209526 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for tape automated bonding [TAB] connectors
High density interconnection of microelectronic devices
#2High density interconnection of microelectronic devices
#3Semiconductor chip and film and tab package comprising the chip and film
#4Semiconductor chip and film and TAB package comprising the chip and film
#5Semiconductor device with surface electrodes
#6Method for producing an electrical and mechanical connection and an assembly comprising such a connection
#7Through wafer via and method of making same