Semiconductor chip and semiconductor device

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Semiconductor assembly with component pads attached on die back side

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Stacked Memory Module

Lead frame package

Assembling of Electronic Members on IC Chip

Light emitting device with an insulating layer

Mounting structure and electronic equipment

NONVOLATILE MEMORY SYSTEM

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method and apparatus for forming planar alloy deposits on a substrate

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Microelectronic packages with small footprints and associated methods of manufacturing

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING HEAT RELEASE PATTERN

SHIELDED WIREBOND

Semiconductor device mounted structure and semiconductor device mounted method

Leadframe, semiconductor device, and method of manufacturing the same

Electronic device protected against electro static discharge

Fan-in interposer on lead frame for an integrated circuit package on package system

Solid-state imaging device and method for manufacturing same

Semiconductor device and fabrication method thereof

IC chip package and image display device incorporating same

Flex-rigid wiring board and method for manufacturing the same

PRESSURE-HEATING APPARATUS AND METHOD

Method of forming support structures for semiconductor devices

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Method for manufacturing package on package with cavity

Method of manufacturing a stacked semiconductor apparatus

Stacked memory module and system

Monolithic ceramic electronic component and method for manufacturing the same

Light emitting device assembly, surface light source device, liquid crystal display device assembly, and light output member

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

IC chip package employing substrate with a device hole

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

Semiconductor device and method for manufacturing the same

EXTERNAL HEAT SINK FOR BARE-DIE FLIP CHIP PACKAGES

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIPS AND FABRICATION METHOD THEREOF

Conductive nanowires for electrical interconnect

Holding jig for electronic parts

Manufacturing method of semiconductor device

Printed circuit board

Semiconductor device, production method for the same, and substrate

SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING

Stacked package and method for forming stacked package

POWER MODULE PACKAGE HAVING EXCELLENT HEAT SINK EMISSION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, lead frame and method of manufacturing semiconductor device

Semiconductor package

Light emitting diode and method of the same

SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP STACKED PACKAGE

Electronic component assembly

Radio frequency unit analog level detector and feedback control system

Method for manufacturing semiconductor device including testing dedicated pad and probe card testing

Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device

Semiconductor device

Lens support and wirebond protector

Semiconductor device and a method of manufacturing the same

PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER

Electrical device with protruding contact elements and overhang regions over a cavity

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well

Semiconductor device

Resin-encapsulated semiconductor device and its manufacturing method

Integrated circuit package system with chip on lead

Electronic device package with electromagnetic compatibility (EMC) coating thereon

System comprised of a chip and a substrate and method of assembling such a system

Wiring substrate and method of manufacturing the same

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

Stacked integrated circuit assembly

Production method of semiconductor device and bonding film

System-in-package module and mobile terminal having the same

Systems and methods for lowering interconnect capacitance through adjustment of relative signal levels

Semiconductor device

Semiconductor device with fuse portion

Semiconductor device

Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor

Integrated circuit package system with bumped lead and nonbumped lead

Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

Substrate holder and plating apparatus

Apparatuses and methods to enhance passivation and ILD reliability

Method of manufacturing layered chip package

Photoelectric conversion device, photoelectric conversion module and method of manufacturing photoelectric conversion device

Semiconductor package with reduced inductive coupling between adjacent bondwire arrays

Semiconductor memory device

Layered chip package and method of manufacturing same

Surface depressions for die-to-die interconnects and associated systems and methods

Semiconductor device and method of manufacturing the same

Active thermal control for stacked IC devices

Semiconductor device and semiconductor integrated circuit

Multi-die integrated circuit device and method

Optical semiconductor device and method for manufacturing the same

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

Methods and apparatuses for transferring heat from stacked microfeature devices

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field

Inlays for security documents

Semiconductor device including semiconductor chip and sealing material

Wiring board, semiconductor device using wiring board and their manufacturing methods

Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

THIN GALLIUM NITRIDE LIGHT EMITTING DIODE DEVICE

Method of controlling the trajectory of a bonding tool during the formation of a wire loop

Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof

Processes of making pad-less interconnect for electrical coreless substrate

Sensor module

Manufacturing method of semiconductor device

Semiconductor package and manufacturing method thereof

INSULATING PASTE FOR LOW TEMPERATURE CURING APPLICATION

Semiconductor Package

Low profile solder grid array technology for printed circuit board surface mount components

Circuit apparatus and method of manufacturing the same

Systems and methods for power amplifier with integrated passive device

Return loss techniques in wirebond packages for high-speed data communications

Package on Package Structure with thin film Interposing Layer

Semiconductor device and method of manufacturing the same

Circuitry component and method for forming the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Semiconductor device mounted on heat sink having protruded periphery

Inductor module, silicon tuner module and semiconductor device

Wire bonding method

Array-processed stacked semiconductor packages

Manufacturing method of wafer level chip scale package of image-sensing module

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Integrated circuit package system for stackable devices

Semiconductor device having substrate with differentially plated copper and selective solder

Mountable integrated circuit package-in-package system

Semiconductor arrangement having specially fashioned bond wires

Semiconductor package fabricated by cutting and molding in small windows

COL (Chip-On-Lead) multi-chip package

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

IC having voltage regulated integrated Faraday shield

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Low resistance integrated MOS structure

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Light emitting device

Light-emitting device

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

Method of forming a leaded molded array package

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Ribbon bonding tool and process

Embedding device in substrate cavity

Semiconductor memory device and manufacturing method thereof

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

Semiconductor device, and manufacturing method therefor

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Packaging substrate and method for fabricating the same

SEMICONDUCTOR DEVICE

3-D ICs with microfluidic interconnects and methods of constructing same

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

Semiconductor device assembly and method thereof

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

Conductive clip for semiconductor device package

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Structure including an electronic device for making a security document

Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board

Method of manufacturing a printed wiring board with built-in electronic component

Method of manufacturing semiconductor element

Electronic components mounting adhesive and electronic components mounting structure

Method and apparatus providing fine alignment of a structure relative to a support

Printed circuit board, method of fabricating printed circuit board, and semiconductor device

Semiconductor package and methods of manufacturing the semiconductor package

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Circuit board, lead frame, semiconductor device, and method for fabricating the same

Structure and manufacturing method of chip scale package

Integrated circuit package system with shield and tie bar

Power semiconductor device

Electronic device and method of manufacturing the same

Semiconductor package with a chip on a support plate

ELECTRONIC DEVICE HAVING ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS OF FABRICATING THE SAME

Image sensor package and camera module utilizing the same

Ball-bump bonded ribbon-wire interconnect

Semiconductor chip package structure

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

Semiconductor device

Package structure and method

Package system incorporating a flip-chip assembly

IC card

Semiconductor Device and a Method of Manufacturing the Same

Semiconductor chip package assembly with deflection- resistant leadfingers

Image sensor structure and integrated lens module thereof

Apparatus and system for miniature surface mount devices

Techniques for arranging solder balls and forming bumps

SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD

Wiring board

Method of fabricating chip package

Adhesive composition

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE

Resin sealing structure for electronic component and resin sealing method for electronic component

Semiconductor device

Semiconductor device and method of fabrication

SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE

Semiconductor light-emitting device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Semiconductor storage device, semiconductor storage device manufacturing method and package resin forming method

Apparatus and methods of forming an interconnect between a workpiece and substrate

Image-sensing chip package module for reducing its whole thickness

Semiconductor integrated circuit

Semiconductor component with improved contact pad and method for forming the same

High density memory device manufacturing using isolated step pads

Integrated circuit package on package system

Planar packageless semiconductor structure with via and coplanar contacts

SEMICONDUCTOR MODULE HAVING AN INTERCONNECTION STRUCTURE

Bond wire loop for high speed noise isolation

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Wire bonding to connect electrodes

Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging

Microwave Chip Supporting Structure

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Conductive paste and mounting structure using the same

Through-hole via on saw streets

CHIP PACKAGE STRUCTURE

Intermetallic diffusion block device and method of manufacture

Circuit device including rotated stacked die

Low voltage drop and high thermal performance ball grid array package

ULTRA-THIN CHIP PACKAGING

Semiconductor device

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and manufacturing method thereof

Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips

Through-substrate power-conducting via with embedded capacitance

Integrated circuit with wireless connection

Semiconductor device with a peripheral circuit formed therein

Externally configurable integrated circuits

Wiring board having efficiently arranged pads

Multilayer printed wiring board

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Wafer level package and method of fabricating the same

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Chip package

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

Wafer level integration package

Heat resistant substrate incorporated circuit wiring board

Semiconductor device and method for manufacturing the same

Power converter apparatus

Partially underfilled solder grid arrays

Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same

Semiconductor device and programming method

Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same

Semiconductor light-emitting device

Power conversion apparatus

Wiring board and ceramic chip to be embedded

Heat resistant substrate incorporated circuit wiring board

Method of fabricating bonding structure

Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate

Method and system for collecting alignment data from coated chips or wafers

Three chip package

Multi-chip stack package

Integrated circuit system having different-size solder bumps and different-size bonding pads

Electronic component and method for its production

LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

Semiconductor device

Contact structure and forming method thereof and connecting structure thereof

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Window type BGA semiconductor package and its substrate

Semiconductor device and fabrication method thereof

Wafer integrated with permanent carrier and method therefor

Flip chip interconnection structure with bump on partial pad and method thereof

Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Integrated circuit package system with stacking module

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

Mountable integrated circuit package system with substrate

Complex semiconductor packages and methods of fabricating the same

Semiconductor package structure

Semiconductor chip package assembly method and apparatus for countering leadfinger deformation

Leadframe, semiconductor packaging structure and manufacturing method thereof

Structure for reduction of soft error rates in integrated circuits

Method of manufacturing semiconductor device and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

Light emitting diodes with smooth surface for reflective electrode

Semiconductor device capable of switching operation modes

Multi-layer wiring board and method of manufacturing the same

Multi-layer wiring board and method of manufacturing the same

Bump bonding method

Method for manufacturing microelectronic devices

High frequency power amplifier

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor memory card and semiconductor memory device

IC PACKAGE HAVING REDUCED THICKNESS

COL SEMICONDUCTOR PACKAGE

Semiconductor chip package

Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement

Dual flat non-leaded semiconductor package

Substrate having a functionally gradient coefficient of thermal expansion

Broadband Power Amplifier with A High Power Feedback Structure

Semiconductor device

Integrated circuit package system with integration port