method of fabricating thereof
#2270Semiconductor device having through-silicon-via and methods of forming the same
#2271Package structure and manufacturing method thereof
#2272Low cost package warpage solution
#2273Semiconductor device and manufacturing method for semiconductor device
#2274Packaging assembly and method of making the same
#2275Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
#2276Semiconductor device and a method of manufacturing the same
#2277Semiconductor package
#2278Metal cored solder decal structure and process
#2279Semiconductor memory device and a chip stack package having the same
#2280Info structure with copper pillar having reversed profile
#2281Semiconductor light-emitting device
#2282Package structure with dummy die
#2283Package on-package structure with epoxy flux residue
#2284SEMICONDUCTOR PACKAGE
#2285Conductive external connector structure and method of forming
#2286Package structures and method of forming the same
#2287Scanning methods for focus control for lithographic processing of reconstituted wafers
#2288Semiconductor with through-substrate interconnect
#2289Method for manufacturing bump structure
#2290Multi-die memory device
#2291Display device
#2292Semiconductor memory device including stacked chips and memory module having the same
#2293Structures and methods to enable a full intermetallic interconnect
#2294Fan-out semiconductor package module
#2295Semiconductor device and method
#2296Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
#2297Semiconductor device
#2298Semiconductor device and method of forming a 3D interposer system-in-package module
#2299Chip package and a wafer level package
#2300Chip package
#2301Package-on-package with cavity in interposer
#2302Package structure and method of forming thereof
#2303Method for forming package structure including intermetallic compound
#2304Film scheme for bumping
#2305Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#2306Method for manufacturing interconnect structure
#2307Semiconductor device structure and method for forming the same
#2308Method of fabricating redistribution circuit structure
#2309Post passivation interconnect and fabrication method therefor
#2310Alignment pattern for package singulation
#2311Semiconductor package with dummy bumps connected to non-solder mask defined pads
#2312Semiconductor device and method of forming the same
#2313Semiconductor device package thermal conduit
#2314METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION
#2315Fingerprint sensor device and method
#2316Interconnect structure and method of forming same
#2317Multi-chip package and method of providing die-to-die interconnects in same
#2318Through via structure and method
#2319Front-to-back bonding with through-substrate via (TSV)
#2320Thermal interface material layer and package-on-package device including the same
#2321Manufacturing method of semiconductor device
#2322Semiconductor device packages including an inductor and a capacitor
#2323Package structures and methods of forming the same
#2324Packaged semiconductor devices and methods of packaging semiconductor devices
#2325Semiconductor packages with leadframes and related methods
#2326Semiconductor chip
#2327Package structure with inductor and method of forming thereof
#2328Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#2329Semiconductor device and method
#2330Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#2331Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#2332Thermocompression Bonding with Passivated Gold Contacting Metal
#2333Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#2334Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#2335Thermocompression Bonding Using Metastable Gas Atoms
#2336System for Low-Force Thermocompression Bonding
#2337Electrostatic discharge device and split multi rail network with symmetrical layout design technique
#2338Electronic system having increased coupling by using horizontal and vertical communication channels
#2339Semiconductor structure and manufacturing method thereof
#23403D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#2341Active chip on carrier or laminated chip having microelectronic element embedded therein
#2342Separation of integrated circuit structure from adjacent chip
#2343Semiconductor device
#2344Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#2345Semiconductor packages
#2346Semiconductor device package and method for forming the same
#2347Semiconductor device and method for manufacturing the same
#2348SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#2349Electronic structure
#2350Chip package structure and manufacturing method thereof
#2351Semiconductor package
#2352Semiconductor package and method of fabricating semiconductor package
#2353Substrateless integrated circuit packages and methods of forming same
#2354Method for manufacturing a semiconductor structure
#2355Method for manufacturing a semiconductor structure
#2356Substrate interconnections for packaged semiconductor device
#2357Staged via formation from both sides of chip
#2358Manufacturing method of package-on-package structure
#2359Integrated circuit package and method of forming same
#2360Transient voltage suppressor apparatus
#2361Semiconductor device
#2362Circuit device, oscillator, electronic apparatus, and moving object
#2363Final passivation for wafer level warpage and ULK stress reduction
#2364Fully molded miniaturized semiconductor module
#2365Conductive line system and process
#2366Semiconductor device and method of forming interposer with opening to contain semiconductor die
#2367Electronic system having increased coupling by using horizontal and vertical communication channels
#2368Semiconductor device
#2369Conductive pillar shaped for solder confinement
#2370Mixed UBM and mixed pitch on a single die
#2371Mixed UBM and mixed pitch on a single die
#2372Underfill control structures and method
#2373Solution for reducing poor contact in InFO package
#2374Method of producing an interposer-chip-arrangement for dense packaging of chips
#2375Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#2376Tall and fine pitch interconnects
#2377Fan-out semiconductor package
#2378Fan-out semiconductor package
#2379Package structure with bump
#2380Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
#23813D IC bump height metrology APC
#2382Integrated III-V device and driver device units and methods for fabricating the same
#2383Wafer level package and method
#2384Metal pillar in a film-type semiconductor package
#2385Fan-out semiconductor package
#2386Semiconductor device and method of manufacture
#2387Electrical overstress detection device
#2388Semiconductor package including antenna substrate and manufacturing method thereof
#2389Package structure with dummy die
#2390Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#2391Semiconductor device
#2392Chip alignment utilizing superomniphobic surface treatment of silicon die
#2393Conductive pillar shaped for solder confinement
#2394Semiconductor structure and manufacturing method thereof
#2395Microchip with cap layer for redistribution circuitry and method of manufacturing the same
#2396Fan-out semiconductor package
#2397Info structure with copper pillar having reversed profile
#2398Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
#2399CARRIER ULTRA THIN SUBSTRATE
#2400Electrical interconnect structure for an embedded electronics package