Semiconductor device and method of manufacturing the same

Semiconductor device, method of manufacturing the same

Ultra-thin oxide bonding for S1 to S1 dual orientation bonding

LED package structure for increasing light-emitting efficiency and method of packaging the same

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Stacked die with a recess in a die BGA package

Stacked chip package and method for forming the same

Embedded capacitors for reducing package cracking

Capacitive semiconductor sensor

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

Chip package for image sensor and method of manufacturing the same

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip-chip assembly of protected micromechanical devices

Semiconductor Device and Method of Fabricating the Same

Interposer, electrical package, and contact structure and fabricating method thereof

Method for fabricating heat dissipating package structure

Microelectronic packages fabricated at the wafer level and methods therefor

Substrate with built-in electronic component and method for manufacturing the same

Heat sink assembly

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Semiconductor package and method for manufacturing the same

Method of fabricating semiconductor package structure

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Stacked semiconductor package having fan-out structure through wire bonding

Semiconductor device and wire bonding method therefor

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

CHIP PACKAGE STRUCTURE

FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor apparatus

Semiconductor device package of stacked semiconductor chips with spacers provided therein

Semiconductor package preventing generation of static electricity therein

Semiconductor device and an information management system therefor

Method for producing a semiconductor component and substrate for carrying out the method

Gold-Tin Solder Joints Having Reduced Embrittlement

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Microelectronic component assemblies and microelectronic component lead frame structures

Wafer level chip scale package of image sensor and manufacturing method thereof

Light emitting device

Moveable arm assembly for a wire bonder

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUFACTURING METHOD THEREOF

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Wafer level package structure of optical-electronic device and method for making the same

Wiring board and semiconductor device

Electronic device and method of manufacturing the same

Substrate slot design for die stack packaging

Integrated circuit package system with pad to pad bonding

Semiconductor element comprising a supporting structure and production method

Managing forces of semiconductor device layers

Electronic device and method of manufacturing the same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Electronic device and method of manufacturing the same

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Power semiconductor arrangement

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Process of forming an electronic device including an inductor

Method of assembling carbon nanotube reinforced solder caps

Manufacturing method and manufacturing apparatus of printed wiring board

Elimination of RDL using tape base flip chip on flex for die stacking

Electronic controller

Semiconductor device and manufacturing method thereof

Circuit substrate for preventing warpage and package using the same

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND CHIP PACKAGE ARRAY

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same

Semiconductor package and stacked semiconductor package

Semiconductor package with inner leads exposed from an encapsulant

Methods and materials useful for chip stacking, chip and wafer bonding

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

Interposer and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Optical device and method for making the same

Semiconductor apparatus and method of producing the same

Semiconductor assembly with component attached on die back side

Electrical interconnection structure formation

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Modularized Die Stacking System and Method

Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same

Semiconductor device package with groove

Reduction in thickness of semiconductor component on substrate

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

Microelectronic component assemblies and microelectronic component lead frame structures

Packaged microelectronic components with terminals exposed through encapsulant

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Semiconductor device having curved leads offset from the center of bonding pads

Perimeter matrix ball grid array circuit package with a populated center

Semiconductor package and fabrication method thereof

Bonding wire and bond using a bonding wire

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor apparatus

Mounting structure for IC tag and IC chip for mounting

Electronic device having wiring substrate and lead frame

Packaged stacked semiconductor device and method for manufacturing the same

Semiconductor device having circuit blocks in a single crystal layer, and bumps on certain blocks

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

Circuit-connecting material and circuit terminal connected structure and connecting method

CHIP LOCATION IDENTIFICATION

Method for manufacturing SIP semiconductor device

Lead pin for mounting semiconductor and printed wiring board

Compact impedance transformation circuit

Semiconductor memory device and semiconductor device

Stacking integrated circuit dies

Semiconductor device and method of producing the same

Semiconductor device and fabricating method thereof

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Electronic device and method of manufacturing the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Wire bonding method, wire bonding apparatus and semiconductor device

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

Light emitting device and the manufacture method thereof

Circuit-connecting material and circuit terminal connected structure and connecting method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Microball placement solutions

Wire bonders and methods of wire-bonding

Camera module and assembling process thereof

Methods for attaching microfeature dies to external devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Electric power converter

Semiconductor device

HIGH PERFORMANCE IC PACKAGE AND METHOD

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Semiconductor device and fabricating method thereof

Electric component with a flip-chip construction

Packaged microdevices and methods for manufacturing packaged microdevices

Systems and methods for low profile die package

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Image sensor

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

Semiconductor package and method of manufacturing the same

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Chip carrier and fabrication method

Semiconductor package having laser-embedded terminals

Monolithic capacitor, circuit board, and circuit module

High frequency line-to-waveguide converter and high frequency package

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Components, methods and assemblies for stacked packages

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Stackable ceramic FBGA for high thermal applications

Power semiconductor component

SURFACE MOUNT LIGHT EMITTING DIODE PACKAGE

Semiconductor light-emitting device and light-emitting display therewith

Physical quantity detection device with pixel array column-aligned terminals and method of driving same

Apparatus, system and method for use in mounting electronic elements

Semiconductor element and manufacturing method thereof

Physical quantity sensor, lead frame, and manufacturing method therefor

Method of manufacturing semiconductor device

Light emitting device

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Semiconductor device and method for manufacturing the same

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

CHIP PACKAGE

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Multi-chip structure

Method for producing a module with components stacked one above another

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing a passive integrated matching network for power amplifiers

Surface mountable chip

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Acceleration sensor

Semiconductor device contact resistant to deterioration due to heat and method for manufacturing contact

Chip scale package and method for manufacturing the same

Method of fabricating a stacked die having a recess in a die BGA package

Light emitting device, method of making the same, and light source device comprising the same

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Light-emitting device

Integrated circuit package-in-package system

Chip-stacked package structure

Bump pattern design for flip chip semiconductor package

Integrated circuit package system with molding vents

Interposer and semiconductor package with reduced contact area

Integrated circuit package-on-package stacking system

Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

Method for placing material onto a target board by means of a transfer board

On-chip magnetic components

Solid state device

Wiring substrate and manufacturing method thereof, and semiconductor device

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Electronic system modules and method of fabrication

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Substrate structure integrated with passive components

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Semiconductor device

Contact structure having a compliant bump and a test pad

Double-sided die

Substrate structure integrated with passive components

Package structure having semiconductor chip embedded therein and method for fabricating the same

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

Semiconductor package having passive component and semiconductor memory module including the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Array-Processed Stacked Semiconductor Packages

Integrated circuit module and method of forming the same

Nonvolatile memory apparatus

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Method for self-assembling microstructures

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Luminescent material

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip chip mounting process and flip chip assembly

SEMICONDUCTOR CHIP

BLM structure for application to copper pad

Chip having two groups of chip contacts

Chip package structure

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Semiconductor device and an information management system therefor

Interposer and electronic device using the same

Integrated circuit mount system with solder mask pad

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

Packaging structure with protective layers and packaging method thereof

System and method of attenuating electromagnetic interference with a grounded top film

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

Transformer coils for providing voltage isolation

Integrated circuit module

Radio frequency identification tag

Chip structure

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor Package Having Improved Adhesion and Solderability

Electronic assembly and manufacturing method having a reduced need for wire bonds

SEMICONDUCTOR DEVICE AND WIRELESS DEVICE USING THE SEMICONDUCTOR DEVICE

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Advanced Thin Flexible Microelectronic Assemblies and Methods for Making Same

Miniature optical element for wireless bonding in an electronic instrument

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Electronic module with switching functions and method for producing the same

Integrated circuit packaging system with ultra-thin die

Multi-chip semiconductor connector assemblies

Chip package structure and fabricating method thereof

Semiconductor package and method for producing the same

Bond and method for bonding two contact surfaces

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Method for fabricating a wafer level package with device wafer and passive component integration

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Semiconductor device and method of manufacturing the semiconductor device

Fine pitch microcontacts and method for forming thereof

Semiconductor device

Semiconductor device, wiring board, and manufacturing method thereof

Stack package having pattern die redistribution

Semiconductor device having an inductor

Semiconductor package having embedded passive elements and method for manufacturing the same

Stack package with vertically formed heat sink

Microelectronic assembly having a periphery seal around a thermal interface material

Chip module for complete power train

Semiconductor package having optimal interval between bond fingers for reduced substrate size

Flipped, stacked-chip IC packaging for high bandwidth data transfer buses

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Low inductance capacitors, methods of assembling same, and systems containing same

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods of operating electronic devices, and methods of providing electronic devices

Manufacturing method package substrate

Method of manufacturing a semiconductor device

Manufacturing method for a leadless multi-chip electronic module

Optical path converting member, multilayer print circuit board, and device for optical communication

Semiconductor device having conductive adhesive layer and method of fabricating the same

Semiconductor device having heat spreader with center opening

Semiconductor apparatus with decoupling capacitor

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Microelectronic assembly with back side metallization and method for forming the same

Manufacturing method of semiconductor device

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold

CHIP STRUCTURE

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same

Printed circuit board and circuit structure for power supply

Thermal improvement for hotspots on dies in integrated circuit packages

DIE STACK CAPACITORS, ASSEMBLIES AND METHODS

IC chip package, and image display apparatus using same

Multi-chip stacked package with reduced thickness

Methods of forming solder connections and structure thereof

Substrate treating method and method of manufacturing semiconductor apparatus